公开(公告)号：US20190327860A1

公开(公告)日：2019-10-24

申请号：US15958567

申请日：2018-04-20

Applicant: Google LLC

Inventor： William Edwards ,  Madhusudan Krishnan Iyengar ,  Sundar Rajan ,  Jorge Padilla ,  Norman Paul Jouppi

IPC: H05K7/20

Abstract: A data center cooling system includes a server rack sub-assembly that includes a motherboard mounted on a support member and a heat generating electronic devices mounted on the a motherboard; a cold plate positioned in thermal communication with at least a portion of the heat generating electronic devices, the cold plate configured to receive a flow of a cooling liquid circulated through a supply conduit fluidly coupled to a liquid inlet of the cold plate, through the cold plate, and through a return conduit fluidly coupled to a liquid outlet of the cold plate; and a modulating control valve attached to either of the motherboard or the support member and positioned in either of the supply conduit or the return conduit, the modulating control valve configured to adjust a rate of the flow of the cooling liquid based on an operating condition of at least one of the heat generating electronic devices.