公开(公告)号：US20190327860A1

公开(公告)日：2019-10-24

申请号：US15958567

申请日：2018-04-20

Applicant: Google LLC

Inventor： William Edwards ,  Madhusudan Krishnan Iyengar ,  Sundar Rajan ,  Jorge Padilla ,  Norman Paul Jouppi

IPC: H05K7/20

Abstract: A data center cooling system includes a server rack sub-assembly that includes a motherboard mounted on a support member and a heat generating electronic devices mounted on the a motherboard; a cold plate positioned in thermal communication with at least a portion of the heat generating electronic devices, the cold plate configured to receive a flow of a cooling liquid circulated through a supply conduit fluidly coupled to a liquid inlet of the cold plate, through the cold plate, and through a return conduit fluidly coupled to a liquid outlet of the cold plate; and a modulating control valve attached to either of the motherboard or the support member and positioned in either of the supply conduit or the return conduit, the modulating control valve configured to adjust a rate of the flow of the cooling liquid based on an operating condition of at least one of the heat generating electronic devices.

公开(公告)号：US10468359B2

公开(公告)日：2019-11-05

申请号：US16110133

申请日：2018-08-23

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  TeckGyu Kang

IPC: H05K7/10 ,  H05K7/12 ,  H01L23/00 ,  H05K5/02 ,  H01L23/50 ,  H05K5/00

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

公开(公告)号：US20190237411A1

公开(公告)日：2019-08-01

申请号：US16110133

申请日：2018-08-23

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woonseong Kwon ,  TeckGyu Kang

IPC: H01L23/00 ,  H05K5/02 ,  H05K5/00 ,  H01L23/50

CPC classification number: H01L23/562 ,  H01L23/04 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/50 ,  H05K5/0026 ,  H05K5/0217

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

公开(公告)号：US10083920B1

公开(公告)日：2018-09-25

申请号：US15886246

申请日：2018-02-01

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woon Seong Kwon ,  TeckGyu Kang

IPC: H05K7/10 ,  H05K7/12 ,  H01L23/00 ,  H05K5/00 ,  H01L23/50 ,  H05K5/02

CPC classification number: H01L23/562 ,  H01L23/04 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/50 ,  H05K5/0026 ,  H05K5/0217

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.