Abstract:
A vacuum adsorbing workbench and a vacuum adsorbing device are provided. The vacuum adsorbing workbench includes a workbench body, a first suction tube and an occluder. The workbench body is provided with multiple suction holes. Each suction hole is in communication with the first suction tube. The occluder is able to be connected with the first suction tube cooperatively to cut off communication between each suction hole and the first suction tube.
Abstract:
A transfer apparatus includes a supporting member, a free electron excitation device and a detection device; the free electrons excitation device is configured to excite semiconductor material of an object to be transferred to generate free electrons, and the detection device is configured to detect whether material of a surface of the transferred object in contact with the support surface of the supporting member is conductive under excitation by the free electron excitation device. A laser annealing apparatus comprising the transfer apparatus is further provided.
Abstract:
Embodiments of the disclosure disclose a transistor with floating gate electrode, a manufacturing method thereof, an application method thereof and a display driving circuit. The transistor with floating gate electrode includes a substrate (1), and a floating gate electrode (3), a source electrode (4), a drain electrode (5) and a control gate electrode (6) disposed on the substrate (1). The transistor with floating gate electrode further comprises a first insulating film (7) and a polysilicon film (8) that are sequentially disposed on the substrate (1), and a channel region (2) is formed in the polysilicon film (8) at a position corresponding to the floating gate electrode (3).
Abstract:
A display panel includes a plurality of driving base plates stacked, each of the driving base plates includes a substrate and a driving unit located on the substrate, orientations of the driving base plates are the same; a plurality of pixel units arranged in an array, each of the pixel units includes a plurality of sub-pixels, and orthographic projections on the substrate of light emitting regions of the sub-pixels in the same pixel unit do not overlap with each other; and each of the driving base plates is provided with at least one sub-pixel on one side away from the substrate, and the driving unit on each of the driving base plates is electrically connected to the at least one sub-pixel; and a quantity of the driving base plates is less than or equal to a quantity of the sub-pixels in one of the pixel units.
Abstract:
A vacuum adsorbing workbench and a vacuum adsorbing device are provided. The vacuum adsorbing workbench includes a workbench body, a first suction tube and an occluder. The workbench body is provided with multiple suction holes. Each suction hole is in communication with the first suction tube. The occluder is able to be connected with the first suction tube cooperatively to cut off communication between each suction hole and the first suction tube.
Abstract:
The embodiments of the invention disclose a device for film thickness measurement and a method for film thickness measurement. The device comprises a planar indenter, a collecting unit and a processing unit. The planar indenter comprises a base plate and a piezoelectric film layer. The collecting unit comprises a plurality of collecting circuits evenly distributed above the piezoelectric film layer and spaced from each other. The collecting circuits are used for collecting current signals generated when the piezoelectric film layer deforms at positions corresponding to the collecting circuits. The processing unit is used for calculating a film thickness of the film sample to be measured based on the current signals collected by each of the collecting circuits.
Abstract:
The present disclosure provides a silicon-based mask, a manufacturing method, and a display panel. The silicon-based mask includes a first silicon wafer and a second silicon wafer laminated one on another. The first silicon wafer includes a first via hole, the second silicon wafer includes a second via hole, an orthogonal projection of a wall of the first via hole onto the second silicon wafer surrounds the second via hole, and under a same etching condition, an etching rate of the second silicon wafer is smaller than an etching rate of the first silicon wafer.
Abstract:
An array substrate is provided. The array substrate includes a plurality of subpixels. A respective subpixel of the plurality of subpixels includes a first transistor. The first transistor includes a gate electrode; a first electrode on the gate electrode; a semiconductor material layer on a side of the first electrode away from the gate electrode; a second electrode on a side of the semiconductor material layer away from the first electrode; an organic layer on a side of the second electrode away from the semiconductor material layer; and a third electrode on a side of the organic layer away from the second electrode. An orthographic projection of the second electrode on a base substrate at least partially overlaps with an orthographic projection of the organic layer on the base substrate.
Abstract:
A manufacturing method of a template includes: providing a base; forming a photoresist pattern on the base and patterning the base by using the photoresist pattern as a mask, and the forming the photoresist pattern includes: forming a plurality of first patterns spaced apart from each other on the base; forming a first material layer on the plurality of first patterns; patterning the at least one first pattern by using the first material layer as a mask so that the first pattern is formed into at least one first sub-pattern; and removing the first material layer; and the first material layer at least cover one side of at least one of the plurality of first patterns in a direction perpendicular to a surface on which the base is located.
Abstract:
The present disclosure provides a display substrate, a fabricating method thereof, and a display device. The method includes forming a light shielding layer on a surface of a base substrate, and forming a plurality of thin film transistors on a side of the light shielding layer away from the base substrate. Forming a plurality of thin film transistors on a side of the light shielding layer away from the base substrate includes forming a semiconductor layer at a position where an active layer is to be formed in each of the plurality of thin film transistors, generating heat using the light shielding layer, and utilizing the heat to crystallize the semiconductor layer.