FILLER-LOADED HIGH THERMAL CONDUCTIVE DISPERSION LIQUID COMPOSITION HAVING EXCELLENT SEGREGATION STABILITY, METHOD FOR PRODUCING SAID DISPERSION LIQUID COMPOSITION, FILLER-LOADED HIGH THERMAL CONDUCTIVE MATERIAL USING SAID DISPERSION LIQUID COMPOSITION, METHOD FOR PRODUCING SAID MATERIAL, AND MOLDED ARTICLE OBTAINED USING SAID MATERIAL

    公开(公告)号:US20240092981A1

    公开(公告)日:2024-03-21

    申请号:US18491613

    申请日:2023-10-20

    摘要: A problem of heat dissipation in motors, converters, high-luminance LEDs, power devices, power supplies, and the like becomes significant. Provided is a means for capable of providing a product, which has favorable workability, segregation stability, storage stability, and the like, penetrates into a gap in a coil portion, an interface in casing, and the like without any gaps, enhances thermal conductivity/heat dissipation properties of a molded product thus obtained, and is excellent in electrical characteristics, toughness/elastic modulus, thermal resistance, thermal cycle properties, and the like, in the case of using the product for a cast molding resin, a pottingmaterial (sealingmaterial), an adhesive, grease, and the like.
    Provided is a filler-loaded high thermal conductive dispersion liquid composition being formed by uniformly dispersing a powder composition, which contains organic polymer particles containing thermoplastic polymer particles, and high thermal conductive filler particles which contain filler particles having a graphite-like structure and is obtained by pulverizing 5 to 70 parts by weight of the organic polymer particles and 30 to 95 parts by weight of the high thermal conductive filler particles with respect to 100 parts by weight of the total amount of these components by using a pulverizing machine, which performs grinding with frictional force or impact force, to cause delamination or cohesive failure while maintaining an average planar particle size of the filler particles having a graphite-like structure, in the powder composition, the vicinity of the high thermal conductive filler particles being covered with the micronized organic polymer particles and the covered particles being uniformly dispersed, using 25 to 250 parts by weight of a liquid reactive dispersing medium and/or a dispersing medium containing a thermoplastic polymer having a deflection temperature under load or a melting point lower than that of the thermoplastic polymer used in the powder composition with respect to 100 parts by weight of the powder composition, and the dispersion liquid composition having conditions that a thermal conductive infinite cluster exhibiting a thermal conductivity of 1 to 35 W/mK is formed and a concentration of the high thermal conductive filler particles is equal to or more than a percolation threshold.

    ADDITIVE FOR RESIN KNEADING
    9.
    发明公开

    公开(公告)号:US20230365761A1

    公开(公告)日:2023-11-16

    申请号:US18044437

    申请日:2021-09-10

    摘要: An additive for resin kneading contains an organic ultraviolet absorber and/or a radical scavenger, and a polymer having the organic ultraviolet absorber and/or the radical scavenger dispersed. The additive for resin kneading has a median size of 1 µm or more and 100 µm or less. A percentage of the total amount of the organic ultraviolet absorber and the radical scavenger in the additive for resin kneading is 20% or more and 70 % or less. The polymer is a copolymer of a vinyl monomer component that contains a monofunctional vinyl monomer containing only one polymerizable carbon-carbon double bond per molecule, and a polyfunctional vinyl monomer containing two or more polymerizable carbon-carbon double bonds per molecule. A percentage of the monofunctional vinyl monomer in the total amount of the monofunctional vinyl monomer and the polyfunctional vinyl monomer is 10% or more and 95% or less.