PROCESS MANAGEMENT SYSTEM AND PROCESS MANAGEMENT METHOD

    公开(公告)号:US20240353819A1

    公开(公告)日:2024-10-24

    申请号:US18138239

    申请日:2023-04-24

    IPC分类号: G05B19/418

    CPC分类号: G05B19/41865

    摘要: A process-management system and a process-management method are provided. The process-management system includes a process-planning module, a process-management module, and a process-executing module. The process-planning module stores a preset workflow and is configured to receive a first input instruction and a second input instruction. The process-planning module provides the preset workflow according to the first input instruction, and adjusts the preset workflow according to the second input instruction to generate a customized workflow. The process-management module is electrically connected to the process-planning module and is configured to generate a work instruction according to the preset workflow or the customized workflow. The process-executing module is electrically connected to the process-management module and configured to process a workpiece according to the work instruction.

    PLANAR TRANSPARENT ANTENNA STRUCTURE
    4.
    发明公开

    公开(公告)号:US20240339758A1

    公开(公告)日:2024-10-10

    申请号:US18625964

    申请日:2024-04-03

    IPC分类号: H01Q9/28 H01Q1/38

    CPC分类号: H01Q9/285 H01Q1/38

    摘要: A planar transparent antenna structure is provided. The planar transparent antenna structure includes a dielectric substrate, a radiation conductive layer and a ground conductive layer. The dielectric substrate has a first surface and a second surface. The radiation conductive layer is disposed on the first surface of the dielectric substrate. The ground conductive layer is disposed on the second surface of the dielectric substrate. The radiation conductive layer and the ground conductive layer are composed of a plurality of wires connected in a mesh manner. Each of the wires is composed of a plurality of grid lines connected in a mesh manner.

    SAMPLE DEPTH-MEASURING DEVICE AND METHOD
    5.
    发明公开

    公开(公告)号:US20240331178A1

    公开(公告)日:2024-10-03

    申请号:US18308223

    申请日:2023-04-27

    IPC分类号: G06T7/521 G01B11/22

    摘要: A measuring device includes a light source unit, a light modulation unit, a spectrum sensing unit, an image sensing unit, and a processing unit. The light source unit projects a first light path to a sample and receives a second light path reflected from the sample. The light module unit tilts the second light path to become a third light path or a fourth light path. The spectrum sensing unit receives the third light path to capture a spectrum corresponding to the microstructures. The image sensing unit receives the fourth light path to measure a captured image that corresponds to the sample. When the processing unit identifies the position of at least one of the microstructures in the captured image, the processing unit measures the depth of at least one of the microstructures from the spectrum for the identified area.

    Embedded system and vibration driving method

    公开(公告)号:US12061741B2

    公开(公告)日:2024-08-13

    申请号:US17857044

    申请日:2022-07-04

    IPC分类号: G06F3/01 G06F9/30 H04W4/80

    摘要: An embedded system and a vibration driving method are provided. The embedded system includes a vibration module, a Bluetooth module, a storage module, and a microcontroller unit. The vibration module includes a plurality of actuators. The Bluetooth module is configured to receive a Bluetooth signal provided by an external device. The storage module is configured to store a vibration type database. The microcontroller unit is coupled to the vibration module, the Bluetooth module, and the storage module. The microcontroller unit generates vibration type data according to the Bluetooth signal and the vibration type database. The microcontroller unit drives at least one of the plurality of actuators according to the vibration type data.