Combined susceptor, support, and lift system

    公开(公告)号:USD1031676S1

    公开(公告)日:2024-06-18

    申请号:US29760951

    申请日:2020-12-04

    摘要: FIG. 1 is a front perspective view of a combined susceptor, support, and lift system;
    FIG. 2 is a back perspective view thereof;
    FIG. 3 is a side view thereof;
    FIG. 4 is a cross-sectional view taken along line 4-4 as indicated in FIG. 3;
    FIG. 5 is an enlarged view of FIG. 4 shown without broken line environmental subject matter for clarity of the claimed subject matter;
    FIG. 6 is a top perspective view of the lift pin thereof;
    FIG. 7 is a bottom perspective view of the lift pin thereof;
    FIG. 8 is a front view of the lift pin thereof;
    FIG. 9 is a back view of the lift pin thereof;
    FIG. 10 is a left view of the lift pin thereof;
    FIG. 11 is a right view of the lift pin thereof;
    FIG. 12 is a top view of the lift pin thereof; and,
    FIG. 13 is a bottom view of the lift pin thereof.
    The dash-dash broken lines within the shaded area and the dash-dash broken lines in FIGS. 1-13 depicting various components of the susceptor, support, and lift system are for the purpose of illustrating environmental subject matter and portions of the article that form no part of the claimed design. The dot-dash broken line in FIG. 3 is for the purpose of defining the cross-sectional view shown in FIG. 4.

    LIFT PIN ACTUATORS FOR SEMICONDUCTOR PROCESSING SYSTEMS AND RELATED METHODS

    公开(公告)号:US20240112946A1

    公开(公告)日:2024-04-04

    申请号:US18476067

    申请日:2023-09-27

    IPC分类号: H01L21/687 C23C16/458

    CPC分类号: H01L21/68742 C23C16/4585

    摘要: A lift pin actuator includes a castellated annulus, a first arm, a second arm, and a pin pad. The annulus arranged along a rotation axis and has a first merlon and a second merlon circumferentially separated by a crenel. The first arm is connected to the first merlon and extends outward from the annulus, the second arm is connected to the second merlon and extends outward from the annulus, and the second arm is circumferentially spaced from the first arm by a radial gap. The pin pad is connected to the annulus by the first arm and the second arm, is radially spaced from the annulus by the radial gap, and radially overlaps the crenel to nest a support member within the lift pin actuator during translation of the lift pin actuator along the rotation axis relative to the support member. Process kits, semiconductor processing systems, methods of making lift pin actuators and related material layer deposition methods are also described.

    SUBSTRATE SUPPORTS FOR SEMICONDUCTOR PROCESSING SYSTEMS

    公开(公告)号:US20230128390A1

    公开(公告)日:2023-04-27

    申请号:US18048099

    申请日:2022-10-20

    IPC分类号: H01L21/687

    摘要: A substrate support includes a disc body with an upper surface and an opposite lower surface arranged along a rotation axis. The upper surface has a circular concave portion extending about the rotation axis, an annular ledge portion extending circumferentially about the concave portion, and an annular rim portion extending circumferentially about the ledge portion connecting to the concave portion of the disc body by the ledge portion of the disc body. The ledge portion slopes downward radially outward from the rotation axis to seat a substrate on the disc body such that a beveled edge of the substrate is cantilevered above the ledge portion of the upper surface of the disc body. Substrate support assemblies, semiconductor processing systems, and film deposition methods are also described.

    FIXTURE AND METHOD FOR DETERMINING POSITION OF A TARGET IN A REACTION CHAMBER

    公开(公告)号:US20220189804A1

    公开(公告)日:2022-06-16

    申请号:US17549311

    申请日:2021-12-13

    摘要: A fixture includes a frame, a leveling plate, a bracket, and a laser profiler. The frame is arranged for fixation above a reaction chamber arranged to deposit a film onto a substrate. The leveling plate is supported on the frame. The bracket is supported on the leveling plate. The laser profiler is suspended from the bracket, overlays the reaction chamber, and has a field of view that extends through the leveling plate and the frame to determine position of a target within the reaction chamber. Semiconductor processing systems and methods of determining position of targets within reaction chambers in semiconductor processing systems are also described.

    Susceptor
    18.
    外观设计

    公开(公告)号:USD1030687S1

    公开(公告)日:2024-06-11

    申请号:US29840698

    申请日:2022-05-31

    摘要: FIG. 1 is a front perspective view of a susceptor, showing our new design;
    FIG. 2 is a bottom perspective view thereof;
    FIG. 3 is right side view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is front view thereof;
    FIG. 6 is back view thereof;
    FIG. 7 is a top view thereof; and,
    FIG. 8 is a bottom view thereof.

    Semiconductor deposition reactor ring

    公开(公告)号:USD1028913S1

    公开(公告)日:2024-05-28

    申请号:US29797476

    申请日:2021-06-30

    摘要: FIG. 1 is a top perspective view of a semiconductor deposition reactor ring;
    FIG. 2 is a bottom perspective view thereof;
    FIG. 3 is a front view thereof;
    FIG. 4 is a back view thereof;
    FIG. 5 is a left view thereof;
    FIG. 6 is a right view thereof;
    FIG. 7 is a top view thereof; and,
    FIG. 8 is a bottom view thereof.
    The broken lines in the drawings illustrate portions of the semiconductor deposition reactor ring that form no part of the claimed design.

    SUBSTRATE SUPPORTS, SEMICONDUCTOR PROCESSING SYSTEMS, AND MATERIAL LAYER DEPOSITION METHODS

    公开(公告)号:US20230386874A1

    公开(公告)日:2023-11-30

    申请号:US18324411

    申请日:2023-05-26

    摘要: A substrate support includes a disc body with upper and lower surfaces spaced apart by a thickness. The upper surface has a circular concavity extending about a rotation axis, an annular ledge portion radially outward of the concavity extending circumferentially about the concavity, and an annular rim portion radially outward of the ledge portion extending circumferentially about the ledge portion. The concavity has a circular perforated portion and an annular unperforated portion. The perforated portion extends about the rotation axis and defines two or more perforations to issue an etchant into a cavity defined between the concavity and a backside of a substrate seated on the substrate support. The unperforated portion is radially outward of the perforated portion and extends circumferentially about the perforated portion to limit etching of the backside of the substrate by the etchant. Semiconductor processing systems and material layer deposition methods are also described.