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    Conductive paste and laminated ceramic electronic component
    31.
    发明授权
    Conductive paste and laminated ceramic electronic component 有权
    导电胶和层压陶瓷电子元件

    公开(公告)号：US06673272B2

    公开(公告)日：2004-01-06

    申请号：US09899323

    申请日：2001-07-05

    申请人： Takaharu Miyazaki ,  Tsuyoshi Yamana

    发明人： Takaharu Miyazaki ,  Tsuyoshi Yamana

    IPC分类号： H01B106

    CPC分类号： C04B35/49 ,  B32B18/00 ,  B32B38/145 ,  B32B2311/22 ,  C04B35/468 ,  C04B35/6281 ,  C04B35/62821 ,  C04B35/62823 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/405 ,  C04B2235/79 ,  C04B2237/12 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/405 ,  C04B2237/50 ,  C04B2237/704 ,  C04B2237/706 ,  H01G4/0085 ,  H05K1/092 ,  Y10T428/24917

    摘要： A laminated ceramic electronic component, for example, monolithic ceramic capacitor, in which the delamination does not occur during baking and having superior thermal shock and moisture load resistance characteristics is provided. A conductive paste, used with advantage to form an internal electrode of the laminated ceramic electronic component, and a laminated ceramic electronic component using the conductive paste is provided. The conductive paste is composed of a conductive powder which is primarily Ni, an organic vehicle, a compound A containing at least one of Mg and Ca and which is an organic acid metal salt, oxide powder, metal organic complex salt and/or an alkoxide, and a compound B, having a hydrolyzable reactive group containing at least one of Ti and Zr, which adheres to the surface of the conductive powder.

    摘要翻译： 提供了层压陶瓷电子部件，例如，单片陶瓷电容器，其中在烘烤期间不发生分层并具有优异的耐热冲击和耐湿负荷特性。 提供有利地形成层叠陶瓷电子部件的内部电极的导电性糊料和使用导电性糊料的层叠陶瓷电子部件。 导电性糊料由主要为Ni的导电性粉末，有机载体，含有Mg和Ca中的至少一种的化合物A，作为有机酸金属盐，氧化物粉末，金属有机配盐和/或醇盐构成 ，以及具有含有Ti和Zr中的至少一种的可水解反应性基团的化合物B，其粘附到导电粉末的表面。

    Method of fabricating a ceramic stack structure
    32.
    发明申请
    Method of fabricating a ceramic stack structure 审中-公开
    制造陶瓷堆叠结构的方法

    公开(公告)号：US20030168784A1

    公开(公告)日：2003-09-11

    申请号：US10376299

    申请日：2003-03-03

    发明人： Akio Iwase ,  Takeshi Matsui

    IPC分类号： C04B033/32

    CPC分类号： B32B18/00 ,  B32B38/145 ,  B32B2038/042 ,  B32B2311/08 ,  C04B35/491 ,  C04B2235/6567 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/50 ,  C04B2237/68 ,  C04B2237/704 ,  H01G4/308 ,  H01L41/083 ,  H01L41/273

    摘要： A method of fabricating a ceramic stack structure having dielectric layers which are not easily cracked or delaminated is disclosed. In fabricating a ceramic stack structure having a plurality of dielectric layers and a plurality of internal electrode layers stacked alternately with each other, a carrier film (20) is prepared and a plurality of internal electrode print portions (21) are formed. A large print portion (225) is formed in such a manner as to cover the internal electrode print portions (21). The large print portion (225) is dried and a coat layer (23) is formed in such a manner as to smooth out the unevenness of the surface of the large print portion (225). The large print portion (225) is removed from the carrier film (20) and punched to produce an unsintered unit. The unsintered unit is punched while at the same time stacking and attaching the particular unsintered unit on another unsintered unit under pressure. This process is repeated to produce an unsintered stack body including a plurality of the unsintered units. The unsintered stack body is sintered into a ceramic stack structure.

    摘要翻译： 公开了一种制造具有不容易破裂或分层的电介质层的陶瓷堆叠结构的方法。 在制造具有彼此交替堆叠的多个电介质层和多个内部电极层的陶瓷堆叠结构体的情况下，制备载体膜（20）并形成多个内部电极印刷部分（21）。 以覆盖内部电极印刷部分（21）的方式形成大的印刷部分（225）。 大的印刷部分（225）被干燥，并且形成涂层（23）以平滑大印刷部分（225）的表面的不均匀性。 将大的印刷部分（225）从载体薄膜（20）上取下并冲压成不烧结单元。 未烧结单元被冲压，同时在特定未烧结单元的压力下堆叠并附着在另一个未烧结单元上。 重复该过程以产生包括多个未烧结单元的未烧结堆叠体。 将未烧结的堆叠体烧结成陶瓷堆叠结构。