- 专利标题: HIGH-THROUGHPUT SILICON CARBIDE REACTOR
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申请号: US18523021申请日: 2023-11-29
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公开(公告)号: US20240175130A1公开(公告)日: 2024-05-30
- 发明人: Hichem M’Saad , Ivo Johannes Raaijmakers , Xing Lin , Wentao Wang , Herbert Terhorst
- 申请人: ASM IP Holding B.V.
- 申请人地址: NL Almere
- 专利权人: ASM IP Holding B.V.
- 当前专利权人: ASM IP Holding B.V.
- 当前专利权人地址: NL Almere
- 主分类号: C23C16/455
- IPC分类号: C23C16/455 ; C23C16/44 ; H01L21/67 ; H01L21/677
摘要:
Methods and systems for growing silicon carbide epitaxial layers are described. In one example, a reactor system with multiple reactor modules may include a heating load/lock chamber and a cooling load/lock chamber. In another example, a reactor may be heated by separate sets of coils inductively heating a susceptor, which heats graphite near one or more wafers. Multiple pyrometers may measure the temperature of the graphite walls at different locations. Based on temperature differences and/or temperature gradients, a temperature controller may adjust power provided to one or more sets of coils. In yet another example, separations between a wafer carrier and a wafer may be adjusted.
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