知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

96 条记录 (耗时 0.023 秒)

    Integrated electro-mechanical actuator
    1.
    发明授权
    Integrated electro-mechanical actuator 有权
    集成机电执行器

    公开(公告)号：US09029719B2

    公开(公告)日：2015-05-12

    申请号：US13638275

    申请日：2011-03-29

    申请人： Michel Despont

    发明人： Michel Despont

    IPC分类号： H01H13/702 ,  H01H49/00 ,  H01H59/00

    CPC分类号： H01H49/00 ,  H01H59/00 ,  H01H59/0009

    摘要： The present invention provides an integrated electro-mechanical actuator and a manufacturing method for manufacturing such an integrated electro-mechanical actuator. The integrated electro-mechanical actuator comprises an electrostatic actuator gap between actuator electrodes and an electrical contact gap between contact electrodes. An inclination with an inclination angle is provided between the actuator electrodes and the contact electrodes. The thickness of this electrical contact gap is equal to the thickness of a sacrificial layer which is etched away in a manufacturing process.

    摘要翻译： 本发明提供了一种集成的机电致动器和用于制造这种集成的机电致动器的制造方法。 集成的机电致动器包括致动器电极之间的静电致动器间隙和接触电极之间的电接触间隙。 在致动器电极和接触电极之间设置有倾斜角度的倾斜。 该电接触间隙的厚度等于在制造过程中被蚀刻掉的牺牲层的厚度。

    Hybrid FPA for Thz imaging with an antenna array, coupled to CMOS-MEMS thermal sensors, implementing per-pixel ES actuation and enabling tuning, correlated double sampling and AM modulation
    2.
    发明申请
    Hybrid FPA for Thz imaging with an antenna array, coupled to CMOS-MEMS thermal sensors, implementing per-pixel ES actuation and enabling tuning, correlated double sampling and AM modulation 有权
    混合FPA用于具有天线阵列的Thz成像，耦合到CMOS-MEMS热传感器，实现每像素ES致动和实现调谐，相关双采样和AM调制

    公开(公告)号：US20130082345A1

    公开(公告)日：2013-04-04

    申请号：US13251255

    申请日：2011-10-02

    申请人： Dan Corcos ,  Michel Despont ,  Danny Elad ,  Lukas Kull ,  Thomas Morf ,  Benny Sheinman

    发明人： Dan Corcos ,  Michel Despont ,  Danny Elad ,  Lukas Kull ,  Thomas Morf ,  Benny Sheinman

    IPC分类号： H01L27/144

    CPC分类号： G01N21/3581 ,  B81B3/0081 ,  G01J3/42 ,  G01J5/0837 ,  G01J2005/0077 ,  H01L31/09

    摘要： A THz radiation detector comprising a vertical antenna separated from a suspended platform by an isolating thermal air gap for concentrating THz radiation energy into a smaller suspended MEMS platform upon which a thermal sensor element is located. THz photon energy is converted into electrical energy via a thermally isolated air gap between plates of a coupling capacitor that couples energy from the antenna to the thermal sensor. The capacitor plates used for capacitive coupling of the received signal realize an electro-static actuator whereby the application of a DC bias varies the coupling capacitor gap. The DC bias causes the actuator to pull the suspended platform close to the antenna to reduce the capacitive gap, increasing the coupling capacitance, to touch the antenna array thus quickly discharging the heat induced in the sensor platform or to perform advanced readout operations, such as amplitude modulation and correlated double sampling.

    摘要翻译： 一种太赫兹辐射检测器，包括通过隔离热空气间隙与悬浮平台分离的垂直天线，用于将太赫兹辐射能量集中到位于热传感器元件的较小悬置MEMS平台上。 太赫兹光子能量通过将能量从天线耦合到热传感器的耦合电容器的板之间的隔热气隙转换成电能。 用于接收信号的电容耦合的电容器板实现静电致动器，由此施加直流偏压改变耦合电容器间隙。 DC偏置使致动器将悬挂平台拉近靠近天线，以减小电容间隙，增加耦合电容，以便触摸天线阵列，从而快速放出传感器平台中感应的热或执行高级读出操作，例如 幅度调制和相关双重采样。

    Platinum silicide tip apices for probe-based technologies
    4.
    发明授权
    Platinum silicide tip apices for probe-based technologies 有权
    用于探针技术的铂硅化物尖端顶点

    公开(公告)号：US08332961B2

    公开(公告)日：2012-12-11

    申请号：US12234816

    申请日：2008-09-22

    申请人： Harish Bhaskaran ,  Michel Despont ,  Ute Drechsler ,  Abu Sebastian

    发明人： Harish Bhaskaran ,  Michel Despont ,  Ute Drechsler ,  Abu Sebastian

    IPC分类号： G01Q60/40 ,  G01Q10/00

    CPC分类号： G01Q60/40

    摘要： Tips including a platinum silicide at an apex of a single crystal silicon tip are provided herein. Also, techniques for creating a tip are provided. The techniques include depositing an amount of platinum (Pt) on a single crystal silicon tip, annealing the platinum and single crystal silicon tip to form a platinum silicide, and selectively etching the platinum with respect to the formed platinum silicide.

    摘要翻译： 本文提供了包括单晶硅尖端顶点处的铂硅化物的提示。 此外，提供了用于创建提示的技术。 这些技术包括在单晶硅尖端上沉积一定量的铂（Pt），使铂和单晶硅尖端退火以形成铂硅化物，并相对于形成的铂硅化物选择性地蚀刻铂。

    Method for producing an integrated device
    7.
    发明授权
    Method for producing an integrated device 有权
    集成装置的制造方法

    公开(公告)号：US08201325B2

    公开(公告)日：2012-06-19

    申请号：US12275276

    申请日：2008-11-21

    申请人： Laurent A. Dellmann ,  Michel Despont ,  Ute Drechsler ,  Roland M. Guerre

    发明人： Laurent A. Dellmann ,  Michel Despont ,  Ute Drechsler ,  Roland M. Guerre

    IPC分类号： H05K3/30

    CPC分类号： B81C1/00373 ,  B81C3/008 ,  B81C2201/0185 ,  H01L24/95 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5313

    摘要： A method for producing an integrated device. A source substrate is provided, the source substrate carrying one or more components to be attached to a receiver surface having a uneven topography. The source substrate includes a deformable layer on a surface on which the one or more components are carried. The source substrate is aligned such that said one or more components carried thereon are associated with contact areas of the receiver surface. The source substrate and the receiver surface are moved towards each other such that the one or more components are brought into contact with the contact areas wherein the deformable layer is at least partially deformed. The source substrate is removed such that the one or more of the components remain located on the contact areas of the receiver surface.

    摘要翻译： 一种集成装置的制造方法。 提供源极衬底，源极衬底承载要附着到具有不平坦的形貌的接收器表面的一个或多个部件。 源极基板在其上承载有一个或多个部件的表面上包括可变形层。 源极衬底被对准，使得其上承载的所述一个或多个部件与接收器表面的接触区域相关联。 源极基板和接收器表面朝向彼此移动，使得一个或多个部件与可变形层至少部分变形的接触区域接触。 去除源极衬底，使得一个或多个部件保持位于接收器表面的接触区域上。

    Opto-electronic board
    10.
    发明授权
    Opto-electronic board 有权
    光电板

    公开(公告)号：US07724988B2

    公开(公告)日：2010-05-25

    申请号：US11927589

    申请日：2007-10-29

    申请人： Laurent A. Dellmann ,  Michel Despont ,  Bert J. Offrein ,  David J. Webb

    发明人： Laurent A. Dellmann ,  Michel Despont ,  Bert J. Offrein ,  David J. Webb

    IPC分类号： G02B6/12 ,  H01L21/00

    CPC分类号： G02B6/4232 ,  G02B6/4249 ,  H05K1/0274 ,  H05K1/184 ,  H05K2201/10121

    摘要： An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.

    摘要翻译： 一种光电板，包括具有光波导，金属区域和孔的印刷线路板，其中所述光波导的抵接面和所述金属区域的抵接面形成所述孔的侧面的一部分。 光电板还包括具有接合焊盘的光电子电路，其中光电子电路布置在孔中并用其焊盘焊接到金属区域的邻接面。