-
公开(公告)号：US09801277B1
公开(公告)日：2017-10-24
申请号：US14455772
申请日：2014-08-08
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed , David Geiger , Murad Kurwa
CPC classification number: H05K1/14 , H01R12/52 , H05K1/0271 , H05K3/0085 , H05K3/241 , H05K3/303 , H05K3/3426 , H05K3/3436 , H05K3/4015 , H05K2201/04 , H05K2201/068 , H05K2201/10734 , H05K2201/10946 , H05K2201/10984 , H05K2201/2045 , H05K2203/0338 , H05K2203/0723
Abstract: A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.
-
公开(公告)号：US09661756B1
公开(公告)日：2017-05-23
申请号：US14455642
申请日：2014-08-08
Applicant: Flextronics AP, LLC
Inventor： Jennifer Nguyen , David Geiger , Anwar Mohammed , Murad Kurwa
CPC classification number: H05K3/244 , G06K19/07754 , H01L23/5386 , H01L24/65 , H01L25/00 , H01L2924/38 , H01M6/40 , H04B1/3816 , H05K1/097 , H05K1/111 , H05K3/30 , H05K3/40
Abstract: Embodiments of the present invention relate to nano-copper pillar interconnects. Nano-copper material is a mixture of nano-copper particles and one or more organic fluxes. In some embodiments, the one or more organic fluxes include organic solvents that help bind the nano-copper particles together and allow the nano-copper material to be printable. The nano-copper material is applied onto bond pads on a printed circuit board (PCB) via a printing process, a dipping process or the like, to form nano-copper covered PCB bond pads. A component can thereafter be coupled with the PCB at the nano-copper covered PCB bond pads. What is left when the solvents evaporate are nano-copper pillar interconnects that form, coupling the component with the PCB bond pads. The nano-copper pillar interconnects are of pure copper.
-
公开(公告)号：US09609738B1
公开(公告)日：2017-03-28
申请号：US14560807
申请日：2014-12-04
Applicant: Flextronics AP, LLC
Inventor： Dennis Willie , Richard Loi , David Geiger , Anwar Mohammed , Murad Kurwa , Hector Rene Marin Hernandez
CPC classification number: H05K1/0201 , H01L23/373 , H05K1/0203 , H05K1/0204 , H05K1/115 , H05K1/181 , H05K3/3494 , H05K7/20209 , H05K7/2039 , H05K2201/0323 , H05K2201/06 , H05K2201/062 , H05K2201/10371 , H05K2203/304
Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology. The formed graphite sheet is shaped to selective direct impinging heat. The heat can be directly away from the entire electronic component. Alternatively, the heat can be selectively directed away from some portions of the electronic component and toward other portions of the electronic component.
-
24.发明授权Fast cure conductive epoxy attach methodology for high speed automated processes 有权快速固化导电环氧树脂附着方法用于高速自动化工艺公开(公告)号：US09566764B1
公开(公告)日：2017-02-14
申请号：US14579631
申请日：2014-12-22
Applicant: Flextronics AP, LLC
Inventor： Anwar Mohammed , Weifeng Liu , David Geiger , Dennis Willie , Gervasio Mutarelli , Murad Kurwa
CPC classification number: B32B7/14 , B32B7/12 , B32B9/005 , B32B9/04 , B32B9/045 , B32B27/08 , B32B37/06 , B32B37/1207 , B32B37/18 , B32B2255/26 , B32B2307/202 , B32B2309/02 , B32B2363/00 , B32B2457/00 , B32B2457/08 , F16B11/006 , H05K3/305 , H05K3/321 , H05K3/36
Abstract: Two substrates are mechanically and electrically coupled together using a combination of a fast cure electrically non-conductive epoxy for mechanical attachment and a slow cure electrically conductive epoxy for electrical interconnects. The two epoxies are selectively applied between the two substrates as a stack, and the stack is subjected to a temperature that is sufficient to cure the fast cure electrically non-conductive epoxy in a short period of time but does not damage the substrates or components coupled thereto. In some applications, the temperature is less than 100 degrees Celsius and the time period is less than 5 seconds. The stack is removed from the heat and the slow cure electrically conductive epoxy continues to cure over a longer second period of time, such as a few hours to a day.
Abstract translation: 使用用于机械附接的快速固化非导电环氧树脂和用于电互连的缓慢固化导电环氧树脂的组合将两个基底机械和电耦合在一起。 两个环氧树脂作为叠层选择性地施加在两个基板之间，并且堆叠体经历足够的温度以在短时间段内固化快速固化的非导电环氧树脂，但不会损坏耦合的基板或部件 到此。 在一些应用中，温度低于100摄氏度，时间段小于5秒。 堆叠从热量中除去，慢固化导电环氧树脂在更长的第二时间段内继续固化，例如几小时至一天。
-
25.发明授权公开(公告)号：US09449942B1
公开(公告)日：2016-09-20
申请号：US14803803
申请日：2015-07-20
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Murad Kurwa , Anwar Mohammed , Zhen Feng
CPC classification number: H01L24/42 , G06K19/027 , G06K19/07752 , G06K19/07754 , G06K19/07758 , H01L21/28 , H01L2224/32225
Abstract: A method for making a Radio Frequency Identification (RFID) device on fabric is described herein. In a first example, an RFID semiconductor chip is attached to a piece of fabric. The RFID semiconductor chip includes two terminals. A solid wire is stitched into the fabric making an RFID antenna. The solid wire is attached to the terminals of the RFID semiconductor chip. In a second example, a metal wire is selected. The metal wire is stitched into fabric making an RFID antenna. The metal wire includes two ends and a conductive adhesive is applied to two ends of the metal wire. An RFID semiconductor chip is attached to the fabric. The RFID semiconductor chip includes two terminals and the RFID semiconductor chip is attached to the fabric at the two terminals. The conductive adhesive is cured. In both examples, the wire and the RFID semiconductor chip are encapsulated in fabric.
Abstract translation: 本文描述了一种在织物上制作射频识别（RFID）设备的方法。 在第一示例中，将RFID半导体芯片附接到一块织物上。 RFID半导体芯片包括两个端子。 将实线焊接到制造RFID天线的织物中。 实芯线连接到RFID半导体芯片的端子。 在第二示例中，选择金属线。 将金属线缝合成制造RFID天线的织物。 金属线包括两端，并且导电粘合剂被施加到金属线的两端。 RFID半导体芯片附着在织物上。 RFID半导体芯片包括两个端子，并且RFID半导体芯片在两个端子处附接到织物。 导电粘合剂固化。 在这两个例子中，电线和RFID半导体芯片被封装在织物中。
-
Patent Agency Ranking
公开(公告)号：US09397065B1
公开(公告)日：2016-07-19
申请号：US14468216
申请日：2014-08-25
Applicant: Flextronics AP, LLC
Inventor： Jennifer Nguyen , David Geiger , Ranilo Aranda , Jonas Sjoberg , Anwar Mohammed , Murad Kurwa
IPC: H01L23/544 , H01L23/00 , H01L25/00 , H01L23/538
CPC classification number: H05K3/244 , G06K19/07754 , H01L23/5386 , H01L24/65 , H01L25/00 , H01L2924/38 , H01M6/40 , H04B1/3816 , H05K1/097 , H05K1/111 , H05K3/30 , H05K3/40
Abstract: Embodiments of the present invention relate to a fixture design for pre-attachment package on package component assembly. The fixture design includes a plurality of pockets arranged in a N×M array. The plurality of pockets is sized to receive bottom packages. The fixture design includes global fiducials that are used to locate positions of the pockets on the fixture, and sets of local fiducials, with each set being specific to one of the pockets and used to refine the position of the location of a corresponding pocket. Each of the pockets can include one or more ear cuts for easy component placement and component removal. The fixture design can include a vacuum port for coupling with a vacuum source for drawing a vacuum to hold the bottom packages down. The fixture design can also include a cover that is used with the fixture to keep the components from being disturbed.
Abstract translation: 本发明的实施例涉及一种用于包装部件组件上的预附接包装的夹具设计。 夹具设计包括以N×M阵列排列的多个口袋。 多个口袋的尺寸适于接纳底部包装。 夹具设计包括用于定位夹具上的凹穴的位置的全局基准和局部基准的集合，其中每一组特定于其中一个凹穴并且用于细化相应凹穴的位置的位置。 每个口袋可以包括一个或多个耳朵切口，便于元件放置和元件移除。 夹具设计可以包括用于与真空源耦合的真空端口，用于抽真空以将底部包装件向下保持。 夹具设计还可以包括与夹具一起使用以防止部件受到干扰的盖子。
-
公开(公告)号：US10231333B1
公开(公告)日：2019-03-12
申请号：US14307201
申请日：2014-06-17
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed , David Geiger , Murad Kurwa
Abstract: Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the plated through hole and forming the copper interconnect by sintering at a temperature below the melting of the copper.
-
公开(公告)号：US09736932B1
公开(公告)日：2017-08-15
申请号：US14601072
申请日：2015-01-20
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Murad Kurwa
CPC classification number: H05K1/0284 , H01L24/00 , H05K3/103 , H05K2201/10356 , H05K2203/107 , H05K2203/1469 , Y10T29/49162
Abstract: A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.
-
公开(公告)号：US09674950B1
公开(公告)日：2017-06-06
申请号：US14268775
申请日：2014-05-02
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more metal foils, one metal foil coupled to one electrical connection point on an electronic component. The metal foil is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the metal foil.
-
公开(公告)号：US09659359B1
公开(公告)日：2017-05-23
申请号：US14704822
申请日：2015-05-05
Applicant: Flextronics AP, LLC
Inventor： Zhen Feng , Weifeng Liu , David Geiger , Anwar Mohammed , Murad Kurwa
CPC classification number: G06T7/0004 , G01N21/9501 , G01N21/956 , G01N2021/95646 , G06T11/206 , G06T2207/30152
Abstract: Methods of and Devices for quality control that can be used with automated optical inspection (AOI), solder paste inspection (SPI), and automated x-ray inspection (AXI) are disclosed. Plurality of threshold settings are entered in a testing process. Multiple testing results are obtained from the testing process. A graphic presentation is generated showing the numerical relationship among the data points, such that a quality control person is able to fine-tune the testing process to have a predetermined ratio of Defect Escaped % to False Call ppm.
-
-
-
-
-
-
-
-
-
Search Results
35
records
(took 0.012 seconds)
