DRIVING SUBSTRATE, LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220336426A1

    公开(公告)日:2022-10-20

    申请号:US17760627

    申请日:2021-05-18

    Abstract: Provided are a driving substrate, a light emitting apparatus and a manufacturing method therefor, which relate to the technical field of display. According to the present disclosure, a rigid substrate, a debonding layer, a first buffer layer, an organic material layer, a second buffer layer and a wiring layer are sequentially arranged in layer configuration in a component disposing area and a circuit board binding area, and the first buffer layer, an overlapping electrode layer, the organic material layer and the second buffer layer are sequentially arranged in layer configuration in a bending area. Two ends of the overlapping electrode layer respectively extend to the component disposing area and the circuit board binding area, and the wiring layer of the component disposing area and the wiring layer of the circuit board binding area are respectively connected to the overlapping electrode layer through via holes.

    Semiconductor apparatus, pixel circuit and control method thereof

    公开(公告)号:US11475833B2

    公开(公告)日:2022-10-18

    申请号:US16767351

    申请日:2019-12-18

    Abstract: The present application discloses a semiconductor apparatus, a pixel circuit and a control method thereof. The semiconductor apparatus comprises: an active layer; a first insulating layer; a first gate and a second gate overlapping with a portion of the active layer with the first insulating layer interposed therebetween, respectively; a first electrode, a second electrode and a third electrode, the first electrode and the second electrode are electrically connected with a first portion and a second portion of the active layer, respectively, the third electrode is used to be electrically connected with a photosensitive device, wherein the third electrode is electrically connected with the first gate or the second gate; or the third electrode is electrically connected with a third portion of the active layer.

    Thin film transistor and method for fabricating the same, array substrate and display device

    公开(公告)号:US11289513B2

    公开(公告)日:2022-03-29

    申请号:US16074282

    申请日:2018-01-19

    Abstract: A thin film transistor and a method for fabricating the same, an array substrate and a display device are provided. The thin film transistor includes an active layer and a protective layer being provided on and in direct contact with the active layer, the protective layer is provided corresponding to a channel region of the thin film transistor; the protective layer is made of an oxygen-enriched metallic oxide insulation material which will not introduce any new element into the active layer. In the thin film transistor and the method for fabricating the same, the array substrate and the display device provided by the present disclosure, the active layer can be protected from being damaged by the etchant for forming the source/drain, and no new element will be introduced into the active layer; thus the characteristics and the stability of the thin film transistor is improved.

    Array substrate and manufacturing method thereof, and display device

    公开(公告)号:US11133363B2

    公开(公告)日:2021-09-28

    申请号:US16556342

    申请日:2019-08-30

    Abstract: The present discloses an array substrate and a manufacturing method thereof, and a display device. The array substrate includes a first transistor and a second transistor. The first transistor includes a first active layer, a first gate, a first source and a first drain. The second transistor includes a second active layer, a second gate, a second source and a second drain. An orthographic projection of the second source on the base substrate and an orthographic projection of the second drain on the base substrate at least partially overlap. One of the second source and the second drain is in the same layer as and made from the same material as the first gate. The first source and the first drain are in the same layer as and made from the same material as the other of the second source and the second drain.

    Method of fabricating array substrate, array substrate and display device

    公开(公告)号:US11043514B2

    公开(公告)日:2021-06-22

    申请号:US16486990

    申请日:2018-12-11

    Inventor: Wei Yang Xinhong Lu

    Abstract: A method of fabricating an array substrate, an array substrate, and a display device is disclosed. The array substrate comprises a display area and a wiring area. The display area is disposed with a first thin film transistor and a second thin film transistor. A distance between a first active layer of the first thin film transistor and a substrate is different from a distance between a second active layer of the second thin film transistor and the substrate. The first thin film transistor comprises first vias that receive a first source/drain. The second thin film transistor includes second vias that receives a second source/drain. The wiring area is provided with a groove. The groove comprises a first sub-groove and a second sub-groove that are stacked. The method includes simultaneously forming the first vias and the first sub-groove, and simultaneously forming the second vias and the second sub-groove.

    OLED DISPLAY PANEL AND DISPLAY DEVICE

    公开(公告)号:US20250120298A1

    公开(公告)日:2025-04-10

    申请号:US18985350

    申请日:2024-12-18

    Abstract: The present disclosure relates to an OLED display panel and display device. The OLED display panel includes: a display area, a bending area and a bonding area, the display panel further includes: a base substrate; a first semiconductor pattern on the base substrate; a first insulating layer group on the first semiconductor pattern; a second semiconductor pattern on the first insulating layer group; a second insulating layer group on the second semiconductor pattern; first via holes in the first insulating layer group and the second insulating layer group; second via holes in the second insulating layer group, the display panel further includes: a metal trace, located on a side of the second insulating layer group away from the base substrate, and configured to connect a trace in the display area to a circuit board of the bending area; and a second source electrode and/or a second drain electrode.

    Driving substrate, manufacturtion method thereof and display device

    公开(公告)号:US12183867B2

    公开(公告)日:2024-12-31

    申请号:US17628926

    申请日:2021-03-10

    Abstract: The present disclosure provides a driving substrate, including: a flexible substrate including a display region and a bendable region; a first conductive layer on the flexible substrate and including a first wire in the display region, and a connection wire at least partially in the bendable region; a flexible insulating layer including a first insulation pattern in the display region, and a second insulation pattern in the bendable region; a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region, wherein a thickness of a portion of the second insulating pattern covering the connection wire is d2, a thickness of the flexible substrate is d3, and d2≥2 μm and |d2−d3|≤3 μm.

    DRIVE SUBSTRATE AND PREPARATION METHOD THEREFOR, AND LIGHT-EMITTING APPARATUS

    公开(公告)号:US20240313007A1

    公开(公告)日:2024-09-19

    申请号:US18274897

    申请日:2022-07-01

    CPC classification number: H01L27/1248 H01L27/1259 H01L25/167

    Abstract: A driving base plate includes a functional region (A) and a peripheral region (B) surrounding the functional region (A). Both the functional region (A) and the peripheral region (B) include a supporting substrate, and the functional region (A) further includes a flexible substrate and at least one protecting layer that are sequentially arranged on the supporting substrate. The region of the orthographic projection of the flexible substrate on the supporting substrate is located within the region where the supporting substrate within the functional region (A) is located, and the protecting layer covers the surface of the flexible substrate further from the supporting substrate and the side of the flexible substrate close to the peripheral region (B). The adhesive force between the flexible substrate and the supporting substrate of the driving base plate is increased, and the reliability of the products manufactured by using the driving base plate is improved.

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