Invention Grant
- Patent Title: Methods and devices for fabricating and assembling printable semiconductor elements
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Application No.: US17357697Application Date: 2021-06-24
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Publication No.: US12074213B2Publication Date: 2024-08-27
- Inventor: Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
- Applicant: The Board of Trustees of the University of Illinois
- Applicant Address: US IL Urbana
- Assignee: The Board of Trustees of the University of Illinois
- Current Assignee: The Board of Trustees of the University of Illinois
- Current Assignee Address: US IL Urbana
- Agency: Leydig, Voit & Mayer, Ltd.
- The original application number of the division: US11145574 2005.06.02
- Main IPC: H01L29/76
- IPC: H01L29/76 ; B82Y10/00 ; H01L21/02 ; H01L21/308 ; H01L21/322 ; H01L21/683 ; H01L23/00 ; H01L23/02 ; H01L25/075 ; H01L27/12 ; H01L29/04 ; H01L29/06 ; H01L29/12 ; H01L29/786 ; H01L31/0392 ; H01L31/18 ; H01L33/00 ; H01L33/32
Abstract:
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Public/Granted literature
- US20210343862A1 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS Public/Granted day:2021-11-04
Information query
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