发明授权
- 专利标题： Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same
- 专利标题（中）： 薄膜配线基板及其制造方法，基板及其制造方法
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申请号： US09699569申请日： 2000-10-31
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公开(公告)号： US06465085B1公开(公告)日： 2002-10-15
- 发明人: Zhiyi Song , Kiyokazu Moriizumi , Takami Sasahara , Norikazu Ozaki , Manabu Watanabe , Misao Umematsu , Shunichi Kikuchi
- 申请人： Zhiyi Song , Kiyokazu Moriizumi , Takami Sasahara , Norikazu Ozaki , Manabu Watanabe , Misao Umematsu , Shunichi Kikuchi
- 优先权： JP2000-102589 20000404; JP2000-116988 20000418
- 主分类号： B32B300
- IPC分类号： B32B300
摘要：
A dummy pad is formed through a polyimide insulating layer so as to be provided opposite to a via connecting pad formed on the surface of a ceramic substrate. A defect occurring in the via connecting pad is filled with a protrusion when the dummy pad is formed. Accordingly, the influence of the defect upon a layer above the dummy pad is prevented. Further, in a method for manufacturing a thin film wiring board obtained by forming a thin film layer on a base substrate having a via that allows interlayer electric conduction, a void defect existing in the via is filled with a conductive material having corrosion resistance against an etchant, and then the thin film layer is formed on the base substrate.
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