公开(公告)号：US20100044880A1

公开(公告)日：2010-02-25

申请号：US12428273

申请日：2009-04-22

申请人： Isamu AOKURA ,  Takashi YUI ,  Toshitaka AKAHOSHI

发明人： Isamu AOKURA ,  Takashi YUI ,  Toshitaka AKAHOSHI

IPC分类号： H01L23/48

CPC分类号： H05K1/0271 ,  H01L23/13 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09036 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes a multilayer wiring substrate having a plurality of inner wiring layers and a semiconductor chip mounted on the multilayer wiring substrate. The multilayer wiring substrate has a groove formed in the bottom surface. The groove does not reach the lowermost of the inner wiring layers.

摘要翻译： 半导体器件包括具有多个内部布线层的多层布线基板和安装在多层布线基板上的半导体芯片。 多层布线基板在底面形成有槽。 凹槽不到达内部布线层的最下部。

公开(公告)号：US20080135975A1

公开(公告)日：2008-06-12

申请号：US11951441

申请日：2007-12-06

申请人： Yukiko Haraguchi ,  Takahiro Kumakawa ,  Takashi Yui ,  Kazumi Watase

发明人： Yukiko Haraguchi ,  Takahiro Kumakawa ,  Takashi Yui ,  Kazumi Watase

IPC分类号： H01L27/00 ,  H01L21/82

CPC分类号： H01L21/78

摘要： A modified layer 5 and an altered layer 8 are formed outside a dicing point of a dicing area 3. Thus without forming another interface between different physical properties on the dicing point, it is possible to prevent chipping from progressing along a crystal orientation from an interface between a semiconductor element 2 and a semiconductor substrate 1 and from a surface of the semiconductor element during dicing, thereby suppressing the development of chipping to the semiconductor element.

摘要翻译： 在切割区域3的切割点的外部形成改质层5和改质层8。 因此，在切割点之间不形成不同物理特性之间的另一界面，可以防止在切割期间从半导体元件2和半导体基板1之间的界面以及半导体元件的表面沿着晶体取向进行切屑， 从而抑制了对半导体元件的切屑的发展。

公开(公告)号：US07138706B2

公开(公告)日：2006-11-21

申请号：US10608295

申请日：2003-06-24

申请人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Kouichi Yamauchi ,  Yasutake Yaguchi

发明人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Kouichi Yamauchi ,  Yasutake Yaguchi

IPC分类号： H01L21/44

CPC分类号： H01L21/565 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/731 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.

摘要翻译： 提供具有优异的散热特性的半导体器件，其在安装在诸如蜂窝电话等的电子设备中时可以实现高可靠性及其制造方法。 半导体器件包括基板，通过在其上顶层叠一个而安装在基板上的多个半导体芯片以及由密封树脂制成的封装树脂层。 在多个半导体芯片中，作为最上半导体芯片的第一半导体芯片的表面安装有面向基板的电路，并且形成密封树脂层，使得至少第一半导体 芯片与形成电路的表面相对，并且第一半导体芯片的一部分侧表面暴露于封装树脂层的外部。

公开(公告)号：US07087455B2

公开(公告)日：2006-08-08

申请号：US10636595

申请日：2003-08-08

申请人： Toshiyuki Fukuda ,  Hiroaki Fujimoto ,  Mutsuo Tsuji ,  Takashi Yui ,  Yoshiaki Takeoka

发明人： Toshiyuki Fukuda ,  Hiroaki Fujimoto ,  Mutsuo Tsuji ,  Takashi Yui ,  Yoshiaki Takeoka

IPC分类号： H01L21/44

CPC分类号： H01L21/561 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48624 ,  H01L2224/4943 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01204 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/3512 ,  H01L2224/92247 ,  H01L2224/4554

摘要： A semiconductor device and a manufacturing method for the same are provided wherein the reliability of connections of fine metal wires connecting a second semiconductor chip to a wiring board can be improved in the case wherein the second semiconductor chip, which is located above the lower, first semiconductor chip, is significantly larger than the first semiconductor chip in a configuration wherein two semiconductor chips are stacked and mounted on a wiring board. In this semiconductor device the rear surface of the first semiconductor chip and the rear surface of the second semiconductor chip are adhered to each other by means of adhesive and the side of the adhesive is inclined from the edge portions of the first semiconductor chip toward the portions of the second semiconductor chip extending from the side of the first semiconductor chip. Therefore, it becomes possible to prevent the occurrence of microcracks in the second semiconductor chip and to prevent the occurrence of defective fine metal wire connections caused by the impact at the time of electrical connection of the second semiconductor chip to the wiring board.

摘要翻译： 提供了一种半导体器件及其制造方法，其中在第二半导体芯片位于下部第一半导体芯片的情况下，可以提高连接第二半导体芯片到布线板的细金属线的连接的可靠性 半导体芯片明显大于其中两个半导体芯片堆叠并安装在布线板上的配置中的第一半导体芯片。 在该半导体器件中，第一半导体芯片的后表面和第二半导体芯片的后表面通过粘合剂彼此粘合，并且粘合剂的侧面从第一半导体芯片的边缘部朝向部分 的第二半导体芯片从第一半导体芯片的侧面延伸。 因此，可以防止第二半导体芯片中的微裂纹的发生，并且防止由于第二半导体芯片与布线板的电连接时的冲击而引起的细小金属线连接不良的发生。

公开(公告)号：US20060091563A1

公开(公告)日：2006-05-04

申请号：US11282726

申请日：2005-11-21

申请人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Yasutake Yaguchi

发明人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Yasutake Yaguchi

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/85399 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a substrate having electrode pads, a first semiconductor chip mounted on the substrate with a first adhesion layer interposed therebetween, a second semiconductor chip mounted on the first semiconductor chip with a second adhesion layer interposed therebetween and having electrode pads on the upper surface thereof, wires for bonding the electrode pads of the substrate and the electrode pads of the second semiconductor chip to each other, and a mold resin sealing therein the first and second semiconductor chips and the wires. The peripheral edge portion of the first adhesion layer is protruding outwardly from the first semiconductor chip and the peripheral edge portion of the second semiconductor chip is protruding outwardly beyond the peripheral edge portion of the first semiconductor chip.

公开(公告)号：US20050178357A1

公开(公告)日：2005-08-18

申请号：US11049648

申请日：2005-02-04

申请人： Takashi Yui ,  Noboru Takagi ,  Kiyoo Hirose ,  Keizo Hiraku ,  Hirohiko Yamada

发明人： Takashi Yui ,  Noboru Takagi ,  Kiyoo Hirose ,  Keizo Hiraku ,  Hirohiko Yamada

IPC分类号： F02D9/02 ,  F02D13/02 ,  F02D29/02 ,  F02D41/00 ,  F02D41/08 ,  F02D43/00

CPC分类号： F02D41/083 ,  F01L1/185 ,  F01L13/0063 ,  F01L2001/0537 ,  F01L2105/00 ,  F01L2800/00 ,  F02D13/02 ,  F02D41/0002 ,  F02D41/086 ,  F02D41/1454 ,  F02D2200/023 ,  F02D2200/0404 ,  Y02T10/18 ,  Y02T10/42

摘要： An controller detects a change in a load generation state of an accessory device that generates a load on the internal combustion engine during operation, and the controller in turn controls a variable valve mechanism to change at least one of an operation angle and a valve lift of an intake valve of the internal combustion engine, as well as changing an amount of an intake air drawn into the internal combustion engine, in response to the detected change in the load generation state of the accessory device.

摘要翻译： 控制器检测在操作期间在内燃机上产生负载的附件装置的负载生成状态的变化，并且控制器进而控制可变气门机构以改变操作角和气门升程中的至少一个 内燃机的进气阀，以及响应于检测到的附件装置的负载产生状态的变化而改变吸入内燃机的进气量。

公开(公告)号：US06509638B2

公开(公告)日：2003-01-21

申请号：US09946363

申请日：2001-09-06

申请人： Hiroaki Fujimoto ,  Yoshinobu Kunitomo ,  Takashi Yui

发明人： Hiroaki Fujimoto ,  Yoshinobu Kunitomo ,  Takashi Yui

IPC分类号： H01L2302

CPC分类号： H01L25/0657 ,  H01L25/0652 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes: a wiring board; a first semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which is electrically connected to the wiring board via a raised electrode, the circuitry side of the first chip facing the principal surface of the wiring board; and a second semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which includes an external electrode on the circuitry side thereof. The non-circuitry sides of the first and second semiconductor chips are secured to each other. The external electrode of the second semiconductor chip is connected to the wiring board via a metal fine wire. The external and raised electrodes are so disposed as not to overlap each other as viewed vertically downward from over the principal surface of the wiring board.

摘要翻译： 一种半导体器件，包括：布线板; 第一半导体芯片，其具有垂直相对的电路侧和非电路侧，并且经由凸起电极电连接到布线板，第一芯片的电路侧面对布线板的主表面 ; 以及第二半导体芯片，其具有垂直彼此面对并且在其电路侧上包括外部电极的电路侧和非电路侧。 第一和第二半导体芯片的非电路侧彼此固定。 第二半导体芯片的外部电极通过金属细线连接到布线板。 外电极和凸起电极被布置为从布线板的主表面的垂直向下观察不彼此重叠。

公开(公告)号：US08022305B2

公开(公告)日：2011-09-20

申请号：US12428860

申请日：2009-04-23

申请人： Takashi Yui ,  Atsushi Saiki

发明人： Takashi Yui ,  Atsushi Saiki

IPC分类号： H05K1/00

CPC分类号： H05K3/0052 ,  H05K3/005 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/167 ,  Y10T29/4913

摘要： A semiconductor device fabrication method includes: forming an elongated hole 5 in a wiring board plate along a perimeter line 3 of a plurality of wiring board regions defined over the wiring board plate with a connecting portion left unremoved at a corner of each of the wiring board regions; mounting semiconductor elements on the wiring board regions; and cutting the connecting portion using a punch 8 to isolate the wiring board regions from the wiring board plate into wiring boards. Each of the wiring boards has a cut edge formed by the punch, the cut edge starting from an end of the elongated hole 5 provided on a first side of the perimeter line 3 and extending across part of the connecting portion inside the perimeter line 3, the cut edge being angled inward of the wiring board so as to slope downward from the end of the elongated hole 5.

摘要翻译： 半导体器件制造方法包括：沿着布线板板上限定的多个布线板区域的周边线3在布线板板上形成细长孔5，其中连接部分在左边未被移除在每个布线板的拐角处 区域; 将半导体元件安装在布线板区域上; 并使用冲头8切割连接部分，以将布线板区域与布线板板隔离成线路板。 每个布线板具有由冲头形成的切割边缘，切割边缘从设置在周边线3的第一侧上的细长孔5的端部开始并延伸穿过周边线3内的连接部分的一部分， 切割边缘从布线板向内倾斜，从而从细长孔5的端部向下倾斜。

公开(公告)号：US07298043B2

公开(公告)日：2007-11-20

申请号：US11375134

申请日：2006-03-15

申请人： Takashi Yui

发明人： Takashi Yui

IPC分类号： H01L23/367

CPC分类号： H01L23/3677 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device having a wiring substrate, a semiconductor element mounted on the wiring substrate via a heat sink, a wire electrically connecting the wiring substrate and the semiconductor element, the wiring substrate having through holes each connected to the wire or the heat sink, and external electrodes formed on a back surface of the wiring substrate and connected to the through holes. An insulating layer is formed between the heat sink and the semiconductor element, and the heat sink is divided into at least two sections. Hence, the back surface of the semiconductor element maintains an electrically disconnected state irrespective of the potential of the heat sink, and the heat dissipation design is allowed greater flexibility. Thus, the external electrodes connected to the heat sink via the through holes are connected to the mounting substrate wirings having satisfactory heat dissipation efficiency, allowing the heat of the semiconductor element to escape efficiently.

摘要翻译： 一种具有布线基板的半导体器件，经由散热器安装在布线基板上的半导体元件，将布线基板与半导体元件电连接的布线，具有各自与导线或散热片连接的通孔的布线基板，以及 外部电极形成在布线基板的背面并与通孔连接。 在散热片和半导体元件之间形成绝缘层，将散热片分成至少两个部分。 因此，与散热器的电位无关地，半导体元件的背面保持电断开状态，并且允许散热设计更大的灵活性。 因此，通过通孔连接到散热器的外部电极与具有令人满意的散热效率的安装基板布线连接，从而使半导体元件的热量有效地逸出。

公开(公告)号：US07082923B2

公开(公告)日：2006-08-01

申请号：US11049648

申请日：2005-02-04

申请人： Takashi Yui ,  Noboru Takagi ,  Kiyoo Hirose ,  Keizo Hiraku ,  Hirohiko Yamada

发明人： Takashi Yui ,  Noboru Takagi ,  Kiyoo Hirose ,  Keizo Hiraku ,  Hirohiko Yamada

IPC分类号： F02D3/00 ,  F02D41/00

CPC分类号： F02D41/083 ,  F01L1/185 ,  F01L13/0063 ,  F01L2001/0537 ,  F01L2105/00 ,  F01L2800/00 ,  F02D13/02 ,  F02D41/0002 ,  F02D41/086 ,  F02D41/1454 ,  F02D2200/023 ,  F02D2200/0404 ,  Y02T10/18 ,  Y02T10/42

摘要： An controller detects a change in a load generation state of an accessory device that generates a load on the internal combustion engine during operation, and the controller in turn controls a variable valve mechanism to change at least one of an operation angle and a valve lift of an intake valve of the internal combustion engine, as well as changing an amount of an intake air drawn into the internal combustion engine, in response to the detected change in the load generation state of the accessory device.

摘要翻译： 控制器检测在操作期间在内燃机上产生负载的附件装置的负载生成状态的变化，并且控制器进而控制可变气门机构以改变操作角和气门升程中的至少一个 内燃机的进气阀，以及响应于检测到的附件装置的负载产生状态的变化而改变吸入内燃机的进气量。