公开(公告)号：US20170272081A1

公开(公告)日：2017-09-21

申请号：US15342554

申请日：2016-11-03

申请人： TXC CORPORATION

发明人： CHIEN-WEI CHIANG ,  WAN-LIN HSIEH ,  CHIA-WEI CHEN ,  CHE-LUNG HSU ,  SHENG-HSIANG KAO ,  CHEN-YA WENG ,  CHIA-CHEN CHEN

IPC分类号： H03L1/02 ,  H01L23/498 ,  G01K13/00 ,  H05K1/02 ,  H03L1/04 ,  H01L23/34 ,  H05K1/18

CPC分类号： H03L1/028 ,  G01K13/00 ,  H03L1/02 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/184 ,  H05K2201/10075 ,  H05K2201/10151

摘要： An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

公开(公告)号：US20190222214A1

公开(公告)日：2019-07-18

申请号：US16363055

申请日：2019-03-25

申请人： TXC CORPORATION

发明人： CHIEN-WEI CHIANG ,  WAN-LIN HSIEH ,  CHIA-WEI CHEN ,  CHE-LUNG HSU ,  SHENG-HSIANG KAO ,  CHEN-YA WENG ,  CHIA-CHEN CHEN

IPC分类号： H03L1/02 ,  H05K1/18 ,  H03L1/04 ,  G01K13/00 ,  H05K1/02 ,  H01L23/34

CPC分类号： H03L1/028 ,  G01K13/00 ,  H01L23/345 ,  H03L1/02 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/10075 ,  H05K2201/10151

摘要： An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

公开(公告)号：US20160285460A1

公开(公告)日：2016-09-29

申请号：US15066274

申请日：2016-03-10

申请人： TXC CORPORATION

发明人： CHIEN-WEI CHIANG ,  CHE-LUNG HSU ,  CHEN-YA WENG ,  CHIA-WEI CHEN

IPC分类号： H03L1/02 ,  H03L1/04

CPC分类号： H03L1/028 ,  H03L1/04

摘要： An oven controlled crystal oscillator using an embedded heating device package is disclosed. The oven controlled crystal oscillator, which is different from the conventional technology using a heating source independent from a quartz crystal package, integrates a heating resistor in a ceramic package structure of the quartz crystal and cooperates with a temperature-controlled circuit to heat a quartz blank in the quartz crystal package, thereby shortening thermal conduction paths, increasing thermal conduction efficiency and greatly reducing thermal dissipation. The present invention further uses an exterior and independent heating resistor, combining with the heating resistor in the quartz crystal package and controlled by the temperature-controlled circuit to form a sandwich structure so that heat is more concentrated to use, thereby stabilizing the interior temperature of a constant temperature oven and the output frequency of an oscillator.

摘要翻译： 公开了一种使用嵌入式加热装置封装的烤箱控制晶体振荡器。 与使用独立于石英晶体封装的加热源的常规技术不同的恒温晶体振荡器将加热电阻器集成在石英晶体的陶瓷封装结构中，并与温度控制电路配合以加热石英空白 在石英晶体封装中，从而缩短热传导路径，增加导热效率，大大降低散热。 本发明还使用外部和独立的加热电阻器，与石英晶体封装中的加热电阻器组合并由温度控制电路控制以形成夹层结构，使得热量更集中使用，从而稳定内部温度 恒温炉和振荡器的输出频率。