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    SURFACE TEXTURING USING ENERGY PULSES
    4.
    发明申请
    SURFACE TEXTURING USING ENERGY PULSES 有权

    公开(公告)号：US20230120034A1

    公开(公告)日：2023-04-20

    申请号：US18067438

    申请日：2022-12-16

    申请人： Medtronic, Inc.

    发明人： Xiangnan He ,  David A. Ruben

    IPC分类号： B23K26/0622 ,  B23K26/046 ,  B23K26/122 ,  B23K26/12 ,  B23K26/352 ,  B23K26/082

    摘要： A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contain a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

    Sealed package and method of forming same
    5.
    发明授权
    Sealed package and method of forming same 有权

    公开(公告)号：US11419552B2

    公开(公告)日：2022-08-23

    申请号：US17012961

    申请日：2020-09-04

    申请人： Medtronic, Inc.

    发明人： David A. Ruben ,  Craig L. Schmidt

    IPC分类号： H05K5/06 ,  H05K5/02 ,  A61B5/00 ,  A61N1/375 ,  A61N1/372 ,  A61B5/0245 ,  A61N1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40 ,  H05K5/03

    摘要： Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

    ELECTRONIC PACKAGE AND DEVICE INCLUDING SAME
    6.
    发明申请
    ELECTRONIC PACKAGE AND DEVICE INCLUDING SAME 有权

    公开(公告)号：US20220248545A1

    公开(公告)日：2022-08-04

    申请号：US17574362

    申请日：2022-01-12

    申请人： Medtronic, Inc.

    发明人： David A. Ruben ,  Andrew J. Ries ,  Pankti N. Shah ,  Jason D. Hamack

    IPC分类号： H05K5/00 ,  H05K1/18 ,  H02J50/10 ,  A61N1/378

    摘要： Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.

    Hermetically-sealed packages including feedthrough assemblies
    7.
    发明授权
    Hermetically-sealed packages including feedthrough assemblies 有权

    公开(公告)号：US10813238B2

    公开(公告)日：2020-10-20

    申请号：US16192933

    申请日：2018-11-16

    申请人： Medtronic, Inc.

    发明人： David A. Ruben

    IPC分类号： A61N1/375 ,  H05K5/06 ,  H05K3/38 ,  H05K7/06

    摘要： Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    Hermetic conductive feedthroughs for a semiconductor wafer
    8.
    发明授权
    Hermetic conductive feedthroughs for a semiconductor wafer 有权

    公开(公告)号：US10464836B2

    公开(公告)日：2019-11-05

    申请号：US14050415

    申请日：2013-10-10

    申请人： MEDTRONIC, INC.

    发明人： David A. Ruben ,  Michael S. Sandlin

    IPC分类号： C03B23/20 ,  H05K5/00 ,  A61N1/375 ,  H01L23/057 ,  H01L23/10 ,  B81C1/00

    摘要： A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.