公开(公告)号：US20190237411A1

公开(公告)日：2019-08-01

申请号：US16110133

申请日：2018-08-23

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woonseong Kwon ,  TeckGyu Kang

IPC: H01L23/00 ,  H05K5/02 ,  H05K5/00 ,  H01L23/50

CPC classification number: H01L23/562 ,  H01L23/04 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/50 ,  H05K5/0026 ,  H05K5/0217

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.