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    Cooling electronic devices in a data center
    11.
    发明授权
    Cooling electronic devices in a data center 有权

    公开(公告)号：US10681846B2

    公开(公告)日：2020-06-09

    申请号：US15957161

    申请日：2018-04-19

    Applicant: Google LLC

    Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

    IPC: H05K7/20 ,  H01L23/473

    Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

    Methods and heat distribution devices for thermal management of chip assemblies
    12.
    发明授权
    Methods and heat distribution devices for thermal management of chip assemblies 有权

    公开(公告)号：US12278160B2

    公开(公告)日：2025-04-15

    申请号：US18099337

    申请日：2023-01-20

    Applicant: Google LLC

    Inventor： Woon-Seong Kwon ,  Yuan Li ,  Zhi Yang

    IPC: H01L23/373 ,  H01L23/00 ,  H05K3/34 ,  H05K7/20 ,  H01L25/065

    Abstract: According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

    Direct liquid cooling with O-ring sealing
    15.
    发明授权
    Direct liquid cooling with O-ring sealing 有权

    公开(公告)号：US11488890B2

    公开(公告)日：2022-11-01

    申请号：US16880417

    申请日：2020-05-21

    Applicant: Google LLC

    Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

    IPC: H01L23/433 ,  H01L25/065

    Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

    COOLING ELECTRONIC DEVICES IN A DATA CENTER
    17.
    发明申请
    COOLING ELECTRONIC DEVICES IN A DATA CENTER 审中-公开

    公开(公告)号：US20200296862A1

    公开(公告)日：2020-09-17

    申请号：US16890103

    申请日：2020-06-02

    Applicant: Google LLC

    Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

    IPC: H05K7/20

    Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

    Summarizing Events Over a Time Period
    18.
    发明申请
    Summarizing Events Over a Time Period 有权

    公开(公告)号：US20250111674A1

    公开(公告)日：2025-04-03

    申请号：US18420466

    申请日：2024-01-23

    Applicant: Google LLC

    Inventor： Yuan Li ,  Indu Ramamurthi ,  Ryan Kam Wang Tai

    IPC: G06V20/40 ,  G06F40/40 ,  G11B27/031

    Abstract: This document describes systems and techniques for implementing event summarization over a period of time. A request is received to create an event summarization that includes details associated with the event summarization. The systems and techniques identify at least one image relevant to the event summarization based on the details associated with the event summarization. At least one of the identified images is selected that is relevant to the event summarization. The selected images are arranged based on how they will be included in the event summarization. A video summary is created that represents the event summarization and includes the arrangement of the selected images.

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