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公开(公告)号:US10482958B2
公开(公告)日:2019-11-19
申请号:US15898119
申请日:2018-02-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Lien Linus Lu , Yu-Der Chih , Chung-Cheng Chou , Tong-Chern Ong
Abstract: A circuit includes a memory array having a plurality of memory cells; a control logic circuit, coupled to the memory array, and configured to use a first voltage signal to cause a first memory cell of the plurality of memory cells to transition from a first resistance state to a second resistance state, and a second voltage signal to cause the first memory cell to transition from the second resistance state to a third resistance state; and a counter circuit, coupled to the control logic circuit, and configured to increment a count by one in response to the first memory cell's transition from the first to the second resistance state, and again increment the count by one in response to the first memory cell's transition from the second to the third resistance state.
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公开(公告)号:US09966139B2
公开(公告)日:2018-05-08
申请号:US15730398
申请日:2017-10-11
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chung-Cheng Chou , Yu-Der Chih , Wen-Ting Chu
IPC: G11C13/00 , H01L27/24 , H01L23/522 , H01L45/00
CPC classification number: G11C13/0069 , G11C11/005 , G11C13/0007 , G11C13/0023 , G11C13/0028 , G11C13/0033 , G11C13/0035 , G11C13/0097 , G11C2013/0073 , G11C2013/0092 , G11C2213/79 , H01L23/522 , H01L27/2436 , H01L27/2463 , H01L45/08 , H01L45/1233 , H01L45/1273 , H01L45/146 , H01L45/1616
Abstract: A memory architecture includes: a first memory macro comprising a first plurality of memory cells that each comprises a first variable resistance dielectric layer with a first geometry parameter; and a second memory macro comprising a second plurality of memory cells that each comprises a second variable resistance dielectric layer with a second geometry parameter, wherein the first geometry parameter is different from the second geometry parameter thereby causing the first and second memory macros to have first and second endurances. The first and second variable resistance dielectric layers are formed using a single process recipe. The first endurance comprises a maximum number of cycles for which the first plurality of memory cells can transition between first and second logical states, and the second endurance comprises a maximum number of cycles for which the second plurality of memory cells can transition between the first and second logical states.
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公开(公告)号:US09196360B2
公开(公告)日:2015-11-24
申请号:US14161193
申请日:2014-01-22
Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
Inventor: Chung-Cheng Chou , Yue-Der Chih
CPC classification number: G11C13/0064 , G11C11/56 , G11C13/0007 , G11C13/0069 , G11C2013/0066 , G11C2013/0078 , G11C2213/79 , H03K17/56
Abstract: A circuit that includes a current source and a current comparator is disclosed. The current source is connected to a resistive memory cell to generate a driving current thereto. The current comparator has a sensing node connected to the current source and the resistive memory cell to sense an injection current injected to the current comparator through the sensing node, wherein when a resistive state of the resistive memory cell switches such that the current comparator determines that an amount of the injection current increases to exceed or decreases to reach threshold value, the current comparator turns off the current source.
Abstract translation: 公开了一种包括电流源和电流比较器的电路。 电流源连接到电阻存储器单元以产生驱动电流。 电流比较器具有连接到电流源和电阻存储器单元的感测节点,以感测通过感测节点注入到电流比较器的注入电流,其中当电阻性存储器单元的电阻状态切换使得电流比较器确定 注入电流的量增加到超过或者减小到达阈值时,电流比较器关闭电流源。
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公开(公告)号:US11423982B2
公开(公告)日:2022-08-23
申请号:US16932736
申请日:2020-07-18
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chung-Cheng Chou
Abstract: A device is disclosed. The device includes a first memory cell, a second memory cell, a first pair of a driver and a sinker, and a second pair of a driver and a sinker. The first memory cell is coupled between the first pair of the driver and the sinker through a first line and a second line. The second memory cell is coupled between the second pair of the driver and the sinker through a third line and a fourth line. The first pair of the driver and the sinker are configured to be controlled to have resistances depending on a row location of the first memory cell in a memory column.
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公开(公告)号:US11024381B2
公开(公告)日:2021-06-01
申请号:US17003761
申请日:2020-08-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Der Chih , Chung-Cheng Chou , Wen-Ting Chu
Abstract: A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
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公开(公告)号:US20190164606A1
公开(公告)日:2019-05-30
申请号:US16158498
申请日:2018-10-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Der CHIH , Chung-Cheng Chou , Wen-Ting Chu
Abstract: A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
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公开(公告)号:US11915754B2
公开(公告)日:2024-02-27
申请号:US18080696
申请日:2022-12-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Der Chih , Chung-Cheng Chou , Wen-Ting Chu
CPC classification number: G11C13/0069 , G11C13/003 , G11C13/004 , G11C13/0026 , G11C13/0028 , H10B63/30 , H10B63/80 , H10B63/84 , H10N70/253 , H10N70/841 , G11C13/0007 , G11C2013/0045 , G11C2013/0054 , G11C2013/0078 , G11C2213/79 , H10N70/20 , H10N70/826 , H10N70/8833
Abstract: A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
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公开(公告)号:US09922962B2
公开(公告)日:2018-03-20
申请号:US15485294
申请日:2017-04-12
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chung-Cheng Chou , Po-Hao Lee , Jonathan Tehan Chen
IPC: F25B21/02 , H01L25/065 , H01L23/38
CPC classification number: H01L25/0657 , F25B21/02 , F25B2321/0212 , H01L23/38 , H01L2225/06513 , H01L2225/06544 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
Abstract: A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.
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公开(公告)号:US09812198B1
公开(公告)日:2017-11-07
申请号:US15416191
申请日:2017-01-26
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chung-Cheng Chou
CPC classification number: G11C13/004 , G11C7/12 , G11C13/0026 , G11C13/0061 , G11C13/0069 , G11C2013/0042 , G11C2013/0054
Abstract: A bit-line of a resistive memory cell includes a reference branch including a reference resistor having a predetermined value and a cell branch including an adjustable memory resistor having a variable value. The reference branch generates a reference current based on the predetermined value of the reference resistor and the cell branch generates a cell branch current based on a selected value of the adjustable memory resistor. A sense amplifier has a first input coupled to the reference branch and a second input coupled to the cell branch. A first pre-charge transistor is coupled to a first pre-charge voltage and the cell branch. The first pre-charge transistor is configured to pre-charge the cell branch to the first pre-charge voltage prior to a read operation.
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公开(公告)号:US09792987B1
公开(公告)日:2017-10-17
申请号:US15216520
申请日:2016-07-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chung-Cheng Chou , Yue-Der Chih , Wen-Ting Chu
IPC: G11C13/00 , H01L27/24 , H01L23/522 , H01L45/00
CPC classification number: G11C13/0069 , G11C11/005 , G11C13/0007 , G11C13/0023 , G11C13/0028 , G11C13/0033 , G11C13/0035 , G11C13/0097 , G11C2013/0073 , G11C2013/0092 , G11C2213/79 , H01L23/522 , H01L27/2436 , H01L27/2463 , H01L45/08 , H01L45/1233 , H01L45/1273 , H01L45/146 , H01L45/1616
Abstract: A memory architecture comprises a first memory macro comprising a first plurality of memory cells, a second memory macro comprising a second plurality of memory cells, and a control logic coupled to the first and second memory macros. The control logic is configured to write a logical state to each of the first and second pluralities of memory cells by using first and second signal levels, respectively, thereby causing the first and second memory macros to be used in first and second applications, respectively, the first and second signal levels being different and the first and second applications being different. The first and second memory macros are formed on a single chip, and wherein the first and second pluralities of the memory cells comprise a variable resistance dielectric layer formed using a single process recipe.
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