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公开(公告)号：US20150068787A1
公开(公告)日：2015-03-12
申请号：US14480250
申请日：2014-09-08
Applicant: INKTEC Co., Ltd.
Inventor： Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Dae Sang Han , Nam-Boo Cho
CPC classification number: H05K3/1258 , H05K1/095 , H05K3/06 , H05K2201/0376 , H05K2201/0382 , H05K2201/09036 , H05K2201/09827 , H05K2203/1173 , Y10T29/49155
Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.
Abstract translation: 这里提供一种导电图案制作方法和导电图案，该方法包括形成一个槽，使得其在入口区域中的宽度大于其在内部区域中的宽度; 用导电油墨组合物填充凹槽; 并干燥导电油墨组合物，使得槽内的导电油墨组合物中所含的溶剂挥发，以减小导电油墨组合物的体积。
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12.发明授权公开(公告)号：US10887997B2
公开(公告)日：2021-01-05
申请号：US15336221
申请日：2016-10-27
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Byung Woong Moon
Abstract: The present disclosure relates to an apparatus for manufacturing flexible printed circuit board (FPCB) and method for manufacturing the FPCB, having no limitations of length of a circuit pattern being formed on a base film.
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公开(公告)号：US10383212B2
公开(公告)日：2019-08-13
申请号：US16025641
申请日：2018-07-02
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Byung Woong Moon
Abstract: The present disclosure relates a printed circuit board having an EMI shielding function. In an example embodiment, the printed circuit board includes a substrate, a signal unit disposed on the substrate, a ground unit disposed in parallel with the signal unit, an insulation layer disposed above the substrate and covering the signal unit and the ground unit, an EMI shielding layer disposed on the insulation layer and under the substrate, respectively, and a shielding bridge passing through the substrate and the insulation layer at opposite sides of the signal unit and electrically connecting the EMI shielding layer disposed on the insulation layer to the EMI shielding layer disposed under the substrate.
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公开(公告)号：US10178773B2
公开(公告)日：2019-01-08
申请号：US14367492
申请日：2012-12-24
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Nam Boo Cho , Young-Koo Han , Myung Bong Yoo , Woong Ku On
Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
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公开(公告)号：US09832882B2
公开(公告)日：2017-11-28
申请号：US14480250
申请日：2014-09-08
Applicant: INKTEC Co., Ltd.
Inventor： Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Dae Sang Han , Nam-Boo Cho
CPC classification number: H05K3/1258 , H05K1/095 , H05K3/06 , H05K2201/0376 , H05K2201/0382 , H05K2201/09036 , H05K2201/09827 , H05K2203/1173 , Y10T29/49155
Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.
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Patent Agency Ranking
16.发明授权公开(公告)号：US09832881B2
公开(公告)日：2017-11-28
申请号：US14785281
申请日：2014-04-18
Applicant: INKTEC CO., LTD.
Inventor： Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Dae sang Han
CPC classification number: H05K3/103 , C09D11/52 , H01B1/22 , H05K1/0274 , H05K1/0296 , H05K1/032 , H05K1/09 , H05K3/002 , H05K3/0055 , H05K3/007 , H05K3/12 , H05K2203/06
Abstract: Provided herein is a method for forming a transparent electrode film for display and the transparent electrode film for display, the method comprising forming an electrode pattern by printing a fine electrode pattern on a release film using a conductive ink composition; forming an insulating layer by applying an insulating resin on the release film on which the electrode pattern has been formed; forming a substrate layer by laminating a substrate on the insulating layer; and removing the release film.
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17.发明申请公开(公告)号：US20160192477A1
公开(公告)日：2016-06-30
申请号：US14902980
申请日：2014-07-07
Applicant: INKTEC Co., Ltd.
Inventor： Kwang-Choon Chung , Ji Hoon Yoo , Joonki Seong , Byung Hun Kim , Nam Boo Cho , Myung-Bong Yoo
CPC classification number: H05K1/0274 , G06F3/041 , G06F2203/04103 , H01L51/445 , H05K1/0213 , H05K1/0289 , H05K1/0298 , H05K1/0306 , H05K1/032 , H05K1/034 , H05K1/0346 , H05K1/097 , H05K3/0026 , H05K3/06 , H05K3/067 , H05K3/12 , H05K3/1258 , H05K2201/0776 , Y02E10/549 , Y02P70/521
Abstract: Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.
Abstract translation: 本发明提供一种制造导电透明基板的方法，该方法包括在基板上形成多个主电极，使得主电极彼此间隔开; 以及形成连接两个或多个主电极的连接电极，使得所述多个主电极被分组成彼此电断开的多个组电极，从而在高过程中产生具有优异透射率的导电透明基板 产量。
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公开(公告)号：US20140125742A1
公开(公告)日：2014-05-08
申请号：US13848263
申请日：2013-03-21
Applicant: Inktec Co., Ltd
Inventor： Kwang-Choon Chung , Chang Soo Yu , Nam Boo Cho , Young Chul Shin , Baek Song Heo , In-Ha Kim , Jae-Won Choi
IPC: B41J2/175
CPC classification number: B41J2/17556 , B41J2/17513 , B41J2/17553
Abstract: Disclosed is an ink cartridge for a printer, comprising a body having an opened surface and a predetermined size to receive ink therein; a cover coupled with the body to define a desired space and having a pressure regulation part for regulating an internal pressure of the body; and a chamber instrument comprising a filling chamber having a body for receiving a part of the ink in the body, a discharging chamber connected with the filling chamber, an ink transferring channel for moving the ink received in the filling chamber to the discharging chamber, an air inducing channel for guiding air to an inside of the cartridge and an air suction valve for selectively passing the guided air.
Abstract translation: 公开了一种用于打印机的墨盒，包括具有开口表面和预定尺寸以在其中接收墨水的主体; 与所述主体联接以限定期望的空间并具有用于调节所述主体的内部压力的压力调节部件的盖子; 以及腔室仪器，其包括具有用于容纳体内的一部分墨水的本体的填充室，与填充室连接的排出室，用于将容纳在填充室中的墨移动到排出室的墨转移通道， 用于将空气引导到筒的内部的空气引导通道和用于选择性地通过引导空气的空气吸入阀。
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公开(公告)号：US11453823B2
公开(公告)日：2022-09-27
申请号：US16487104
申请日：2018-02-20
Applicant: InkTec Co., Ltd.
Inventor： Kwang-Choon Chung , Byung Woong Moon , Su Han Kim , Jae Rin Kim
IPC: C09K13/00 , C23F1/00 , C25D3/38 , C25D5/02 , H05K1/09 , H05K3/06 , H05K3/42 , H05K3/46 , C25D5/10
Abstract: The disclosure relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier member and the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.
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公开(公告)号：US11160171B2
公开(公告)日：2021-10-26
申请号：US16485174
申请日：2018-02-14
Applicant: InkTec Co., Ltd.
Inventor： Kwang-Choon Chung , Su Han Kim , Jung Yoon Moon , Hyeon-Jun Seong , Byung Woong Moon
Abstract: The present invention relates to an etching solution composition for selectively etching only silver, a silver alloy, or a silver compound, and to a circuit forming method using the composition. The circuit forming method according to the present invention is characterized in that, in a substrate material in which an electrically conductive seed layer and a circuit layer are formed of heterogeneous metals, only the seed layer is selectively etched to enable the implementation of fine pitches. In addition, the present invention relates to a circuit forming method and an etching solution composition, wherein only a seed layer of silver (Ag), a silver alloy, or a silver compound is selectively etched without etching a copper (Cu) plated circuit.
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