公开(公告)号：US10214903B2

公开(公告)日：2019-02-26

申请号：US14680379

申请日：2015-04-07

Applicant: Adam Cohen

Inventor： Adam Cohen

IPC: E04C2/296 ,  E02D27/01 ,  F16M13/02 ,  G06Q30/06 ,  G06Q10/08 ,  E04B1/70

Abstract: Prefabricated exterior panels and slab foundation systems are disclosed for use in an integrated simple design procedure for use in low-energy use buildings. The panels include a frame formed from conventional framing methods, an inner layer of sheathing fastened to an outer side of the frame, a layer of insulation adhered to an outer surface of the inner layer of sheathing without using fasteners, and an outer layer of sheathing adhered to an outer surface said layer of insulation without using fasteners. Sets of panels are formed with openings for windows or doors. Jigs are used for constructing the panels including corner panels.

公开(公告)号：US20080108221A1

公开(公告)日：2008-05-08

申请号：US11931308

申请日：2007-10-31

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01L21/44

CPC classification number: C25D1/00 ,  C25D1/003 ,  C25D7/123

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

公开(公告)号：US20070256480A1

公开(公告)日：2007-11-08

申请号：US11775316

申请日：2007-07-10

Applicant: Charles Black ,  Adam Cohen ,  Christopher Murray ,  Robert Sandstrom

Inventor： Charles Black ,  Adam Cohen ,  Christopher Murray ,  Robert Sandstrom

IPC: G01B5/28

CPC classification number: G01Q70/16 ,  G01Q70/14 ,  Y10S977/924 ,  Y10T428/254

Abstract: A structure and method for improving the spatial resolution of a scanning probe microscope (SPM) tip, which has been coated with a layer of chemically-synthesized nanoparticles. The nanoparticles are either single-species or heterogeneous, such that the single-species nanoparticles can be either ferromagnetic, paramagnetic, superparamagnetic, antiferromagnetic, ferrimagnetic, magneto-optic, ferroelectric, piezoelectric, superconducting, semiconducting, magnetically-doped semiconducting, insulating, fluorescent, or chemically catalytic. The layer of nanoparticles is at least two nanoparticles thick, or alternatively, is a single layer of nanoparticles thick, or alternatively, is a single layer of nanoparticles thick and covers only the tip apex portion of the tip, or alternatively, only a single nanoparticle is affixed to the tip apex. Alternatively, the layer of nanoparticles is transformed into an electrically-continuous magnetic film by annealing at a high temperature.

Abstract translation: 用于改善扫描探针显微镜（SPM）尖端的空间分辨率的结构和方法，其已经涂覆有化学合成的纳米颗粒层。 纳米颗粒是单种或非均质的，使得单种纳米颗粒可以是铁磁性，顺磁性，超顺磁性，反铁磁性，亚铁磁性，磁光学，铁电体，压电，超导，半导体，磁掺杂半导体，绝缘，荧光 ，或化学催化。 纳米颗粒层是至少两个纳米颗粒厚度，或者可选地，是单层纳米颗粒的厚度，或者可选地，单层纳米颗粒是厚的，并且仅覆盖尖端的顶端部分，或者仅仅是单个纳米颗粒 贴在尖端顶端。 或者，通过在高温下退火将纳米颗粒层转变成电连续的磁性膜。

公开(公告)号：US20070221505A1

公开(公告)日：2007-09-27

申请号：US11680596

申请日：2007-02-28

Applicant: Adam Cohen

Inventor： Adam Cohen

IPC: C25D5/02

CPC classification number: B81C1/00126 ,  B81C1/00246 ,  B81C2201/019 ,  B81C2201/053 ,  B81C2203/0735 ,  C25D1/003 ,  C25D5/022 ,  H01L21/2885 ,  H01L21/76885 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00

Abstract: Enhanced Electrochemical fabrication processes are provided that can form three-dimensional multi-layer structures using semiconductor based circuitry as a substrate. Electrically functional portions of the structure are formed from structural material (e.g. nickel) that adheres to contact pads of the circuit. Aluminum contact pads and silicon structures are protected from copper diffusion damage by application of appropriate barrier layers.

Abstract translation: 提供了增强的电化学制造工艺，其可以使用基于半导体的电路作为衬底形成三维多层结构。 结构的电功能部分由粘附到电路的接触垫的结构材料（例如镍）形成。 铝接触焊盘和硅结构通过施加适当的阻挡层来保护铜扩散损坏。

公开(公告)号：US20070205374A1

公开(公告)日：2007-09-06

申请号：US11636147

申请日：2006-12-07

Applicant: Richard Chen ,  Vacit Arat ,  Chris Folk ,  Adam Cohen

Inventor： Richard Chen ,  Vacit Arat ,  Chris Folk ,  Adam Cohen

IPC: G01K1/08 ,  H01J3/14

CPC classification number: G01R1/0483 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.

Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及两部分探针元件，可插座探针及其安装件的各种设计。 一些实施例涉及制造这种探针和支架的方法。 在一些实施例中，例如，探针在安装结构中具有滑动，在安装结构中扭转，包括柔顺元件的安装结构等。

公开(公告)号：US20070181430A1

公开(公告)日：2007-08-09

申请号：US11622279

申请日：2007-01-11

Applicant: Adam Cohen

Inventor： Adam Cohen

IPC: C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US20060286829A1

公开(公告)日：2006-12-21

申请号：US11028962

申请日：2005-01-03

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

IPC: H01R12/00

CPC classification number: G01R3/00 ,  G01R1/06744 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US20060283712A1

公开(公告)日：2006-12-21

申请号：US11441578

申请日：2006-05-26

Applicant: Adam Cohen

Inventor： Adam Cohen

IPC: C25D5/02

CPC classification number: C25D1/003 ,  B33Y10/00

Abstract: Multi-layer fabrication methods (e.g. electrochemical fabrication methods) for forming microscale and mesoscale devices or structures (e.g. turbines) provide bushings or roller bearing that allow rotational or linear motion which is constrained by multiple structural elements spaced from one another by gaps that are effectively less than minimum features sizes associated with the individual layers used to form the structures. In some embodiments, features or protrusions formed on different layers on opposing surfaces are offset along the axis of layer stacking so as to bring the features into positions that are closer than allowed by the minimum features sizes associated with individual layers. In other embodiments, interference is used to create effective spacings that are less than the minimum features sizes.

Abstract translation: 用于形成微尺寸和中尺度装置或结构（例如涡轮机）的多层制造方法（例如电化学制造方法）提供衬套或滚子轴承，其允许由多个结构元件约束的旋转或线性运动，这些结构元件通过有效的间隙彼此间隔开 小于与用于形成结构的各个层相关联的最小特征尺寸。 在一些实施例中，形成在相对表面上的不同层上的特征或突起沿着层堆叠的轴线偏移，以便使特征进入比由与各个层相关联的最小特征尺寸允许的位置更近的位置。 在其他实施例中，使用干涉来产生小于最小特征尺寸的有效间隔。

公开(公告)号：US20060112550A1

公开(公告)日：2006-06-01

申请号：US11178145

申请日：2005-07-07

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01R43/00

CPC classification number: C25D1/003 ,  G01R3/00 ,  Y10T29/49222

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

公开(公告)号：US20060108678A1

公开(公告)日：2006-05-25

申请号：US11173241

申请日：2005-06-30

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC: H01L23/48

CPC classification number: B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract translation: 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。 在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。 一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。 一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。 保留材料可以用作焊接掩模材料。