公开(公告)号：US20230037380A1

公开(公告)日：2023-02-09

申请号：US17971087

申请日：2022-10-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

公开(公告)号：US20210366806A1

公开(公告)日：2021-11-25

申请号：US16879101

申请日：2020-05-20

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Connor Burgess ,  Emad Samadiani ,  Padam Jain ,  Jorge Padilla ,  Feini Zhang ,  Yuan Li

IPC: H01L23/433 ,  F28F9/02 ,  H05K7/20

Abstract: Systems and methods for using spring force based compliance to minimize the bypass liquid flow gaps between the tops of chip microfins and bottom side of manifold ports are disclosed herein. A fluid delivery and exhaust manifold structure provides direct liquid cooling of a module. The manifold sits on top of a chip with flow channels. Inlet and outlet channels of the manifold in contact with flow channels of the chip creates an intricate crossflow path for the coolant resulting in improved heat transfer between the chip and the working fluid. The module is also designed with pressure reduction features using internal leakage flow openings to account for pressure differential between fluid entering and being expelled from the module.

公开(公告)号：US10681846B2

公开(公告)日：2020-06-09

申请号：US15957161

申请日：2018-04-19

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

IPC: H05K7/20 ,  H01L23/473

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

公开(公告)号：US11832396B2

公开(公告)日：2023-11-28

申请号：US16890103

申请日：2020-06-02

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

IPC: H05K3/30 ,  H05K7/20 ,  H01L23/473

CPC classification number: H05K3/30 ,  H05K7/20772 ,  H01L23/473 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/20636

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

公开(公告)号：US11488890B2

公开(公告)日：2022-11-01

申请号：US16880417

申请日：2020-05-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

公开(公告)号：US20200296862A1

公开(公告)日：2020-09-17

申请号：US16890103

申请日：2020-06-02

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

IPC: H05K7/20

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

公开(公告)号：US20190327860A1

公开(公告)日：2019-10-24

申请号：US15958567

申请日：2018-04-20

Applicant: Google LLC

Inventor： William Edwards ,  Madhusudan Krishnan Iyengar ,  Sundar Rajan ,  Jorge Padilla ,  Norman Paul Jouppi

IPC: H05K7/20

Abstract: A data center cooling system includes a server rack sub-assembly that includes a motherboard mounted on a support member and a heat generating electronic devices mounted on the a motherboard; a cold plate positioned in thermal communication with at least a portion of the heat generating electronic devices, the cold plate configured to receive a flow of a cooling liquid circulated through a supply conduit fluidly coupled to a liquid inlet of the cold plate, through the cold plate, and through a return conduit fluidly coupled to a liquid outlet of the cold plate; and a modulating control valve attached to either of the motherboard or the support member and positioned in either of the supply conduit or the return conduit, the modulating control valve configured to adjust a rate of the flow of the cooling liquid based on an operating condition of at least one of the heat generating electronic devices.

公开(公告)号：US20220013435A1

公开(公告)日：2022-01-13

申请号：US17484766

申请日：2021-09-24

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Norman Paul Jouppi ,  Jorge Padilla ,  Christopher Gregory Malone

IPC: H01L23/473 ,  H01L23/367 ,  H01L27/02

Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.

公开(公告)号：US11158566B2

公开(公告)日：2021-10-26

申请号：US16441998

申请日：2019-06-14

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Norman Paul Jouppi ,  Jorge Padilla ,  Christopher Gregory Malone

IPC: H01L23/473 ,  H01L23/367 ,  H01L27/02

Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.

公开(公告)号：US20200100396A1

公开(公告)日：2020-03-26

申请号：US16139377

申请日：2018-09-24

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Jorge Padilla

IPC: H05K7/20

Abstract: This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.