Invention Application
- Patent Title: METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
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Application No.: US15640206Application Date: 2017-06-30
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Publication No.: US20170309733A1Publication Date: 2017-10-26
- Inventor: Ralph G. NUZZO , John A. ROGERS , Etienne MENARD , Keon Jae LEE , Dahl-Young KHANG , Yugang SUN , Matthew MEITL , Zhengtao ZHU
- Applicant: The Board of Trustees of the University of Illinois
- Main IPC: H01L29/76
- IPC: H01L29/76 ; B82Y10/00 ; H01L33/00 ; H01L31/18 ; H01L31/0392 ; H01L29/786 ; H01L29/12 ; H01L29/06 ; H01L29/04 ; H01L27/12 ; H01L25/075 ; H01L23/00 ; H01L23/02 ; H01L21/683 ; H01L21/322 ; H01L21/308 ; H01L21/02 ; H01L33/32
Abstract:
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Public/Granted literature
- US10374072B2 Methods and devices for fabricating and assembling printable semiconductor elements Public/Granted day:2019-08-06
Information query
IPC分类:
