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公开(公告)号：US20180079640A1
公开(公告)日：2018-03-22
申请号：US15700179
申请日：2017-09-11
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN , Marin Sigurdson
CPC classification number: B81B3/0013 , B81B3/0086 , B81B7/0006 , B81B7/008 , B81C1/00206 , B81C1/00936 , H01H1/0036 , H01H59/0009 , H01H2001/0078
Abstract: Systems and methods for forming an electrostatic MEMS switch that is used to switch a source of current or voltage. At least one surface of the MEMS switch may be rotated on approach to another substrate, such that when the surfaces are separated, the forces are shearing forces rather than static frictional forces.
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公开(公告)号：US20170283252A1
公开(公告)日：2017-10-05
申请号：US15477593
申请日：2017-04-03
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
CPC classification number: B81C1/00182 , B81B3/0018 , B81B2201/0264 , B81C2201/01 , G01L7/022 , G01L7/024 , G01L7/026 , G01L7/163 , G01L9/0001 , G01L9/0042 , G01L9/0054 , G01L9/0089
Abstract: A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.
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公开(公告)号：US20170126323A1
公开(公告)日：2017-05-04
申请号：US15408956
申请日：2017-01-18
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
CPC classification number: H04B10/516 , B81B7/0067 , B81C1/00301 , G02B27/0955 , H01S5/0064 , H01S5/021 , H01S5/02216 , H01S5/02248 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/0607 , H01S5/4025 , H01S5/4031
Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via.
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公开(公告)号：US20170062165A1
公开(公告)日：2017-03-02
申请号：US15232871
申请日：2016-08-10
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN , Paul J. RUBEL
IPC: H01H59/00
CPC classification number: H01H59/0009 , H01H2059/0072
Abstract: An MEMS device, having two substantially parallel surfaces are separated by an initial distance. At least one of the surfaces includes a raised feature that limits the gap between the surfaces to less than the initial distance when an actuating voltage is applied. In some embodiments, the raised feature limits the gap to about 66% of the initial distance.
Abstract translation: 具有两个基本上平行的表面的MEMS器件被分开初始距离。 至少一个表面包括凸起特征，其在施加致动电压时将表面之间的间隙限制为小于初始距离。 在一些实施例中，凸起特征将间隙限制为初始距离的约66％。
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公开(公告)号：US20160304335A1
公开(公告)日：2016-10-20
申请号：US15098353
申请日：2016-04-14
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
CPC classification number: B81B7/0067 , B81B2201/0264 , B81B2201/047 , B81B2207/115 , B81C1/00317 , B81C3/001 , B81C2201/013 , B81C2201/0197 , B81C2203/031 , H01L24/00 , H04R19/02
Abstract: A first ion rich dielectric substrate with a patterned dielectric barrier and a oxidizable metal layer is anodically bonded to a second ion rich dielectric substrate. To bond the substrates, the oxidizable metal layer is oxidized. The dielectric barrier may inhibit the migration of these ions to the bondline, which might otherwise poison the bond strength. Accordingly, when joining the two substrates, a strong bond is maintained between the wafers.
Abstract translation: 具有图案化电介质阻挡层和可氧化金属层的第一富离子电介质基片阳极结合到第二富离子电介质基片上。 为了结合基板，可氧化的金属层被氧化。 电介质阻挡层可以抑制这些离子迁移到粘结线，否则可能会损害粘结强度。 因此，当接合两个基板时，在晶片之间保持牢固的结合。
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Patent Agency Ranking
公开(公告)号：US09388037B2
公开(公告)日：2016-07-12
申请号：US14158829
申请日：2014-01-19
Applicant: Innovative Micro Technology
Inventor： Benedikt Zeyen , Jeffery F. Summers
CPC classification number: B81B1/00 , B32B37/0084 , B32B2037/1269 , B81B7/00 , B81C1/00269 , B81C2203/019 , Y10T428/13 , Y10T428/24851 , Y10T428/24975 , Y10T428/31536
Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。
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公开(公告)号：US20160093530A1
公开(公告)日：2016-03-31
申请号：US14499287
申请日：2014-09-29
Applicant: Innovative Micro Technology
Inventor： John C. HARLEY
IPC: H01L21/768 , B81C1/00
CPC classification number: H01L21/76898 , B81B7/0006 , B81B2201/018 , B81B2201/0271 , B81B2207/012 , B81B2207/015 , B81C1/00301 , B81C2203/0792 , H01L2224/02372 , H01L2224/05548
Abstract: A method for forming through silicon vias (TSVs) in a silicon substrate is disclosed. The method involves forming a silicon post as an annulus in a first side of a silicon substrate, removing material from an opposite side to the level of the annulus, removing the silicon post and replacing it with a metal material to form a metal via extending through the thickness of the substrate.
Abstract translation: 公开了一种在硅衬底中形成硅通孔（TSV）的方法。 该方法包括在硅衬底的第一侧中形成硅柱作为环状空间，从与环空的水平面相反的一侧去除材料，去除硅柱并用金属材料代替它，以通过延伸通过 基板的厚度。
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公开(公告)号：US20150183630A1
公开(公告)日：2015-07-02
申请号：US14158829
申请日：2014-01-19
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN , Jeffery F. SUMMERS
IPC: B81B1/00
CPC classification number: B81B1/00 , B32B37/0084 , B32B2037/1269 , B81B7/00 , B81C1/00269 , B81C2203/019 , Y10T428/13 , Y10T428/24851 , Y10T428/24975 , Y10T428/31536
Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。
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公开(公告)号：US20150069618A1
公开(公告)日：2015-03-12
申请号：US13987871
申请日：2013-09-11
Applicant: Innovative Micro Technology
Inventor： Christopher S. Gudeman , Prosenjit Sen
CPC classification number: H01L21/486 , B81B7/007 , B81B2207/095 , B81B2207/096 , B81C1/00095 , H01L21/76898 , H01L23/481 , H01L31/02167 , H01L31/03529 , H01L31/052 , H01L31/068 , H01L2924/0002 , Y02E10/547 , H01L2924/00
Abstract: A method for forming through substrate vias (TSVs) in a non-conducting, glass substrate is disclosed. The method involves patterning a silicon template substrate with a plurality of lands and spaces, bonding a slab or wafer of glass to the template substrate, and melting the glass so that it flows into the spaces formed in the template substrate. The template substrate may then be removed to leave a plurality of TSVs in the glass slab or wafer.
Abstract translation: 公开了一种用于在非导电玻璃基板中形成贯穿衬底通孔（TSV）的方法。 该方法包括用多个焊盘和间隔图案化硅模板衬底，将玻璃板或玻璃晶片粘合到模板衬底上，并使玻璃熔化，使其流入模板衬底中形成的空间。 然后可以移除模板衬底以在玻璃板或晶片中留下多个TSV。
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公开(公告)号：US20150031120A1
公开(公告)日：2015-01-29
申请号：US13987464
申请日：2013-07-29
Applicant: Innovative Micro Technology
Inventor： John S. Foster , Daryl W. Grummitt , John C. Harley , Jaquelin K. Spong , Kimberly L. Turner
IPC: G01N33/50
CPC classification number: G01N33/5005 , B01L3/502738 , B01L3/502761 , B01L2200/0652 , B01L2400/043 , B01L2400/0633 , C12M47/04
Abstract: A MEMS-based system and a method are described for separating a target particle from the remainder of a fluid stream. The system makes use of a unique, microfabricated movable structure formed on a substrate, which moves in a rotary fashion about one or more fixed points, which are all located on one side of the axis of motion. The movable structure is actuated by a separate force-generating apparatus, which is entirely separate from the movable structure formed on its substrate. This allows the movable structure to be entirely submerged in the sample fluid.
Abstract translation: 描述了基于MEMS的系统和方法，用于将目标颗粒与流体流的其余部分分离。 该系统利用形成在基板上的独特的微加工可移动结构，其以旋转方式围绕一个或多个固定点移动，所述固定点都位于运动轴的一侧。 可移动结构由独立的力产生装置致动，该装置与其基板上形成的可移动结构完全分开。 这允许可移动结构完全浸没在样品流体中。
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