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    Sealed implantable medical device and method of forming same
    13.
    发明授权
    Sealed implantable medical device and method of forming same 有权

    公开(公告)号：US11103714B2

    公开(公告)日：2021-08-31

    申请号：US16405032

    申请日：2019-05-07

    申请人： Medtronic, Inc.

    发明人： Michael W. Barror ,  John K. Day ,  David A. Ruben ,  James D. Bradley

    IPC分类号： A61N1/375 ,  A61N1/05 ,  A61N1/372 ,  A61N1/378

    摘要： Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

    NUCLEAR RADIATION PARTICLE POWER CONVERTER
    14.
    发明申请
    NUCLEAR RADIATION PARTICLE POWER CONVERTER 有权

    公开(公告)号：US20210210246A1

    公开(公告)日：2021-07-08

    申请号：US17073712

    申请日：2020-10-19

    申请人： Medtronic, Inc.

    发明人： Andreas Fenner ,  David A. Ruben ,  Anna J. Malin ,  Paul F. Gerrish ,  Bruce C. Fleischhauer ,  Larry E. Tyler

    IPC分类号： G21H1/02 ,  G21H1/06 ,  G21C19/07 ,  G21H1/04

    摘要： Various embodiments of a nuclear radiation particle power converter and method of forming such power converter are disclosed. In one or more embodiments, the power converter can include first and second electrodes, a three-dimensional current collector disposed between the first and second electrodes and electrically coupled to the first electrode, and a charge carrier separator disposed on at least a portion of a surface of the three-dimensional current collector. The power converter can also include a hole conductor layer disposed on at least a portion of the charge carrier separator and electrically coupled to the second electrode, and nuclear radiation-emitting material disposed such that at least one nuclear radiation particle emitted by the nuclear radiation-emitting material is incident upon the charge carrier separator.

    HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES
    19.
    发明申请
    HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES 审中-公开
    密封包装，包括有意义的组装

    公开(公告)号：US20160192524A1

    公开(公告)日：2016-06-30

    申请号：US14966181

    申请日：2015-12-11

    申请人： Medtronic, Inc.

    发明人： David A. Ruben

    IPC分类号： H05K5/06 ,  H05K3/38 ,  A61N1/375 ,  H05K7/06

    CPC分类号： H05K5/066 ,  A61N1/3754 ,  H05K3/38 ,  H05K7/06 ,  H05K2203/107

    摘要： Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    摘要翻译： 公开了密封封装的各种实施例和形成这种封装的方法。 在一个或多个实施例中，密封包装可以包括形成壳体的一部分的壳体和馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点。 外部接触件可以电耦合到布置在通孔中的导电材料。 此外，外部接触可以通过围绕通孔的激光键气密地密封到非导电衬底的外表面。

    IMPLANTABLE MEDICAL DEVICES AND METHODS OF FORMING SAME
    20.
    发明申请
    IMPLANTABLE MEDICAL DEVICES AND METHODS OF FORMING SAME 有权
    可植入医疗装置及其形成方法

    公开(公告)号：US20160184593A1

    公开(公告)日：2016-06-30

    申请号：US14966279

    申请日：2015-12-11

    申请人： Medtronic, Inc.

    发明人： David A. Ruben ,  Michael S. Sandlin

    IPC分类号： A61N1/375 ,  H05K3/42 ,  H05K3/32

    CPC分类号： A61N1/3754 ,  H05K3/32 ,  H05K3/42

    摘要： Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    摘要翻译： 公开了可植入医疗装置系统的各种实施例和形成这种系统的方法。 在一个或多个实施例中，可植入医疗装置系统包括壳体，设置在壳体内的电子装置，以及连接到壳体的侧壁并与电子装置电连接的馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点，其中 外部接触电耦合到布置在通孔中的导电材料。 在一个或多个实施例中，通过围绕通孔的激光键将外部接触件气密地密封到非导电衬底的外表面。