公开(公告)号：US20240228800A1

公开(公告)日：2024-07-11

申请号：US18497157

申请日：2023-10-30

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Hsiang-Jui CHEN ,  Chih-Hao LIN ,  Yueh-Chuan HUANG

IPC分类号： C09D7/62 ,  C08G59/22 ,  C08G59/30 ,  C08K9/06 ,  C09D163/00 ,  H01L33/56 ,  H01L33/58

CPC分类号： C09D7/62 ,  C08G59/226 ,  C08G59/306 ,  C08K9/06 ,  C09D163/00 ,  H01L33/56 ,  H01L33/58

摘要： A coating material includes a modified particle and a reactive compound. The modified particle includes a core, and a silane coupling agent having an epoxy group (or a double-bond) grafted onto a surface of the core. When the silane coupling agent having the epoxy group is grafted onto the surface of the core, the reactive compound includes a non-silicon multi-epoxy compound and a silicon-containing multi-epoxy compound. When the silane coupling agent having the double-bond is grafted onto the surface of the core, the reactive compound includes a multi double-bond compound.

公开(公告)号：US20240228710A1

公开(公告)日：2024-07-11

申请号：US18406604

申请日：2024-01-08

申请人： Celanese International Corporation

发明人： Sabine Steinbach ,  Kirsten Markgraf

IPC分类号： C08J5/04 ,  C08K5/24 ,  C08K5/315 ,  C08K9/06

CPC分类号： C08J5/043 ,  C08K5/24 ,  C08K5/315 ,  C08K9/06 ,  C08J2359/02

摘要： Molded polymer components are described that are configured to be used in a coolant fluid circulation system. The molded polymer components, for instance, can at least partially define a coolant fluid pathway and are well suited for use in cooling batteries and other electrical components in electric vehicles. The molded polymer components can be made from a polyoxymethylene polymer composition containing reinforcing fibers.

公开(公告)号：US20240199935A1

公开(公告)日：2024-06-20

申请号：US18285966

申请日：2022-03-22

申请人： DOW TORAY CO., LTD.

发明人： Kenji OTA

IPC分类号： C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K5/098 ,  C08K5/56 ,  C08K9/06 ,  C08K13/06 ,  C09D7/62 ,  C09D7/63 ,  C09D183/04 ,  H01M10/653

CPC分类号： C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K13/06 ,  C09D7/62 ,  C09D7/63 ,  C09D183/04 ,  H01M10/653 ,  C08K5/098 ,  C08K5/56 ,  C08K9/06 ,  C08K2201/001

摘要： Provided is a curable organopolysiloxane composition that has high thermal conductivity while suppressing a change in hardness of the cured material after heat aging, and that provides an organopolysiloxane cured material that can maintain flexibility and stress relaxation even when a thermally conductive member made of the cured materials is used at high temperature. The disclosure also relates to a thermally conductive member made of the composition and a heat dissipating structure using the member. The composition comprises: (A) an alkenyl group-containing organopolysiloxane, (B) an organohydrogen polysiloxane, (C) a thermally conductive filler in an amount of from 60 to 90% by volume, (D) at least one type selected from fatty acids, fatty acid esters, and fatty acid metal salts in an amount of from 0.05 to 2.00 parts by mass per 100 parts by mass of Component (C), (E) a hydrosilylation reaction catalyst, and (F) a heat resistance imparting agent.

公开(公告)号：US20240182657A1

公开(公告)日：2024-06-06

申请号：US18282929

申请日：2022-03-09

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Akira IRIFUNE ,  Mitsuyoshi NISHINO

IPC分类号： C08J5/24 ,  C08K3/22 ,  C08K3/36 ,  C08K9/02 ,  C08K9/06 ,  H05K1/03

CPC分类号： C08J5/244 ,  C08K3/22 ,  C08K3/36 ,  C08K9/02 ,  C08K9/06 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2371/12 ,  C08K2003/2206 ,  C08K2003/2237 ,  H05K2201/0209 ,  H05K2201/0239

摘要： A resin composition contains a polyphenylene ether compound (A) having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in the molecule, a curing agent (B), a titanate compound filler (C), and a silica filler (D), in which the content ratio of the titanate compound filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.




In Formula (1), p represents 0 to 10, Ar represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.




In Formula (2), R4 represents a hydrogen atom or an alkyl group.

公开(公告)号：US20240150553A1

公开(公告)日：2024-05-09

申请号：US18549649

申请日：2022-03-07

申请人： IMERTECH SAS

发明人： Shamila GRIGORIEFF ,  Anaëlle ESPOSITO ,  Alice BASSALER ,  Gaëlle RODARY

IPC分类号： C08K9/06 ,  C08K3/26 ,  C08K9/02 ,  C09C1/02 ,  C09C3/08 ,  C09C3/12

CPC分类号： C08K9/06 ,  C08K3/26 ,  C08K9/02 ,  C09C1/024 ,  C09C3/08 ,  C09C3/12 ,  C01P2006/12 ,  C08K2003/265 ,  C08K2201/006

摘要： The present disclosure relates to a silane treated composition, and a filled polymer composition comprising such silane treated composition and a polymer for improved mechanical properties; the treatment being in two steps, the first being a treatment with an aqueous silicate, followed by a second treatment with a silane-containing compound; optionally including treatment with an aliphatic carboxylic acid prior to the first treatment.

公开(公告)号：US20240150552A1

公开(公告)日：2024-05-09

申请号：US18280875

申请日：2022-01-17

申请人： MITSUI CHEMICALS, INC.

发明人： Hiroaki YOSHII

IPC分类号： C08K9/06

CPC分类号： C08K9/06 ,  C08K2201/002 ,  C08K2201/009

摘要： A resin composition including: 100 parts by mass of a thermoplastic resin (A) having a density, a MFR, and durometer A hardness falling within certain ranges; 10 to 100 parts by mass of a heat storage compound (B) having a flash point of 200° C. or higher; and 1.5 to 20 parts by mass of a porous inorganic compound (C) having an oil absorption of 4.0 g/g or more, in which the content of the heat storage compound (B) is less than 700 parts by mass based on the content of the porous inorganic compound (C) of 100 parts by mass.

公开(公告)号：US20240124757A1

公开(公告)日：2024-04-18

申请号：US18105513

申请日：2023-02-03

申请人： SAMDO ATS CO., LTD.

发明人： Taeyoon LIM ,  Hongsoo KIM ,  Jaeseung YOO ,  In Hwan JANG ,  Hyeok PARK

IPC分类号： C09K5/14 ,  C08G59/50 ,  C08J3/205 ,  C08J5/18 ,  C08K9/06 ,  C09C3/12

CPC分类号： C09K5/14 ,  C08G59/5073 ,  C08J3/2053 ,  C08J5/18 ,  C08K9/06 ,  C09C3/12 ,  C01P2002/76 ,  C01P2004/61 ,  C01P2006/32 ,  C08J2363/00 ,  C08K2201/001 ,  C08K2201/005

摘要： There is provided a method for manufacturing a heat dissipation film. The method includes preparing a first mixture by mixing hexagonal boron nitride and an organic solvent, performing primary surface-modification on the hexagonal boron nitride, adding an amine-based silane compound to the first mixture, and then performing secondary surface-modification on the hexagonal boron nitride, preparing a second mixture by obtaining the secondarily surface-modified hexagonal boron nitride, and mixing the secondarily surface-modified hexagonal boron nitride, an imidazole-based curing agent, and an organic solvent, dispersing the second mixture, adding an epoxy resin to the second mixture, and then performing dispersion, and drying the organic solvent in the second mixture, and manufacturing a film using a product obtained by the drying.

公开(公告)号：US20240120615A1

公开(公告)日：2024-04-11

申请号：US18502978

申请日：2023-11-06

申请人： CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED

发明人： Haiyang KANG ,  Lei LI ,  Yi ZHENG ,  Chengdong SUN ,  Shaohua AI

IPC分类号： H01M50/446 ,  C08F220/14 ,  C08F220/18 ,  C08F220/28 ,  C08K9/06 ,  H01M50/42 ,  H01M50/423 ,  H01M50/434 ,  H01M50/443 ,  H01M50/451

CPC分类号： H01M50/446 ,  C08F220/14 ,  C08F220/1802 ,  C08F220/1804 ,  C08F220/1806 ,  C08F220/1811 ,  C08F220/281 ,  C08K9/06 ,  H01M50/42 ,  H01M50/423 ,  H01M50/434 ,  H01M50/443 ,  H01M50/451 ,  C08F2800/10

摘要： A binder includes a polymer and ceramic particles modified with silane coupling agent. The polymer contains structural units derived from a first-type monomer, a second-type monomer, and a third-type monomer, and a molar ratio of the first-type monomer, the second-type monomer, and the third-type monomer is (50 to 58):(40 to 44):(2 to 6). The first-type monomer is selected from one or more compounds of formula I, the second-type monomer is selected from one or more compounds of formula II, and the third-type monomer is selected from one or more compounds of formula III.

公开(公告)号：US20240092962A1

公开(公告)日：2024-03-21

申请号：US18284386

申请日：2022-03-24

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Taichi NAKASHIMA ,  Hiroyuki FUJISAWA ,  Akira OTSUKA ,  Koichi ISAJI ,  Hajime OGUSHI

IPC分类号： C08F290/06 ,  C08J5/24 ,  C08K9/06 ,  H05K1/03

CPC分类号： C08F290/062 ,  C08J5/244 ,  C08J5/249 ,  C08K9/06 ,  H05K1/0366 ,  C08J2351/08

摘要： A resin composition contains a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in a molecule and an acid anhydride (a2) having an acid anhydride group in a molecule, and a curable resin (B) containing a reactive compound having an unsaturated double bond in a molecule, in which an equivalent ratio of the acid anhydride group in the acid anhydride (a2) to the hydroxyl group in the polyphenylene ether compound (a1) is 1.5 or less, and a content of the curable resin (B) is 20 to 85 parts by mass with respect to 100 parts by mass of a sum of the preliminary reaction product (A) and the curable resin (B).

公开(公告)号：US11923505B2

公开(公告)日：2024-03-05

申请号：US16617104

申请日：2018-05-31

申请人： LG ENERGY SOLUTION, LTD.

发明人： Takuya Nishimura ,  Hiroki Mikuni

IPC分类号： H01M10/0565 ,  C08K3/36 ,  C08K9/06 ,  H01M10/052 ,  H01M10/0568 ,  H01M10/0569 ,  H01M10/0585

CPC分类号： H01M10/0565 ,  C08K3/36 ,  C08K9/06 ,  H01M10/052 ,  H01M10/0568 ,  H01M10/0569 ,  H01M10/0585 ,  H01M2300/0082 ,  H01M2300/0091

摘要： There is disclosed an electrolyte composition comprising one or two or more polymers, oxide particles having a hydrophobic surface, at least one electrolyte salt selected from the group consisting of a lithium salt, a sodium salt, a calcium salt, and a magnesium salt, and an ionic liquid.