公开(公告)号：US11564334B2

公开(公告)日：2023-01-24

申请号：US17113461

申请日：2020-12-07

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Avinash Panga

IPC: H05K5/00 ,  H05K7/20 ,  H05K5/02 ,  H05K7/14

Abstract: A server tray assembly includes a server tray support configured to receive a server board that includes a working fluid conduit fluidly coupled to a server board connector disposed on a back plane of the server board, a back wall of the server tray support includes a fluid connector configured to form an unbiased fluid connection with the server board connector; and a locking assembly secured to at least one of a server rack or the server tray support, the locking assembly disposed opposite the fluid connector is configured to engage a portion of the server board to bias the server board toward the fluid connector to fluidly seal the unbiased fluid connection between the server board connector and the fluid connector of the server tray support.

公开(公告)号：US20190327859A1

公开(公告)日：2019-10-24

申请号：US15957161

申请日：2018-04-19

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

IPC: H05K7/20

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

公开(公告)号：US11832396B2

公开(公告)日：2023-11-28

申请号：US16890103

申请日：2020-06-02

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

IPC: H05K3/30 ,  H05K7/20 ,  H01L23/473

CPC classification number: H05K3/30 ,  H05K7/20772 ,  H01L23/473 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/20636

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

公开(公告)号：US20200296862A1

公开(公告)日：2020-09-17

申请号：US16890103

申请日：2020-06-02

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

IPC: H05K7/20

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

公开(公告)号：US20200187388A1

公开(公告)日：2020-06-11

申请号：US16250418

申请日：2019-01-17

Applicant: Google LLC

Inventor： Jerry Chiu ,  Skyler Salman ,  Madhusudan Krishnan Iyengar

IPC: H05K7/20

Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).

公开(公告)号：US20190327860A1

公开(公告)日：2019-10-24

申请号：US15958567

申请日：2018-04-20

Applicant: Google LLC

Inventor： William Edwards ,  Madhusudan Krishnan Iyengar ,  Sundar Rajan ,  Jorge Padilla ,  Norman Paul Jouppi

IPC: H05K7/20

Abstract: A data center cooling system includes a server rack sub-assembly that includes a motherboard mounted on a support member and a heat generating electronic devices mounted on the a motherboard; a cold plate positioned in thermal communication with at least a portion of the heat generating electronic devices, the cold plate configured to receive a flow of a cooling liquid circulated through a supply conduit fluidly coupled to a liquid inlet of the cold plate, through the cold plate, and through a return conduit fluidly coupled to a liquid outlet of the cold plate; and a modulating control valve attached to either of the motherboard or the support member and positioned in either of the supply conduit or the return conduit, the modulating control valve configured to adjust a rate of the flow of the cooling liquid based on an operating condition of at least one of the heat generating electronic devices.

公开(公告)号：US20210068309A1

公开(公告)日：2021-03-04

申请号：US17095554

申请日：2020-11-11

Applicant: Google LLC

Inventor： Jerry Chiu ,  Skyler Salman ,  Madhusudan Krishnan Iyengar

IPC: H05K7/20

Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).

公开(公告)号：US10681846B2

公开(公告)日：2020-06-09

申请号：US15957161

申请日：2018-04-19

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

IPC: H05K7/20 ,  H01L23/473

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

公开(公告)号：US20200100392A1

公开(公告)日：2020-03-26

申请号：US16139789

申请日：2018-09-24

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Avinash Panga

IPC: H05K7/20 ,  H05K7/14 ,  H05K5/02

Abstract: A server tray assembly includes a server tray support configured to receive a server board that includes a working fluid conduit fluidly coupled to a server board connector disposed on a back plane of the server board, a back wall of the server tray support includes a fluid connector configured to form an unbiased fluid connection with the server board connector; and a locking assembly secured to at least one of a server rack or the server tray support, the locking assembly disposed opposite the fluid connector is configured to engage a portion of the server board to bias the server board toward the fluid connector to fluidly seal the unbiased fluid connection between the server board connector and the fluid connector of the server tray support.

公开(公告)号：US20220013435A1

公开(公告)日：2022-01-13

申请号：US17484766

申请日：2021-09-24

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Norman Paul Jouppi ,  Jorge Padilla ,  Christopher Gregory Malone

IPC: H01L23/473 ,  H01L23/367 ,  H01L27/02

Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.