Abstract:
Various example implementations are directed to circuits and methods for inter-die communication on a multi-die integrated circuit (IC) package. According to an example implementation, an IC package includes a first semiconductor die having a plurality of communication circuits for communicating data over respective data terminals of the package. The package also includes a second semiconductor die having N contacts for communicating data to and from the semiconductor die. The second semiconductor die includes a logic circuit configured to communicate M parallel data signals with one or more other semiconductor dies of the package, wherein M>N. The second semiconductor die also includes a plurality of serializer circuits, each configured to serialize data from a respective subset of the plurality of the M signal lines to produce serialized data and provide the serialized data to a respective one of the contacts.
Abstract:
A circuit for providing a ground path in an integrated circuit device is described. The circuit comprises a device region formed in a substrate; a substrate tap formed adjacent to the device region; and a conductive path coupled between the substrate tap and a ground metal layer by way of a plurality of metal layers and vias, wherein the conductive path is configured to meet a predetermined design requirement.
Abstract:
An integrated circuit having improved radiation immunity is described. The integrated circuit comprises a substrate; a P-well formed on the substrate and having N-type transistors of a memory cell; and an N-well formed on the substrate and having P-type transistors of the memory cell; wherein the N-well has minimal dimensions for accommodating the P-type transistors.
Abstract:
An electronics-harmful-radiation (EHR) monitoring system includes an EHR measurement circuit. The EHR measurement circuit includes a first device, a single event upset (SEU) detector circuit configured to determine a first number of SEUs of the first device during a first period, and an EHR measurement generator configured to generate a first EHR value based on the first number of SEUs and the first period.
Abstract:
A circuit for implementing a discharge path in an input/output circuit of an integrated circuit is described. The circuit comprises an input/output pad; a first node coupled to a power reference voltage; a first impedance element implemented between the first node and the input/output pad; a second node coupled to a ground reference voltage; and a second impedance element implemented between the second node and the input/output pad. A method of implementing a discharge path in an input/output circuit of an integrated circuit is also disclosed.
Abstract:
Approaches are disclosed for processing a circuit design to protect against single event upsets. A logic path of the circuit design is selected for redundancy based on a total of failure rates of circuit elements in the logic path being greater than a product of a target reduction in failure rate of the logic path and a failure rate of a voting circuit. The circuit design is modified to include at least three instances of the logic path coupled in parallel and a voting circuit coupled to receive output signals from the instances of the logic path. The modified circuit design is stored in a memory.
Abstract:
To implement a circuit design on a programmable integrated circuit (IC), first data are generated for implementing the circuit design. Critical and non-critical portions of the circuit design are determined, and second data are generated for programming configuration memory cells of the programmable IC to implement the circuit design. A first subset of the second data is assigned to program a first type of configuration memory cells to implement the critical portion of the circuit design on a first subset of programmable logic resources and a first subset of programmable interconnect resources of the programmable IC. A second subset of the second data is assigned to program a second type of configuration memory cells to implement the non-critical portion of the circuit design on a second subset of programmable logic resources and a second subset of programmable interconnect resources. The second data are stored in an electronically readable storage medium.
Abstract:
A wafer includes a first interposer having a first patterned metal layer and a second interposer having a second patterned metal layer. The wafer includes a metal connection in a scribe region of the wafer that electrically couples the first patterned metal layer of the first interposer with the second patterned metal layer of the second interposer forming a global wafer network. The wafer further includes a probe pad located in the scribe region that is electrically coupled to the global wafer network.
Abstract:
Examples described herein provide a circuit and methods for self-testing to detect damage to a device, which damage may be caused by an Electro-Static Discharge (ESD) event. In an example, an integrated circuit includes an input/output circuit, an ESD protection circuit, and a system monitor. The input/output circuit has an input/output node. The ESD protection circuit is connected to the input/output node. The system monitor has a driving/measurement node selectively connectable to the input/output node. The system monitor is configured to drive and measure a voltage of the driving/measurement node. The system monitor is further configured to determine, based on driving and measuring the voltage of the driving/measurement node, whether a damaged device is present. The damaged device is in the input/output circuit or the ESD protection circuit.
Abstract:
Examples described herein provide for single event latch-up (SEL) mitigation techniques. In an example, a semiconductor structure includes a semiconductor substrate, a p-type transistor having p+ source/drain regions disposed in a n-doped region in the semiconductor substrate, an n-type transistor having n+ source/drain regions disposed in a p-doped region in the semiconductor substrate, a n+ guard ring disposed in the n-doped region and laterally around the p+ source/drain regions of the p-type transistor, and a p+ guard ring disposed laterally around the n-doped region. The p+ guard ring is disposed between the p-type transistor and the n-type transistor.