公开(公告)号：US20240357734A1

公开(公告)日：2024-10-24

申请号：US18474880

申请日：2023-09-26

申请人： Apple Inc.

发明人： Behzad Biglarbegian ,  Hongrui Wang ,  Abbas Komijani ,  Reetika K Agarwal

IPC分类号： H05K1/02 ,  H01P3/08

CPC分类号： H05K1/0243 ,  H01P3/08 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10075

摘要： An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

公开(公告)号：US20190222214A1

公开(公告)日：2019-07-18

申请号：US16363055

申请日：2019-03-25

申请人： TXC CORPORATION

发明人： CHIEN-WEI CHIANG ,  WAN-LIN HSIEH ,  CHIA-WEI CHEN ,  CHE-LUNG HSU ,  SHENG-HSIANG KAO ,  CHEN-YA WENG ,  CHIA-CHEN CHEN

IPC分类号： H03L1/02 ,  H05K1/18 ,  H03L1/04 ,  G01K13/00 ,  H05K1/02 ,  H01L23/34

CPC分类号： H03L1/028 ,  G01K13/00 ,  H01L23/345 ,  H03L1/02 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/10075 ,  H05K2201/10151

摘要： An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

公开(公告)号：US09883589B2

公开(公告)日：2018-01-30

申请号：US14764795

申请日：2014-07-30

申请人： KYOCERA Corporation

发明人： Kouichi Kawasaki

IPC分类号： H05K7/10 ,  H05K1/11 ,  H01L23/13 ,  H01L23/498 ,  H01L23/24 ,  H01L23/00 ,  H05K3/34 ,  H05K1/18 ,  H05K1/02 ,  H01R9/00 ,  H01L23/48 ,  H05K3/24 ,  H05K3/46

CPC分类号： H05K1/111 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49838 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/4629 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09663 ,  H05K2201/097 ,  H05K2201/098 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/2054 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.

公开(公告)号：US20150373846A1

公开(公告)日：2015-12-24

申请号：US14764795

申请日：2014-07-30

申请人： KYOCERA CORPORATION

发明人： Kouichi KAWASAKI

IPC分类号： H05K1/11 ,  H05K1/18

CPC分类号： H05K1/111 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49838 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/4629 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09663 ,  H05K2201/097 ,  H05K2201/098 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/2054 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.

摘要翻译： 布线板具有绝缘基板和在绝缘基板上的平面图中彼此相邻设置的多个电极，电极在外周具有开口，并且具有从外周到内部的狭缝，以及 在彼此相邻的两个电极中，一个电极中的狭缝具有与另一个电极的外周相交的中心线。

公开(公告)号：US20140232476A1

公开(公告)日：2014-08-21

申请号：US14263030

申请日：2014-04-28

申请人： Renesas Electronics Corporation

发明人： Osamu Ozawa ,  Masashi Horiguchi ,  Yuichi Okuda ,  Akihito Anzai

IPC分类号： H03B5/36 ,  H02H7/20

CPC分类号： H03B5/32 ,  H02H7/20 ,  H03B5/364 ,  H03B2200/0088 ,  H03B2202/03 ,  H03B2202/082 ,  H03B2202/084 ,  H05K1/181 ,  H05K2201/10075

摘要： A wiring pattern for oscillation input signal and a wiring pattern for oscillation output signal are provided on a printed circuit board, and a wiring pattern for ground power source voltage is arranged in a region therebetween. A quartz crystal unit is connected between the wiring pattern for oscillation input signal and the wiring pattern for oscillation output signal and one ends of capacitors serving as load capacitors thereof are connected to the wiring pattern for ground power source voltage. Further, a wiring pattern for VSS is arranged so as to enclose these wiring patterns, and a wiring pattern for VSS is arranged also in a lower layer in addition thereto. By this means, reduction of a parasitic capacitance between an XIN node and an XOUT node, improvement in noise tolerance of these nodes and others can be achieved.

摘要翻译： 用于振荡输入信号的布线图案和用于振荡输出信号的布线图案设置在印刷电路板上，并且用于接地电源电压的布线图案布置在它们之间的区域中。 在用于振荡输入信号的布线图案和振荡输出信号的布线图案之间连接石英晶体单元，并且其作为负载电容器的电容器的一端连接到地电源电压的布线图案。 此外，为了包围这些布线图案，布置有用于VSS的布线图案，并且除此之外，还布置有用于VSS的布线图案。 通过这种方式，可以实现XIN节点和XOUT节点之间的寄生电容的减小，这些节点等的噪声容限的改善。

公开(公告)号：US08736390B2

公开(公告)日：2014-05-27

申请号：US13316473

申请日：2011-12-10

申请人： Osamu Ozawa ,  Masashi Horiguchi ,  Yuichi Okuda ,  Akihito Anzai

发明人： Osamu Ozawa ,  Masashi Horiguchi ,  Yuichi Okuda ,  Akihito Anzai

IPC分类号： H03B5/32

CPC分类号： H03B5/32 ,  H02H7/20 ,  H03B5/364 ,  H03B2200/0088 ,  H03B2202/03 ,  H03B2202/082 ,  H03B2202/084 ,  H05K1/181 ,  H05K2201/10075

摘要： A wiring pattern for oscillation input signal and a wiring pattern for oscillation output signal are provided on a printed circuit board, and a wiring pattern for ground power source voltage is arranged in a region therebetween. A quartz crystal unit is connected between the wiring pattern for oscillation input signal and the wiring pattern for oscillation output signal and one ends of capacitors serving as load capacitors thereof are connected to the wiring pattern for ground power source voltage. Further, a wiring pattern for VSS is arranged so as to enclose these wiring patterns, and a wiring pattern for VSS is arranged also in a lower layer in addition thereto. By this means, reduction of a parasitic capacitance between an XIN node and an XOUT node, improvement in noise tolerance of these nodes and others can be achieved.

摘要翻译： 用于振荡输入信号的布线图案和用于振荡输出信号的布线图案设置在印刷电路板上，并且用于接地电源电压的布线图案布置在它们之间的区域中。 在用于振荡输入信号的布线图案和振荡输出信号的布线图案之间连接石英晶体单元，并且将其作为负载电容器的电容器的一端连接到地电源电压的布线图案。 此外，为了包围这些布线图案，布置有用于VSS的布线图案，并且除此之外，还布置有用于VSS的布线图案。 通过这种方式，可以实现XIN节点和XOUT节点之间的寄生电容的减小，这些节点等的噪声容限的改善。

公开(公告)号：US20130329378A1

公开(公告)日：2013-12-12

申请号：US13869010

申请日：2013-04-23

申请人： GERARD TECHNOLOGIES (SUZHOU) CO., LTD.

发明人： Jian-Fei Hou ,  Jian Xu

IPC分类号： H05K7/00 ,  H05K3/36 ,  H05K3/34

CPC分类号： H05K7/00 ,  H05K1/117 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K3/34 ,  H05K3/36 ,  H05K2201/0338 ,  H05K2201/041 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10159 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/49144

摘要： A Universal Serial Bus device includes a PCB module, a plastic package shell and a power module. The PCB module includes a PCB, and a storage chip and a control chip both arranged on the PCB module. The PCB includes opposite front end and rear end, and opposite upper surface and lower surface. The upper surface has a number of contacting portions, and the storage chip and the control chip being arranged on the lower surface. The plastic package shell at least encapsulates the lower surface of the PCB to encapsulate the storage chip and the control chip. The power module is electrically connected to the part of the PCB module where is not encapsulated by the plastic package shell.

摘要翻译： 通用串行总线设备包括PCB模块，塑料封装外壳和电源模块。 PCB模块包括PCB，以及布置在PCB模块上的存储芯片和控制芯片。 PCB包括相对的前端和后端，以及相对的上表面和下表面。 上表面具有多个接触部分，并且存储芯片和控制芯片布置在下表面上。 塑料封装外壳至少封装PCB的下表面以封装存储芯片和控制芯片。 电源模块电连接到PCB模块的未被塑料封装外壳封装的部分。

公开(公告)号：US20120161889A1

公开(公告)日：2012-06-28

申请号：US13316473

申请日：2011-12-10

申请人： Osamu OZAWA ,  Masashi Horiguchi ,  Yuichi Okuda ,  Akihito Anzai

发明人： Osamu OZAWA ,  Masashi Horiguchi ,  Yuichi Okuda ,  Akihito Anzai

IPC分类号： H03K3/354

CPC分类号： H03B5/32 ,  H02H7/20 ,  H03B5/364 ,  H03B2200/0088 ,  H03B2202/03 ,  H03B2202/082 ,  H03B2202/084 ,  H05K1/181 ,  H05K2201/10075

摘要： A wiring pattern for oscillation input signal and a wiring pattern for oscillation output signal are provided on a printed circuit board, and a wiring pattern for ground power source voltage is arranged in a region therebetween. A quartz crystal unit is connected between the wiring pattern for oscillation input signal and the wiring pattern for oscillation output signal and one ends of capacitors serving as load capacitors thereof are connected to the wiring pattern for ground power source voltage. Further, a wiring pattern for VSS is arranged so as to enclose these wiring patterns, and a wiring pattern for VSS is arranged also in a lower layer in addition thereto. By this means, reduction of a parasitic capacitance between an XIN node and an XOUT node, improvement in noise tolerance of these nodes and others can be achieved.

摘要翻译： 用于振荡输入信号的布线图案和用于振荡输出信号的布线图案设置在印刷电路板上，并且用于接地电源电压的布线图案布置在它们之间的区域中。 在用于振荡输入信号的布线图案和振荡输出信号的布线图案之间连接石英晶体单元，并且其作为负载电容器的电容器的一端连接到地电源电压的布线图案。 此外，为了包围这些布线图案，布置有用于VSS的布线图案，并且除此之外，还布置有用于VSS的布线图案。 通过这种方式，可以实现XIN节点和XOUT节点之间的寄生电容的减小，这些节点等的噪声容限的改善。

公开(公告)号：US08022777B2

公开(公告)日：2011-09-20

申请号：US12380313

申请日：2009-02-26

申请人： James L. Stolpman ,  Jeffrey A. McCracken

发明人： James L. Stolpman ,  Jeffrey A. McCracken

IPC分类号： H03L1/04

CPC分类号： H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K1/181 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2203/165

摘要： An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket.

摘要翻译： 一种振荡器组件，包括位于印刷电路板的表面上形成并由限定用于振荡器的烘箱的盖子覆盖的导热材料垫上的振荡器。 在一个实施例中，多个加热器位于振荡器的不同侧，并且至少部分地位于该垫上，以将热量均匀地传递到该垫和该振荡器。 在一个实施例中，振荡器是温度补偿晶体振荡器，并且印刷电路板上的集成放大器控制器电路集成了至少一个用于控制加热器的运算放大器和用于向烘箱提供热量的一个或多个晶体管。 位于垫上并覆盖振荡器的顶盖可用于将热量更均匀地传递到振荡器。 印刷电路板底部的空腔限定了绝缘气囊。

公开(公告)号：US20110108312A1

公开(公告)日：2011-05-12

申请号：US12943564

申请日：2010-11-10

申请人： Karoly Becze ,  Pee-Jay Lanneville

发明人： Karoly Becze ,  Pee-Jay Lanneville

IPC分类号： H05K1/00 ,  H05K3/30

CPC分类号： H05K3/325 ,  H05K2201/0314 ,  H05K2201/10075 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2045 ,  Y10T29/4913

摘要： The inventive shock damping system for vibration sensitive surface mounted devices consists of an elastomeric material having conductive fiber material disposed between a printed circuit board (PCB) and a surface mounted device. Once disposed between PCB and surface mounted device, the elastomeric material, the PCB and the surface mounted device are compressed together with a component restraining system, to provide a secure electrical connection between one or more interconnect pads conductively attached to surface mounted device and the PCB. The elastomeric material allows signals and current to flow between surface mounted device and PCB without the use of any attached wires or leads while at the same time providing a system for damping any shocks or vibrations that may be transferred to surface mounted device through the PCB or through the protective component restraining system that encloses the device and the elastomeric material.

摘要翻译： 用于振动敏感表面安装装置的本发明的减震系统由具有设置在印刷电路板（PCB）和表面安装装置之间的导电纤维材料的弹性体材料组成。 一旦设置在PCB和表面安装的装置之间，弹性体材料，PCB和表面安装的装置与部件约束系统一起压缩，以提供导电连接到表面安装的装置和PCB之间的一个或多个互连焊盘之间的安全的电连接 。 弹性体材料允许信号和电流在表面安装的装置和PCB之间流动，而不使用任何附接的导线或引线，同时提供用于阻尼任何冲击或振动的系统，所述冲击或振动可通过PCB传递到表面安装的装置，或 通过包围装置和弹性体材料的保护部件限制系统。