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公开(公告)号：US09740073B2
公开(公告)日：2017-08-22
申请号：US15007912
申请日：2016-01-27
Inventor： Ji-Young Oh , Jae Bon Koo , Joo Yeon Kim , Bock Soon Na , Chan Woo Park , Sang Seok Lee , Soon-Won Jung , Hye Yong Chu
CPC classification number: G02F1/155 , G02F1/15 , G02F1/153 , G02F1/157 , G02F2001/1552 , G02F2001/1555 , G02F2201/44 , G09G3/38
Abstract: Provided is a complex display device Including a first substrate and an opposed second substrate, a first electrode, an electrochromic layer, a common electrode, an emission part and a second electrode, laminated between the first substrate and the second substrate one by one, and an organic layer disposed between the first electrode and the electrochromic layer, or between the electrochromic layer and the common electrode. The organic layer of the complex display device may include at least one of a hole injection material, a hole transport material and a mixture thereof, or at least one of an electron injection material, an electron transport material or a mixture thereof.
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公开(公告)号：US11789576B2
公开(公告)日：2023-10-17
申请号：US17903145
申请日：2022-09-06
Inventor： Chan Woo Park , Sang Hoon Cheon , Tae-Youb Kim , Bock Soon Na , Ji-Young Oh , Su Jae Lee
IPC: G06F3/044
CPC classification number: G06F3/0446 , G06F2203/04102 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112
Abstract: Provided is a flexible touch panel. The flexible touch panel includes a first sensor part extending in a first direction on a substrate, a second sensor part extending in a second direction crossing the first direction on the substrate, and a protective layer surrounding the first and second sensor parts, wherein the first sensor part includes first sensor patterns spaced apart from each other in the first direction, a first connection electrode disposed between the first sensor patterns adjacent to each other, and first connection patterns connecting the first connection electrode and the first sensor patterns to each other, wherein each of the first sensor patterns includes first electrode patterns spaced apart from each other in a form of a mesh and first wiring patterns connecting the adjacent first electrode patterns to each other, wherein each of the first wiring patterns and the first connection patterns has a serpentine structure, wherein the first electrode patterns and the first wiring patterns include the same material as each other.
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公开(公告)号：US09345123B2
公开(公告)日：2016-05-17
申请号：US13934635
申请日：2013-07-03
Inventor： Yong Suk Yang , In-Kyu You , Minseok Kim , Soon-Won Jung , Bock Soon Na , Sang Chul Lim
IPC: H05K3/02 , H05K3/10 , H05K1/02 , H05K3/00 , H05K3/20 , H01L51/00 , H05K1/03 , H01L51/10 , H01L51/44 , H01L51/52
CPC classification number: H05K1/02 , H01L51/0022 , H01L51/003 , H01L51/102 , H01L51/441 , H01L51/5203 , H05K1/0393 , H05K3/0058 , H05K3/207 , H05K2201/0376
Abstract: A method for manufacturing a planarized printed electronic device includes performing a surface treatment on a base substrate to provide a surface treated base substrate and facilitate release during a delamination process; printing a layer having an electrode pattern onto the surface-treated base substrate; forming an organic material layer comprised of an organic material on the base substrate on which the printed layer is printed such that the printed layer is embedded therein to provide an embedded layer; providing a target substrate onto which the embedded layer is to be transferred; laminating by sandwiching the embedded layer between the base substrate on which the embedded layer is formed and the target substrate; delaminating by detaching the embedded layer from the base substrate; and transferring the printed layer onto the target substrate to provide a planarized printed layer. Large areas with reduced defects due to surface roughness are possible.
Abstract translation: 制造平面化印刷电子器件的方法包括在基底基板上进行表面处理以提供经表面处理的基底基板，并在分层过程中促进释放; 将具有电极图案的层印刷到经表面处理的基底上; 在所述基底基板上形成有机材料层，所述有机材料层在所述基底基板上印刷所述印刷层，使得所述印刷层嵌入其中以提供嵌入层; 提供要在其上传输嵌入层的目标衬底; 通过将嵌入层夹在其上形成有嵌入层的基底基板与靶基板之间进行层压; 通过从基底衬底分离嵌入层来分层; 并将印刷层转印到目标衬底上以提供平坦化的印刷层。 由于表面粗糙度而导致缺陷减少的大面积是可能的。
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14.发明授权公开(公告)号：US09331126B2
公开(公告)日：2016-05-03
申请号：US14280578
申请日：2014-05-17
Inventor： Sang Seok Lee , Kyoung Ik Cho , Bock Soon Na , Sang Chul Lim , Chan Woo Park , Soon-Won Jung , Jae Bon Koo , Hye Yong Chu
CPC classification number: H01L27/3244 , H01L51/003 , H01L51/0094 , H01L51/0097 , H01L51/56 , Y02E10/549
Abstract: Provided is a method for fabricating a flexible display device. The method includes attaching a shape memory alloy film memorizing a shape thereof as a curved shape at a shape memory temperature or lower to a flexible substrate at a temperature higher than the shape memory temperature, forming a display device on the flexible substrate, and returning the shape memory alloy to the curved shape to remove the shape memory alloy film from the flexible substrate.
Abstract translation: 提供一种制造柔性显示装置的方法。 该方法包括将形状记忆合金膜在高于形状记忆温度的温度下将其形状记忆温度保持为形状记忆温度以下的形状记忆合金薄膜，形成柔性基板，在柔性基板上形成显示装置， 形状记忆合金到弯曲形状，以从柔性基底去除形状记忆合金膜。
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15.发明授权公开(公告)号：US09276119B2
公开(公告)日：2016-03-01
申请号：US14243768
申请日：2014-04-02
Inventor： Ji-Young Oh , Jae Bon Koo , Sang Chul Lim , Chan Woo Park , Soon-Won Jung , Bock Soon Na , Sang Seok Lee , Hye Yong Chu
IPC: H01L29/786 , B29C59/02 , B29C43/02 , B29C71/04 , B29C43/18 , B29C43/20 , B29K75/00 , B29K21/00 , B29K83/00 , B29C35/02
CPC classification number: H01L29/78603 , B29C35/0266 , B29C43/021 , B29C43/18 , B29C43/203 , B29C59/02 , B29C71/04 , B29K2021/00 , B29K2075/00 , B29K2083/00 , H01L27/1218 , H01L27/1225 , H01L27/1262 , H01L29/7869 , Y10T428/19
Abstract: Provided is a method of manufacturing a gradually stretchable substrate. The method includes forming convex regions and concave regions on a top surface of a stretchable substrate by compressing a mold onto the stretchable substrate and forming non-stretchable patterns by filling the concave regions of the stretchable substrate. The stretchable substrate includes a stretchable region defined by the non-stretchable patterns, the non-stretchable patterns have side surfaces in contact with the stretchable region, and the side surfaces of the non-stretchable patterns are formed of protrusions and a non-protrusion between the protrusions repetitively connected to one another.
Abstract translation: 提供一种制造逐渐拉伸基材的方法。 该方法包括通过将模具压缩到可拉伸基底上并在可伸缩基底的凹部填充而形成不可拉伸图案，在可拉伸基底的顶表面上形成凸区域和凹区域。 可拉伸基材包括由不可拉伸图案限定的可拉伸区域，不可拉伸图案具有与可拉伸区域接触的侧表面，并且不可拉伸图案的侧表面由突起和非伸缩图案之间的非突起形成 突起重复地彼此连接。
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Patent Agency Ranking
16.发明申请ACTIVE CLICHE FOR LARGE-AREA PRINTING, MANUFACTURING METHOD OF THE SAME, AND PRINTING METHOD USING THE SAME 有权用于大面积打印的主动夹层及其制造方法及使用其的印刷方法公开(公告)号：US20140063124A1
公开(公告)日：2014-03-06
申请号：US13966336
申请日：2013-08-14
Inventor： Yong Suk Yang , In-Kyu You , Soon-Won Jung , Bock Soon Na , Seok-Hwan Moon
CPC classification number: B41J2/1626 , B41J2/06 , B41J2/14 , B41J2/16 , B41J2/162 , B41J2/1621 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/1642 , B41J2/1646 , B41J2202/04
Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.
Abstract translation: 提供了一种大面积纳米级活性印刷装置及其制造方法，以及使用其的印刷方法。 打印装置可以包括基板，沿着第一方向延伸的第一互连线，在基板上，设置在第一互连线上的具有部分地暴露第一互连线的孔的层间电介质层，邻近孔的第二互连线 所述层间电介质层与所述第一互连线交叉，以及设置在与所述第一和第二互连线交叉并与所述第一互连线连接的楔形电极。 楔形电极在孔的中心向上突出。
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公开(公告)号：US10026844B2
公开(公告)日：2018-07-17
申请号：US15461567
申请日：2017-03-17
Inventor： Kyoung Ik Cho , Jae Bon Koo , Chan Woo Park , Bock Soon Na , Sang Seok Lee , Sang Chul Lim , Soon-Won Jung , Hye Yong Chu
IPC: H01L29/10 , H01L29/786 , H01L29/66 , H01L27/12 , H01L21/3105 , H01L21/311
Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
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18.发明授权公开(公告)号：US09865559B2
公开(公告)日：2018-01-09
申请号：US15220145
申请日：2016-07-26
Inventor： Chan Woo Park , Jae Bon Koo , Bock Soon Na , Rae-Man Park , Ji-Young Oh , Sang Seok Lee , Soon-Won Jung
IPC: H01L23/00 , H01L21/683
CPC classification number: H01L24/43 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L2221/6835 , H01L2224/24137 , H01L2924/00014 , H01L2224/45099
Abstract: Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.
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公开(公告)号：US09634120B2
公开(公告)日：2017-04-25
申请号：US14610410
申请日：2015-01-30
Inventor： Kyoung Ik Cho , Jae Bon Koo , Chan Woo Park , Bock Soon Na , Sang Seok Lee , Sang Chul Lim , Soon-Won Jung , Hye Yong Chu
IPC: H01L29/10 , H01L29/66 , H01L29/786 , H01L27/12 , H01L21/3105
CPC classification number: H01L29/78603 , H01L21/3105 , H01L21/31058 , H01L21/31144 , H01L27/1218 , H01L27/1266 , H01L29/66742
Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
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公开(公告)号：US08912094B2
公开(公告)日：2014-12-16
申请号：US13846437
申请日：2013-03-18
Inventor： Jae Bon Koo , Chan Woo Park , Soon-Won Jung , Sang Chul Lim , Ji-Young Oh , Bock Soon Na , Hye Yong Chu
IPC: H01L21/44 , H01L21/768
CPC classification number: H01L29/78603 , H01L27/1218 , H01L27/1262
Abstract: Provided is a method for manufacturing a stretchable thin film transistor. The method for manufacturing a stretchable thin film transistor includes forming a mold substrate, forming a stretchable insulator on the mold substrate, forming a flat substrate on the stretchable insulator, removing the mold substrate, forming discontinuous and corrugated wires on the stretchable insulator, forming a thin film transistor connected between the wires, and removing the flat substrate.
Abstract translation: 提供一种制造可拉伸薄膜晶体管的方法。 制造可伸缩薄膜晶体管的方法包括：在模具基板上形成模具基板，形成可拉伸绝缘体，在可伸缩绝缘体上形成平坦的基板，去除模具基板，在可拉伸的绝缘体上形成不连续的和波纹的导线， 连接在电线之间的薄膜晶体管，以及去除平坦的基板。
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