公开(公告)号：US11600548B2

公开(公告)日：2023-03-07

申请号：US17333607

申请日：2021-05-28

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Yuan Li ,  Zhi Yang

IPC: H01L23/373 ,  H01L23/00 ,  H05K3/34 ,  H05K7/20 ,  H01L25/065

Abstract: According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

公开(公告)号：US20210375715A1

公开(公告)日：2021-12-02

申请号：US17333607

申请日：2021-05-28

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Yuan Li ,  Zhi Yang

IPC: H01L23/373 ,  H01L23/00

Abstract: According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

公开(公告)号：US20230230896A1

公开(公告)日：2023-07-20

申请号：US18099337

申请日：2023-01-20

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Yuan Li ,  Zhi Yang

IPC: H01L23/373 ,  H01L23/00 ,  H05K3/34 ,  H05K7/20

CPC classification number: H01L23/3732 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H05K3/3436 ,  H05K7/20254 ,  H01L2223/58 ,  H01L2224/32 ,  H01L25/0655

Abstract: According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

公开(公告)号：US12278160B2

公开(公告)日：2025-04-15

申请号：US18099337

申请日：2023-01-20

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Yuan Li ,  Zhi Yang

IPC: H01L23/373 ,  H01L23/00 ,  H05K3/34 ,  H05K7/20 ,  H01L25/065

Abstract: According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.