公开(公告)号：US20150258792A1

公开(公告)日：2015-09-17

申请号：US14639233

申请日：2015-03-05

申请人： SII PRINTEK INC. ,  SEIKO INSTRUMENTS INC.

发明人： Tokio TATSUMI ,  Satoshi HORIGUCHI

IPC分类号： B41J2/16

CPC分类号： B41J2/14209 ,  B41J2/14233 ,  B41J2/1609 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1643 ,  B41J2002/14491 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49401

摘要： A method of manufacturing a liquid jet head includes: a through hole forming step of forming through holes on first and second base plates; an actuator plate bonding step of bonding actuator plates to the respective base plates; and an electrode forming step of forming electrodes on the bonded bodies of the base plates and the actuator plates. In the through hole forming step, the through holes are formed on the base plates and the inner surfaces of the through holes are roughened. In the electrode forming step, second extraction electrodes are routed to a principal surface of the first base plate through the through holes.

摘要翻译： 一种制造液体喷射头的方法包括：通孔形成步骤，在第一和第二基板上形成通孔; 将致动器板接合到各个基板的致动器板接合步骤; 以及在基板和致动器板的接合体上形成电极的电极形成步骤。 在通孔形成工序中，在基板上形成通孔，使贯通孔的内表面粗糙化。 在电极形成步骤中，第二提取电极通过通孔被路由到第一基板的主表面。

公开(公告)号：US20150230333A1

公开(公告)日：2015-08-13

申请号：US14616466

申请日：2015-02-06

申请人： SEIKO EPSON CORPORATION

发明人： Tsuyoshi YODA ,  Shuichi TANAKA ,  Ikuya MIYAZAWA

IPC分类号： H05K1/02 ,  H05K1/03 ,  B41J2/01 ,  C23F1/02

CPC分类号： C23F1/02 ,  B41J2/14233 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/14241 ,  B41J2002/14419 ,  B41J2002/14491 ,  H01L2224/18

摘要： A conduction structure includes a device substrate (first substrate), an IC (second substrate) having an upper surface and an end surface, a sealing plate (third substrate) having an upper surface and an end surface, a conductive layer having a first part provided on an upper surface of the device substrate, a second part provided on the end surface of the IC and connected to the first part, a third part provided on the upper surface of the IC and connected to the second part, and a fourth part provided on the end surface of the sealing plate and connected to both of the first part and the second part, and a plating layer overlapped with the conductive layer.

摘要翻译： 导电结构包括器件衬底（第一衬底），具有上表面和端面的IC（第二衬底），具有上表面和端表面的密封板（第三衬底），具有第一部分的导电层 设置在所述器件基板的上表面上的第二部分，设置在所述IC的端面上并连接到所述第一部分的第二部分，设置在所述IC的上表面并连接到所述第二部分的第三部分， 设置在密封板的端面上并连接到第一部分和第二部分，以及与导电层重叠的镀层。

公开(公告)号：US09050798B2

公开(公告)日：2015-06-09

申请号：US13786311

申请日：2013-03-05

申请人： Toshiba Tec Kabushiki Kaisha

发明人： Shuhei Yokoyama ,  Ryutaro Kusunoki ,  Chiaki Tanuma ,  Ryuichi Arai

IPC分类号： B41J2/05 ,  B41J2/14 ,  H01L41/22 ,  B41J2/16

CPC分类号： B41J2/14201 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/1437 ,  B41J2202/15 ,  H01L41/22 ,  Y10T29/42

摘要： According to embodiments, a manufacturing method for an ink-jet head is disclosed. The method comprises forming an ink pressure chamber, forming an oscillating plate, and forming, on the oscillating plate, a first electrode having a predetermined footprint. The method further comprises forming, on the oscillating plate and on the first electrode, a piezoelectric film having a footprint that is geometrically similar to the predetermined footprint, forming, on the oscillating plate and the piezoelectric film, a second electrode having a footprint that is geometrically similar to the predetermined footprint, and forming a nozzle in the oscillating plate.

摘要翻译： 根据实施例，公开了一种用于喷墨头的制造方法。 该方法包括形成墨压室，形成振荡板，并在振荡板上形成具有预定印迹的第一电极。 该方法还包括在振荡板上和第一电极上形成压电薄膜，该压电薄膜具有与预定印迹几何相似的印迹，在振荡板和压电薄膜上形成具有足迹的第二电极 在几何学上类似于预定的足迹，并在振荡板中形成喷嘴。

公开(公告)号：US08998387B2

公开(公告)日：2015-04-07

申请号：US14097837

申请日：2013-12-05

申请人： Seiko Epson Corporation

发明人： Hideyuki Ogawa ,  Koichi Saito ,  Nagamitsu Takashima ,  Katsunori Ono

IPC分类号： B41J2/045 ,  B41J2/16

CPC分类号： B41J2/045 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1637 ,  B41J2/1643 ,  Y10T29/49401

摘要： The invention is directed to a method of working a small recess portion. In the method, prior to press-forming small recess portions arrayed in a row by pressing a predetermined number of pieces of aligned male dies to a metal base plate, the metal base plate is previously formed with a highly rigid portion at a predetermined portion at a vicinity of an imaginary line extending in a row direction along end portions of predicted press portions to which the respective male dies are pressed.

摘要翻译： 本发明涉及一种工作小凹部的方法。 在该方法中，在通过将预定数量的对准的阳模压制到金属基板上之前将压入成型的小凹部排成一排之前，金属基板预先在预定部分处形成高刚性部分 围绕相应的阳模被按压的预测按压部分的端部沿行方向延伸的假想线的附近。

公开(公告)号：US20150093841A1

公开(公告)日：2015-04-02

申请号：US14531723

申请日：2014-11-03

申请人： Japan Science and Technology Agency

发明人： Tatsuya SHIMODA ,  Eisuke TOKUMITSU ,  Takaaki MIYASAKO ,  Toshihiko KANEDA

IPC分类号： H01L29/66 ,  H01L21/441

CPC分类号： H01L29/66969 ,  B05D5/06 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1637 ,  B41J2/1639 ,  B41J2/1643 ,  B41J2/1645 ,  C23C18/06 ,  C23C18/1216 ,  C23C18/1254 ,  C23C18/1279 ,  C23C18/1283 ,  C23C18/1295 ,  H01L21/02104 ,  H01L21/0237 ,  H01L21/02521 ,  H01L21/02601 ,  H01L21/02628 ,  H01L21/38 ,  H01L21/441 ,  H01L27/1225 ,  H01L27/1292 ,  H01L29/786 ,  H01L29/7869 ,  H01L41/0973 ,  H01L41/318 ,  H01L41/33

摘要： A method of producing a functional device according to the present invention includes, in this order: the functional solid material precursor layer formation step of applying a functional liquid material onto a base material to form a precursor layer of a functional solid material; the drying step of heating the precursor layer to a first temperature in a range from 80° C. to 250° C. to preliminarily decrease fluidity of the precursor layer; the imprinting step of imprinting the precursor layer that is heated to a second temperature in a range from 80° C. to 300° C. to form an imprinted structure on the precursor layer; and the functional solid material layer formation step of heat treating the precursor layer at a third temperature higher than the second temperature to transform the precursor layer into a functional solid material layer.

摘要翻译： 本发明的功能元件的制造方法依次包括功能固体材料前体层的形成工序，将功能性液态材料涂布在基材上形成功能性固体材料的前体层; 所述干燥步骤将所述前体层加热至80℃至250℃的第一温度，以预先降低所述前体层的流动性; 将加热到80℃至300℃的第二温度的前体层的压印步骤，在前体层上形成压印结构; 以及在高于第二温度的第三温度下对前体层进行热处理以将前体层转变成功能性固体材料层的功能性固体材料层形成步骤。

公开(公告)号：US08940559B2

公开(公告)日：2015-01-27

申请号：US13289208

申请日：2011-11-04

申请人： Daniel A Kearl ,  Rio Rivas

发明人： Daniel A Kearl ,  Rio Rivas

IPC分类号： H01L21/00 ,  B41J2/16

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1645

摘要： In an embodiment, a method of fabricating an integrated orifice plate and cap structure includes forming an orifice bore on the front side of a product wafer, coating side walls of the orifice bore with a protective material, grinding the product wafer from its back side to a final thickness, forming a first hardmask for subsequent cavity formation, forming a second hardmask over the first hardmask for subsequent descender formation, forming a softmask over the second hardmask for subsequent convergent bore formation, etching a latent convergent bore using the softmask as an etch delineation feature, etching a descender using the second hardmask as an etch delineation feature, and anisotropic etching of convergent bore walls and cavities using the first hardmask as an etch delineation feature.

摘要翻译： 在一个实施例中，制造集成孔板和盖结构的方法包括在产品晶片的正面上形成孔口孔，用保护材料涂覆孔孔的侧壁，将产品晶片从其背面研磨到 最后的厚度，形成用于后续空腔形成的第一硬掩模，在第一硬掩模上形成第二硬掩模用于随后的下沉形成，在第二硬掩模上形成软掩模以用于随后的会聚孔形成，使用软掩模蚀刻潜在会聚孔作为蚀刻 描绘特征，使用第二硬掩模蚀刻下坡作为蚀刻描绘特征，以及使用第一硬掩模作为蚀刻描绘特征的会聚孔壁和空腔的各向异性蚀刻。

公开(公告)号：US08937727B2

公开(公告)日：2015-01-20

申请号：US13620908

申请日：2012-09-15

申请人： Kia Silverbrook

发明人： Kia Silverbrook

IPC分类号： G06F3/12 ,  G06K15/02 ,  H04N1/54 ,  H04N1/56 ,  H04N1/034 ,  G06F13/00 ,  G06F9/28 ,  G06F9/24 ,  G06F15/16 ,  G06F15/163 ,  G06F15/80 ,  B41J2/14 ,  H04N1/00 ,  G06F21/86 ,  H04N1/21 ,  B41J2/16 ,  H04N1/23 ,  G07F7/08 ,  H04N9/04 ,  G11C16/22 ,  B41J15/04 ,  G06F12/08 ,  G11C11/56 ,  B41J11/70 ,  H04N1/32 ,  G06K19/06 ,  H01L23/00 ,  B82Y30/00 ,  H04N5/262 ,  B41J2/175 ,  G03B17/02 ,  G06F1/16 ,  B41J3/44 ,  H04N5/335 ,  G06F21/79 ,  G06K1/12 ,  G06T1/20 ,  G03B27/02 ,  G06K19/073 ,  G06K7/14 ,  G06T3/00 ,  H04N5/225 ,  B41J11/00 ,  B42D25/00 ,  G07F7/12 ,  G06K7/10 ,  B41J29/02 ,  H05K1/18 ,  B41J2/165 ,  B41J2/04 ,  H05K1/14 ,  H04N101/00

CPC分类号： B41J2/175 ,  B41J2/14 ,  B41J2/14427 ,  B41J2/16 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2/1637 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2/1648 ,  B41J2/16585 ,  B41J2/17503 ,  B41J2/17513 ,  B41J2/17546 ,  B41J2/17596 ,  B41J3/445 ,  B41J11/0005 ,  B41J11/70 ,  B41J15/04 ,  B41J15/044 ,  B41J29/02 ,  B41J2002/041 ,  B41J2002/14491 ,  B41J2202/21 ,  B42D15/02 ,  B42D25/00 ,  B42D25/20 ,  B42D25/23 ,  B42D2035/08 ,  B42D2035/34 ,  B42D2035/50 ,  B82Y30/00 ,  G03B17/02 ,  G03B27/00 ,  G03B27/02 ,  G06F1/1626 ,  G06F3/12 ,  G06F12/0866 ,  G06F21/79 ,  G06F21/86 ,  G06F2212/2022 ,  G06F2221/2129 ,  G06K1/121 ,  G06K7/10722 ,  G06K7/14 ,  G06K7/1417 ,  G06K19/06037 ,  G06K19/073 ,  G06T1/20 ,  G06T3/0006 ,  G07F7/08 ,  G07F7/086 ,  G07F7/12 ,  G09G2300/026 ,  G09G2310/0281 ,  G11C11/56 ,  G11C16/22 ,  H01L23/576 ,  H01L2924/0002 ,  H04N1/00127 ,  H04N1/00278 ,  H04N1/00326 ,  H04N1/00355 ,  H04N1/0044 ,  H04N1/00965 ,  H04N1/00968 ,  H04N1/04 ,  H04N1/2112 ,  H04N1/2154 ,  H04N1/2307 ,  H04N1/32122 ,  H04N1/32133 ,  H04N5/225 ,  H04N5/2628 ,  H04N5/335 ,  H04N9/045 ,  H04N2101/00 ,  H04N2201/0008 ,  H04N2201/0084 ,  H04N2201/3222 ,  H04N2201/3242 ,  H04N2201/3261 ,  H04N2201/3264 ,  H04N2201/3269 ,  H04N2201/3276 ,  H04N2201/328 ,  H05K1/14 ,  H05K1/189 ,  Y10S358/9091 ,  H01L2924/00

摘要： A portable handheld device includes an image sensor for capturing an image; an orientation sensor for determining a rotation of the image sensor; and a system-on-chip processor having integrated on a common wafer a CPU for processing a script language, a multi-core processor for processing an image captured by the image sensor, and a common synchronization register. The multi-core processor includes multiple processing units connected in parallel by a crossbar switch. Each processing unit stores one or more synchronization bits for identifying which of the other processing units are functioning as a single process therewith. The common synchronization register contains therein synchronization bits from each of the processing units.

摘要翻译： 便携式手持装置包括用于捕获图像的图像传感器; 用于确定图像传感器的旋转的方向传感器; 以及集成在公共晶片上的用于处理脚本语言的CPU的芯片上系统处理器，用于处理由图像传感器捕获的图像的多核处理器和公共同步寄存器。 多核处理器包括由交叉开关并联连接的多个处理单元。 每个处理单元存储一个或多个同步位，用于识别其他处理单元中的哪个作为其中的一个处理。 公共同步寄存器包含来自每个处理单元的同步位。

公开(公告)号：US08925835B2

公开(公告)日：2015-01-06

申请号：US12422690

申请日：2009-04-13

申请人： Ming Fang ,  Fuchao Wang

发明人： Ming Fang ,  Fuchao Wang

IPC分类号： B05B1/24 ,  B41J2/16 ,  B41J2/14

CPC分类号： B41J2/1601 ,  B41J2/14056 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/1437 ,  B41J2202/16 ,  Y10T137/6416

摘要： A method that includes forming a chamber in a substrate, forming a silicon layer overlying the chamber, etching the silicon layer to remove selected regions and retain a selected portion overlying the chamber, the selected portion being at a location and having dimensions that correspond to a location and to dimensions of a nozzle, and forming a first metal layer adjacent to the selected portion. The method also includes forming a path in the substrate to expose the chamber concurrently with removing the selected portion of the silicon layer to expose the nozzle, the nozzle being in fluid communication with the path, the chamber, and a surrounding environment.

摘要翻译： 一种方法，其包括在衬底中形成腔室，形成覆盖在所述腔室上的硅层，蚀刻所述硅层以去除所选择的区域并且保持覆盖所述腔室的选定部分，所述选定部分位于并且具有对应于 位置和尺寸，以及形成与选定部分相邻的第一金属层。 该方法还包括在衬底中形成路径以同时去除硅层的选定部分以暴露喷嘴，喷嘴与路径，腔室和周围环境流体连通。

公开(公告)号：US20140292937A1

公开(公告)日：2014-10-02

申请号：US14231502

申请日：2014-03-31

申请人： Canon Kabushiki Kaisha

发明人： Mitsuru Chida ,  Kenji Fujii ,  Makoto Watanabe ,  Toshiaki Kurosu ,  Masataka Nagai ,  Takanobu Manabe

IPC分类号： B41J2/04 ,  B41J2/16

CPC分类号： B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2002/14387 ,  Y10T29/49162

摘要： An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.

摘要翻译： 一种喷墨记录头，包括具有多个排出能量产生元件并具有供墨口的基板，设置在该基板上并构造成保护与排出能量产生元件连接的布线的保护膜，以及一个喷墨口形成件 其特征在于，所述保护膜具有突出部，所述喷墨口形成部件具有梁状突起，所述梁状突起具有加强肋，在所述突出部的部分形成有含金的分离膜， 部分和加强筋彼此紧密接触。

公开(公告)号：US08827429B2

公开(公告)日：2014-09-09

申请号：US13401888

申请日：2012-02-22

申请人： Osamu Koseki

发明人： Osamu Koseki

IPC分类号： B41J2/045 ,  H01L41/22 ,  H04R17/00

CPC分类号： B41J2/1609 ,  B41J2/14209 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646

摘要： In a method of manufacturing a liquid jet head, a piezoelectric substrate is bonded onto a first base. Ejection grooves for ejection channels and dummy grooves for dummy channels are alternately formed in parallel with one another. The ejection grooves and the dummy grooves have such a depth as to pierce the piezoelectric substrate and to reach the first base substrate. An electrode material is deposited on inner surfaces of the ejection grooves and the dummy grooves. A cover plate is bonded to the piezoelectric substrate so as to cover the ejection grooves and the dummy grooves. In a subsequent first base substrate removing step, a part of the first base substrate on a side opposite to the cover plate and the electrode material deposited on bottom surfaces of the dummy grooves are removed. A second base substrate is then bonded to the first base substrate.

摘要翻译： 在液体喷射头的制造方法中，将压电基板接合在第一基底上。 用于喷射通道的喷射槽和用于虚拟通道的虚拟槽彼此平行地交替地形成。 喷射槽和虚拟槽具有刺穿压电基板并到达第一基底的深度。 电极材料沉积在喷射槽和虚拟槽的内表面上。 盖板结合到压电基板上以覆盖喷射槽和虚拟槽。 在随后的第一基底去除步骤中，去除与盖板相对的一侧上的第一基底基板的一部分和沉积在虚拟凹槽的底表面上的电极材料。 然后将第二基底接合到第一基底。