公开(公告)号：US20240092981A1

公开(公告)日：2024-03-21

申请号：US18491613

申请日：2023-10-20

申请人： Takagi Chemicals, Inc.

发明人： Noriaki Takagi ,  Masakuni Takagi ,  Yuusuke Nagatani ,  Yuuta Terao ,  Daisuke Watanabe ,  Kazuo Matsuyama

IPC分类号： C08J3/205 ,  C08J5/10 ,  C08K3/04 ,  C08K3/22 ,  C08K3/38 ,  C08L63/00 ,  C08L79/04

CPC分类号： C08J3/205 ,  C08J5/10 ,  C08K3/04 ,  C08K3/22 ,  C08K3/38 ,  C08L63/00 ,  C08L79/04 ,  C08K2003/222 ,  C08K2003/385 ,  C08K2201/001

摘要： A problem of heat dissipation in motors, converters, high-luminance LEDs, power devices, power supplies, and the like becomes significant. Provided is a means for capable of providing a product, which has favorable workability, segregation stability, storage stability, and the like, penetrates into a gap in a coil portion, an interface in casing, and the like without any gaps, enhances thermal conductivity/heat dissipation properties of a molded product thus obtained, and is excellent in electrical characteristics, toughness/elastic modulus, thermal resistance, thermal cycle properties, and the like, in the case of using the product for a cast molding resin, a pottingmaterial (sealingmaterial), an adhesive, grease, and the like.
Provided is a filler-loaded high thermal conductive dispersion liquid composition being formed by uniformly dispersing a powder composition, which contains organic polymer particles containing thermoplastic polymer particles, and high thermal conductive filler particles which contain filler particles having a graphite-like structure and is obtained by pulverizing 5 to 70 parts by weight of the organic polymer particles and 30 to 95 parts by weight of the high thermal conductive filler particles with respect to 100 parts by weight of the total amount of these components by using a pulverizing machine, which performs grinding with frictional force or impact force, to cause delamination or cohesive failure while maintaining an average planar particle size of the filler particles having a graphite-like structure, in the powder composition, the vicinity of the high thermal conductive filler particles being covered with the micronized organic polymer particles and the covered particles being uniformly dispersed, using 25 to 250 parts by weight of a liquid reactive dispersing medium and/or a dispersing medium containing a thermoplastic polymer having a deflection temperature under load or a melting point lower than that of the thermoplastic polymer used in the powder composition with respect to 100 parts by weight of the powder composition, and the dispersion liquid composition having conditions that a thermal conductive infinite cluster exhibiting a thermal conductivity of 1 to 35 W/mK is formed and a concentration of the high thermal conductive filler particles is equal to or more than a percolation threshold.

公开(公告)号：US20190309204A1

公开(公告)日：2019-10-10

申请号：US16244730

申请日：2019-01-10

申请人： Takagi Chemicals, Inc.

发明人： Noriaki Takagi ,  Yuusuke Nagatani ,  Yuuta Terao ,  Kazuo Matsuyama ,  Tsutomu Takeichi ,  Akihiko Matsumoto

IPC分类号： C09K5/14 ,  C08K3/38 ,  C08K3/04 ,  C08L101/00 ,  C09D5/24 ,  B32B27/08 ,  C09D7/40 ,  C09D7/61 ,  B32B7/02 ,  B32B27/36 ,  B32B27/28 ,  B32B27/20 ,  B32B7/04 ,  B32B5/02 ,  B32B5/16 ,  B32B5/24 ,  B32B5/30 ,  C08K7/06 ,  C08K7/14 ,  C09D201/00

摘要： [Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.[Solution] Disclosed is a high filler-loaded high thermal conductive material formed by subjecting a composition which includes organic polymer particles and a thermally conductive filler having a graphite-like structure, and includes 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained, so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; to press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm2; and to cooling and solidification.

公开(公告)号：US20200062911A1

公开(公告)日：2020-02-27

申请号：US16611769

申请日：2018-09-27

申请人： Takagi Chemicals, Inc.

发明人： Noriaki Takagi ,  Masakuni Takagi ,  Yuusuke Nagatani ,  Yuuta Terao ,  Daisuke Watanabe ,  Kazuo Matsuyama

IPC分类号： C08J3/205 ,  C08J5/10 ,  C08K3/04 ,  C08K3/22 ,  C08L63/00 ,  C08L79/04 ,  C08K3/38

摘要： A filler-loaded thermal conductive liquid compositions formed by dispersing a powder composition, which contains polymer particles containing thermoplastic polymer particles, and thermal conductive filler particles containing particles having a graphite-like structure, obtained by pulverizing 5-70 parts by weight of the polymer particles and 30-95 parts by weight of the thermal conductive filler particles, the filler particles being covered with micronized polymer particles and the covered particles being uniformly dispersed, using 25-250 parts by weight of a liquid reactive dispersing medium and/or a dispersing medium containing a thermoplastic polymer having a deflection temperature under load or a melting point lower than the thermoplastic polymer used in the powder composition, and the liquid composition having conditions that a thermal conductive infinite cluster exhibiting a thermal conductivity of 1-35 w/mk is formed and a concentration of thermal conductive filler particles is equal to or more than a percolation threshold.

公开(公告)号：US20150259589A1

公开(公告)日：2015-09-17

申请号：US14404219

申请日：2013-11-01

申请人： Takagi Chemicals, Inc.

发明人： Noriaki Takagi ,  Yuusuke Nagatani ,  Yuuta Terao ,  Kazuo Matsuyama ,  Tsutomu Takeichi ,  Akihiko Matsumoto

IPC分类号： C09K5/14 ,  B32B27/20 ,  B32B27/08 ,  B32B27/28 ,  B32B27/36

CPC分类号： C09K5/14 ,  B32B5/022 ,  B32B5/16 ,  B32B5/24 ,  B32B5/30 ,  B32B7/02 ,  B32B7/04 ,  B32B27/08 ,  B32B27/20 ,  B32B27/286 ,  B32B27/36 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2264/0207 ,  B32B2264/0214 ,  B32B2264/0221 ,  B32B2264/0235 ,  B32B2264/0242 ,  B32B2264/025 ,  B32B2264/0257 ,  B32B2264/0264 ,  B32B2264/0278 ,  B32B2264/0285 ,  B32B2264/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2264/108 ,  B32B2264/12 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/304 ,  B32B2307/308 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2307/58 ,  B32B2307/72 ,  B32B2307/734 ,  B32B2451/00 ,  B32B2457/08 ,  B32B2457/14 ,  B32B2457/18 ,  B32B2457/202 ,  C08K3/04 ,  C08K3/38 ,  C08K7/06 ,  C08K7/14 ,  C08K2003/385 ,  C08K2201/005 ,  C08L101/00 ,  C09D5/24 ,  C09D7/40 ,  C09D7/61 ,  C09D201/00 ,  Y10T428/31786 ,  C08L81/04 ,  C08L69/00 ,  C08L67/02 ,  C08L23/04

摘要： [Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.[Solution] Disclosed is a high filler-loaded high thermal conductive material formed by subjecting a composition which includes organic polymer particles and a thermally conductive filler having a graphite-like structure, and includes 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained, so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; to press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm2; and to cooling and solidification.

摘要翻译： [问题]提供一种高填料负载的高导热材料，其充分利用有机聚合物的特征，同时改善缺点，能够与陶瓷，金属，半导体元件等进行一体成型，并且具有低的热膨胀系数和 高导热性; 以及高填充剂高导热性材料的制造方法，组合物，涂布液和成型体。 [解决方案]公开了一种高填料负载的高导热材料，其通过使包含有机聚合物颗粒的组合物和具有石墨状结构的导热填料进行处理而形成，并且包括5至60重量％的有机聚合物颗粒和 获得40至95重量％的相对于这些组分总量的100重量％具有石墨状结构的导热填料，使得导热填料通过分层分散而保持平均平面颗粒 导热填料的尺寸，并且能够形成导热无限簇; 在高于负载下的挠曲温度，有机聚合物的熔点或玻璃化转变温度，压力为1〜1000kgf / cm2的温度下进行成型; 并进行冷却和凝固。

公开(公告)号：US10851277B2

公开(公告)日：2020-12-01

申请号：US16244730

申请日：2019-01-10

申请人： Takagi Chemicals, Inc.

发明人： Noriaki Takagi ,  Yuusuke Nagatani ,  Yuuta Terao ,  Kazuo Matsuyama ,  Tsutomu Takeichi ,  Akihiko Matsumoto

IPC分类号： C09K5/14 ,  C09D7/40 ,  C09D7/61 ,  B32B5/02 ,  B32B5/16 ,  B32B5/24 ,  B32B5/30 ,  B32B7/02 ,  B32B7/04 ,  C08K3/04 ,  C08K3/38 ,  C08K7/06 ,  C08K7/14 ,  C08L101/00 ,  C09D5/24 ,  C09D201/00 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/36

摘要： [Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.[Solution] Disclosed is a high filler-loaded high thermal conductive material formed by subjecting a composition which includes organic polymer particles and a thermally conductive filler having a graphite-like structure, and includes 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained, so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; to press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm2; and to cooling and solidification.