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    HIGHLY INTEGRATED IMAGE SENSORS USING INTER-SUBSTRATE WIRING STRUCTURES
    31.
    发明公开
    HIGHLY INTEGRATED IMAGE SENSORS USING INTER-SUBSTRATE WIRING STRUCTURES 审中-公开

    公开(公告)号：US20240014243A1

    公开(公告)日：2024-01-11

    申请号：US18295966

    申请日：2023-04-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Minho Jang ,  Doowon Kwon ,  Kyungtae Lim ,  Donghyun Kim

    IPC: H01L27/146

    CPC classification number: H01L27/14634 ,  H01L27/14645 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1469

    Abstract: An image sensor includes a first substrate having a first transistor integrated therein, and a first plurality of wiring structures on the first substrate. The first plurality of wiring structures include a first wiring structure electrically connected to the first transistor. A second substrate extends on the first plurality of wiring structures, and has a second transistor integrated therein, which is electrically connected to a second wiring structure within the first plurality of wiring structures. A second plurality of wiring structures extend on the second substrate. A third substrate is provided on the second plurality of wiring structures. A microlens extends on a light receiving surface of the third substrate. A light sensing element extends within the third substrate. A transfer gate (TG) extends into a portion of the third substrate, extends adjacent the light sensing element, and is electrically connected to a first wiring structure within the second plurality of wiring structures. A floating diffusion (FD) region extends within the third substrate and adjacent the TG. The FD region is electrically connected to a second wiring structure within the second plurality of wiring structures.

    IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME
    32.
    发明公开
    IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME 审中-公开

    公开(公告)号：US20230343800A1

    公开(公告)日：2023-10-26

    申请号：US18093609

    申请日：2023-01-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyoungeun CHANG ,  Sungin Kim ,  Seonghoon Ko ,  Donghyun Kim ,  Wook Lee

    IPC: H01L27/146

    CPC classification number: H01L27/14614 ,  H01L27/14643 ,  H01L27/1463 ,  H01L27/14689

    Abstract: An image sensor includes a substrate having a pixel region in which an active region having a locally asymmetric fin region limited by a locally cutout space is defined and a transistor provided in the pixel region. The transistor includes a horizontal gate portion provided on the active region and a vertical gate portion filling the locally cutout space and facing one of fin sidewalls of the locally asymmetric fin region. Distances of the source region and drain region formed in the active region from the locally asymmetric fin region are different from each other. An electronic system includes at least one camera module including an image sensor and a processor configured to process image data provided from the at least one camera module.

    Heat exchanger and air conditioner including the same
    39.
    发明授权
    Heat exchanger and air conditioner including the same 有权

    公开(公告)号：US12188724B2

    公开(公告)日：2025-01-07

    申请号：US16686913

    申请日：2019-11-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Donghyun Kim ,  Youngmin Kim ,  Yonghwa Choi ,  Jeungku Choi

    IPC: F28D1/053 ,  F24F11/84 ,  F28F9/02

    Abstract: A heat exchanger for an air conditioner includes a plurality of flat heat transfer tubes through which a refrigerant flows; first and second headers disposed on opposite ends of the plurality of flat heat transfer tubes; at least one baffle disposed in at least one of the first and second headers and to partition an inner space of the at least one header; and a refrigerant flow control device disposed on the at least one baffle, to allow the refrigerant to selectively pass through the at least one baffle. The refrigerant flow control device is configured to prevent refrigerant from passing through the refrigerant flow control device when the refrigerant flows in one direction in the header, and to allow the refrigerant to pass through the refrigerant flow control device when the refrigerant flows in a direction opposite to the one direction in the header.

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