公开(公告)号：US11990386B2

公开(公告)日：2024-05-21

申请号：US17333570

申请日：2021-05-28

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Christopher Malone ,  Woon-Seong Kwon ,  Emad Samadiani ,  Melanie Beauchemin ,  Padam Jain ,  Teckgyu Kang ,  Yuan Li ,  Connor Burgess ,  Norman Paul Jouppi ,  Nicholas Stevens-Yu ,  Yingying Wang

IPC: H01L23/00 ,  H01L23/373 ,  H05K3/34 ,  H05K7/20 ,  H01L25/065

CPC classification number: H01L23/3732 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H05K3/3436 ,  H05K7/20254 ,  H01L25/0655 ,  H01L2223/58 ,  H01L2224/32 ,  H01L2224/32245 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2203/041

Abstract: A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

公开(公告)号：US11664329B2

公开(公告)日：2023-05-30

申请号：US16877730

申请日：2020-05-19

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Emad Samadiani ,  Yuan Li

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/473

CPC classification number: H01L23/562 ,  H01L23/16 ,  H01L23/473

Abstract: A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.

公开(公告)号：US11488890B2

公开(公告)日：2022-11-01

申请号：US16880417

申请日：2020-05-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

公开(公告)号：US20210366841A1

公开(公告)日：2021-11-25

申请号：US16877730

申请日：2020-05-19

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Emad Samadiani ,  Yuan Li

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/473

Abstract: A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.

公开(公告)号：US20240347414A1

公开(公告)日：2024-10-17

申请号：US18634198

申请日：2024-04-12

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Christopher Malone ,  Woon-Seong Kwon ,  Emad Samadiani ,  Melanie Beauchemin ,  Padam Jain ,  Teckgyu Kang ,  Yuan Li ,  Connor Burgess ,  Norman Paul Jouppi ,  Nicholas Stevens-Yu ,  Yingying Wang

IPC: H01L23/373 ,  H01L23/00 ,  H01L25/065 ,  H05K3/34 ,  H05K7/20

CPC classification number: H01L23/3732 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H05K3/3436 ,  H05K7/20254 ,  H01L25/0655 ,  H01L2223/58 ,  H01L2224/32 ,  H01L2224/32245 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2203/041

Abstract: A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

公开(公告)号：US20230037380A1

公开(公告)日：2023-02-09

申请号：US17971087

申请日：2022-10-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

公开(公告)号：US20210366806A1

公开(公告)日：2021-11-25

申请号：US16879101

申请日：2020-05-20

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Connor Burgess ,  Emad Samadiani ,  Padam Jain ,  Jorge Padilla ,  Feini Zhang ,  Yuan Li

IPC: H01L23/433 ,  F28F9/02 ,  H05K7/20

Abstract: Systems and methods for using spring force based compliance to minimize the bypass liquid flow gaps between the tops of chip microfins and bottom side of manifold ports are disclosed herein. A fluid delivery and exhaust manifold structure provides direct liquid cooling of a module. The manifold sits on top of a chip with flow channels. Inlet and outlet channels of the manifold in contact with flow channels of the chip creates an intricate crossflow path for the coolant resulting in improved heat transfer between the chip and the working fluid. The module is also designed with pressure reduction features using internal leakage flow openings to account for pressure differential between fluid entering and being expelled from the module.

公开(公告)号：US12243802B2

公开(公告)日：2025-03-04

申请号：US18634198

申请日：2024-04-12

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Christopher Malone ,  Woon-Seong Kwon ,  Emad Samadiani ,  Melanie Beauchemin ,  Padam Jain ,  Teckgyu Kang ,  Yuan Li ,  Connor Burgess ,  Norman Paul Jouppi ,  Nicholas Stevens-Yu ,  Yingying Wang

IPC: H01L23/00 ,  B23K1/00 ,  H01L23/373 ,  H05K3/34 ,  H05K7/20 ,  H01L25/065

Abstract: A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

公开(公告)号：US20230260931A1

公开(公告)日：2023-08-17

申请号：US18139025

申请日：2023-04-25

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Emad Samadiani ,  Yuan Li

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/473

CPC classification number: H01L23/562 ,  H01L23/16 ,  H01L23/473

Abstract: A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.

公开(公告)号：US20210366807A1

公开(公告)日：2021-11-25

申请号：US16880417

申请日：2020-05-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.