Phased array systems and methods with phase shifter

    公开(公告)号:US12095495B2

    公开(公告)日:2024-09-17

    申请号:US17481158

    申请日:2021-09-21

    申请人: Apple Inc.

    IPC分类号: H04B1/44 H04B1/00 H04B1/16

    摘要: This disclosure provide various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter and a receiver, each including one or more differential amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

    Electronic Devices with Wireless Board-to-Board Connectors

    公开(公告)号:US20240097340A1

    公开(公告)日:2024-03-21

    申请号:US18463262

    申请日:2023-09-07

    申请人: Apple Inc.

    IPC分类号: H01Q9/04 H01Q1/24 H01Q1/42

    摘要: An electronic device may include baseband circuitry coupled to antennas over a communication path that includes signal paths on a first substrate, a second substrate, and a third substrate. The antennas may be disposed on the third substrate. A wireless connector may couple the paths on the third substrate to the paths on the second substrate. The wireless connector may include a first transceiver and first antenna on the third substrate and a second transceiver and second antenna on the second substrate. The wireless connector may include one or more dielectric layers disposed between the first antenna and the second antenna. The layers may form a smooth impedance transition between the first antenna and the second antenna. The layers may include one or two angled layers that redirect wireless signals between the first and second antennas to allow the first and second substrates to be offset within the device.

    PHASED ARRAY SYSTEMS AND METHODS WITH PHASE SHIFTER

    公开(公告)号:US20230086630A1

    公开(公告)日:2023-03-23

    申请号:US17946861

    申请日:2022-09-16

    申请人: Apple Inc.

    IPC分类号: H04B1/44 H04B1/16 H04B1/00

    摘要: This disclosure provide various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter and a receiver, each including one or more differential amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

    Eddy Current Mitigation for On-Chip Inductors

    公开(公告)号:US20240357733A1

    公开(公告)日:2024-10-24

    申请号:US18303486

    申请日:2023-04-19

    申请人: Apple Inc.

    IPC分类号: H05K1/02 H01P3/08

    摘要: An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

    PHASED ARRAY SYSTEMS AND METHODS WITH PHASE SHIFTER

    公开(公告)号:US20230088332A1

    公开(公告)日:2023-03-23

    申请号:US17481158

    申请日:2021-09-21

    申请人: Apple Inc.

    IPC分类号: H04B1/44 H04B1/00 H04B1/16

    摘要: This disclosure provide various techniques for improving the quality of a signal. By integrating phase-shifting circuitry with a transmit/receive (T/R) switch, insertion loss may be reduced while decreasing space consumed on an integrated circuit or printed circuit board. In particular, embodiments disclosed herein include a transmitter and a receiver, each including one or more differential amplifiers coupled to a first inductor, and a switching network coupled to a second inductor and one or more phase-shifting circuitries. A differential interface of the differential amplifiers may enable integration of a stage of the phase shifter (e.g., a 180 degree stage) with the T/R switch, such that a single circuit may operate as the phase shifter and the T/R switch. This implementation may reduce the number of T/R switches and phase shifter stages in the phased array system, reducing the overall insertion loss experienced by the phased array system.

    Eddy Current Mitigation for On-Chip Inductors

    公开(公告)号:US20240357734A1

    公开(公告)日:2024-10-24

    申请号:US18474880

    申请日:2023-09-26

    申请人: Apple Inc.

    IPC分类号: H05K1/02 H01P3/08

    摘要: An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.