公开(公告)号：US20120242748A1

公开(公告)日：2012-09-27

申请号：US13498487

申请日：2009-09-28

Applicant: Ioannis Katakis ,  Diego Bejarano ,  Pablo Lozano Sanchez

Inventor： Ioannis Katakis ,  Diego Bejarano ,  Pablo Lozano Sanchez

IPC: B41J2/135 ,  B41M1/12

CPC classification number: B41J2/135 ,  B01L3/502707 ,  B01L2300/0645 ,  B01L2300/0887 ,  B33Y80/00 ,  B81C1/00071 ,  B81C2201/0184 ,  B81C2201/0185

Abstract: Micro fluidic devices comprising three dimensional elements fabricated onto a substrate using thick film printing technology, e.g., screen printing, wherein the three dimensional elements possess both structural and functional properties.

Abstract translation: 微流体装置包括使用厚膜印刷技术（例如丝网印刷）制造在基底上的三维元件，其中三维元件具有结构和功能特性。

公开(公告)号：US20120167262A1

公开(公告)日：2012-06-28

申请号：US13375361

申请日：2010-06-04

Applicant: Chad A. Mirkin ,  Wooyoung Shim ,  Adam B. Braunschweig ,  Xing Liao ,  Jinan Chai ,  Jong Kuk Lim ,  Gengfeng Zheng ,  Zijian Zheng

Inventor： Chad A. Mirkin ,  Wooyoung Shim ,  Adam B. Braunschweig ,  Xing Liao ,  Jinan Chai ,  Jong Kuk Lim ,  Gengfeng Zheng ,  Zijian Zheng

IPC: G01Q70/14 ,  G01Q70/16

CPC classification number: G03F7/0002 ,  B81B2203/0361 ,  B81B2207/056 ,  B81C1/00111 ,  B81C1/0046 ,  B81C2201/0154 ,  B81C2201/0185 ,  B82Y10/00 ,  B82Y40/00 ,  Y10S977/732

Abstract: Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.

Abstract translation: 公开了使用具有连接到背衬层的多个笔的尖端阵列的光刻方法，其中尖端可以包括金属，准金属和/或半导电材料，并且背衬层可以包括弹性体聚合物。 尖端阵列可用于执行光刻工艺，其中尖端涂覆有当尖端与衬底表面接触时沉积到衬底上的油墨（例如，图案化组合物）。 尖端可以容易地平整到基底上，并且可以通过背衬层的光反射的变化和/或在尖端与基底表面接触时靠近尖端附近来光学地监测流平。

公开(公告)号：US08201325B2

公开(公告)日：2012-06-19

申请号：US12275276

申请日：2008-11-21

Applicant: Laurent A. Dellmann ,  Michel Despont ,  Ute Drechsler ,  Roland M. Guerre

Inventor： Laurent A. Dellmann ,  Michel Despont ,  Ute Drechsler ,  Roland M. Guerre

IPC: H05K3/30

CPC classification number: B81C1/00373 ,  B81C3/008 ,  B81C2201/0185 ,  H01L24/95 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5313

Abstract: A method for producing an integrated device. A source substrate is provided, the source substrate carrying one or more components to be attached to a receiver surface having a uneven topography. The source substrate includes a deformable layer on a surface on which the one or more components are carried. The source substrate is aligned such that said one or more components carried thereon are associated with contact areas of the receiver surface. The source substrate and the receiver surface are moved towards each other such that the one or more components are brought into contact with the contact areas wherein the deformable layer is at least partially deformed. The source substrate is removed such that the one or more of the components remain located on the contact areas of the receiver surface.

Abstract translation: 一种集成装置的制造方法。 提供源极衬底，源极衬底承载要附着到具有不平坦的形貌的接收器表面的一个或多个部件。 源极基板在其上承载有一个或多个部件的表面上包括可变形层。 源极衬底被对准，使得其上承载的所述一个或多个部件与接收器表面的接触区域相关联。 源极基板和接收器表面朝向彼此移动，使得一个或多个部件与可变形层至少部分变形的接触区域接触。 去除源极衬底，使得一个或多个部件保持位于接收器表面的接触区域上。

公开(公告)号：US20100283069A1

公开(公告)日：2010-11-11

申请号：US11981380

申请日：2007-10-31

Applicant: John Rogers ,  Ralph Nuzzo ,  Matthew Meitl ,  Etienne Menard ,  Alfred J. Baca ,  Michael Motala ,  Jong-Hyun Ahn ,  Sang-Il Park ,  Chang-Jae Yu ,  Heung-Cho Ko ,  Mark Stoykovich ,  Jongseung Yoon

Inventor： John Rogers ,  Ralph Nuzzo ,  Matthew Meitl ,  Etienne Menard ,  Alfred J. Baca ,  Michael Motala ,  Jong-Hyun Ahn ,  Sang-Il Park ,  Chang-Jae Yu ,  Heung-Cho Ko ,  Mark Stoykovich ,  Jongseung Yoon

IPC: H01L33/58 ,  H01L33/00 ,  H01L31/18 ,  H01L31/0232

CPC classification number: H01L25/50 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchability. Optical systems of the present invention include, however, devices and device arrays provided on conventional rigid or semi-rigid substrates, in addition to devices and device arrays provided on flexible, shapeable and/or stretchable substrates.

Abstract translation: 本发明提供至少部分地通过基于印刷的装配和装置部件的集成制造的光学装置和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。 本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适应性和拉伸性。 然而，本发明的光学系统除了在柔性，可塑性和/或可拉伸的基底上提供的装置和装置阵列外，还包括设置在常规刚性或半刚性基底上的装置和装置阵列。

公开(公告)号：US20090294803A1

公开(公告)日：2009-12-03

申请号：US11145574

申请日：2005-06-02

Applicant: Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

Inventor： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC: H01L29/772 ,  H01L27/12 ,  H01L21/782 ,  H01L21/30 ,  H01L29/06 ,  H01L29/861

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract translation: 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

公开(公告)号：US20070032089A1

公开(公告)日：2007-02-08

申请号：US11421654

申请日：2006-06-01

Applicant: Ralph Nuzzo ,  John Rogers ,  Etienne Menard ,  Keon Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Ko

Inventor： Ralph Nuzzo ,  John Rogers ,  Etienne Menard ,  Keon Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu ,  Heung Ko

IPC: H01L21/302

CPC classification number: H01L29/72 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02628 ,  H01L21/30 ,  H01L21/3083 ,  H01L21/31612 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/045 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/1606 ,  H01L29/66265 ,  H01L29/66462 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78684 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/13091 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Abstract translation: 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：US12074213B2

公开(公告)日：2024-08-27

申请号：US17357697

申请日：2021-06-24

Applicant: The Board of Trustees of the University of Illinois

Inventor： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC: H01L29/76 ,  B82Y10/00 ,  H01L21/02 ,  H01L21/308 ,  H01L21/322 ,  H01L21/683 ,  H01L23/00 ,  H01L23/02 ,  H01L25/075 ,  H01L27/12 ,  H01L29/04 ,  H01L29/06 ,  H01L29/12 ,  H01L29/786 ,  H01L31/0392 ,  H01L31/18 ,  H01L33/00 ,  H01L33/32

CPC classification number: H01L29/76 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/80 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0093 ,  H01L33/32 ,  B81C2201/0185 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/50 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/0332 ,  H01L2924/00014 ,  H01L2224/97 ,  H01L2224/80 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/80121 ,  H01L2924/00012 ,  H01L2224/83121 ,  H01L2924/00012 ,  H01L2224/9202 ,  H01L2224/03 ,  H01L2224/05666 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/94 ,  H01L2224/03 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05144 ,  H01L2924/01032 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/05155 ,  H01L2224/05144 ,  H01L2924/01032 ,  H01L2224/05073 ,  H01L2224/05644 ,  H01L2224/05166 ,  H01L2224/05166 ,  H01L2924/00014 ,  H01L2224/05555 ,  H01L2924/00014 ,  H01L2224/05554 ,  H01L2924/00014 ,  H01L2224/05553 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00012 ,  H01L2224/83192 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/1306 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/1305 ,  H01L2924/00 ,  H01L2924/12032 ,  H01L2924/00 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/12036 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12043 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/13063 ,  H01L2924/00 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/13055 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：US11667521B2

公开(公告)日：2023-06-06

申请号：US16550495

申请日：2019-08-26

Applicant: City University of Hong Kong

Inventor： Yang Lu ,  Libo Gao ,  Sufeng Fan ,  Yuejiao Wang

IPC: B81B7/02 ,  B82B3/00 ,  B81C1/00 ,  B33Y10/00 ,  B33Y80/00 ,  B29C64/393 ,  B29C64/129 ,  B82Y35/00 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: B81B7/02 ,  B29C64/129 ,  B29C64/393 ,  B33Y10/00 ,  B33Y80/00 ,  B81C1/00373 ,  B82B3/009 ,  B82Y35/00 ,  B01L2300/0809 ,  B81C2201/0185 ,  B82Y30/00 ,  B82Y40/00

Abstract: A method of constructing a micromechanical device by additive manufacturing for characterizing strength of a low dimensional material sample, the method including: a) deriving a three-dimensional representation arranged to represent a said micromechanical device with reference to at least one physical characteristic of a said low dimensional material sample; b) transforming the three-dimensional representation into a plurality of two-dimensional representations arranged to individually represent a portion of the three-dimensional representation; and c) forming the micromechanical device from a fluid medium arranged to transform its physical state by stereolithography apparatus in response to a manipulated illumination exposed thereto, whereby a said low dimensional material sample is loaded onto the formed micromechanical device.

公开(公告)号：US20170309733A1

公开(公告)日：2017-10-26

申请号：US15640206

申请日：2017-06-30

Applicant: The Board of Trustees of the University of Illinois

Inventor： Ralph G. NUZZO ,  John A. ROGERS ,  Etienne MENARD ,  Keon Jae LEE ,  Dahl-Young KHANG ,  Yugang SUN ,  Matthew MEITL ,  Zhengtao ZHU

IPC: H01L29/76 ,  B82Y10/00 ,  H01L33/00 ,  H01L31/18 ,  H01L31/0392 ,  H01L29/786 ,  H01L29/12 ,  H01L29/06 ,  H01L29/04 ,  H01L27/12 ,  H01L25/075 ,  H01L23/00 ,  H01L23/02 ,  H01L21/683 ,  H01L21/322 ,  H01L21/308 ,  H01L21/02 ,  H01L33/32

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：US20160072027A1

公开(公告)日：2016-03-10

申请号：US14800363

申请日：2015-07-15

Applicant: The Board of Trustees of the University of Illinois ,  Semprius, Inc.

Inventor： John ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC: H01L33/54 ,  H01L25/16 ,  H01L33/56

CPC classification number: H01L25/50 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

Abstract translation: 提供了至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。 本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适形性和可拉伸性。