Invention Grant
- Patent Title: Device using glass substrate anodic bonding
- Patent Title (中): 装置采用玻璃基板阳极结合
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Application No.: US14158829Application Date: 2014-01-19
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Publication No.: US09388037B2Publication Date: 2016-07-12
- Inventor: Benedikt Zeyen , Jeffery F. Summers
- Applicant: Innovative Micro Technology
- Applicant Address: US CA Goleta
- Assignee: Innovative Micro Technology
- Current Assignee: Innovative Micro Technology
- Current Assignee Address: US CA Goleta
- Agent Jaquelin K. Spong
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B17/06 ; B81B1/00 ; B32B37/00 ; B81C1/00 ; B81B7/00 ; B32B37/12
Abstract:
A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Public/Granted literature
- US20150183630A1 DEVICE USING GLASS SUBSTRATE ANODIC BONDING Public/Granted day:2015-07-02
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