公开(公告)号：US20230023235A1

公开(公告)日：2023-01-26

申请号：US17477413

申请日：2021-09-16

Applicant: Applied Materials, Inc.

Inventor： Xi CEN ,  Yun TAEWOONG ,  Shirish A. PETHE ,  Kai WU ,  Nobuyuki SASAKI ,  Wei LEI

IPC: H01L21/768

Abstract: Embodiments of methods and associated apparatus for filling a feature in a substrate are provided herein. In some embodiments, a method of filling a feature in a substrate includes: depositing a seed layer of tungsten nitride in the feature via a physical vapor deposition (PVD) process; depositing a liner layer of tungsten on the seed layer of tungsten nitride in the feature via a PVD process; and subsequently filling the feature with a tungsten bulk fill via a chemical vapor deposition (CVD) process.

公开(公告)号：US20220380888A1

公开(公告)日：2022-12-01

申请号：US17334630

申请日：2021-05-28

Applicant: Applied Materials, Inc.

Inventor： Goichi YOSHIDOME ,  Suhas BANGALORE UMESH ,  Sushil Arun SAMANT ,  Martin Lee RIKER ,  Wei LEI ,  Kishor Kumar KALATHIPARAMBIL ,  Shirish A. PETHE ,  Fuhong ZHANG ,  Prashanth KOTHNUR ,  Andrew TOMKO

IPC: C23C14/35 ,  H01J37/34

Abstract: Methods of processing a substrate in a PVD chamber are provided herein. In some embodiments, a method of processing a substrate in a PVD chamber, includes: sputtering material from a target disposed in the PVD chamber and onto a substrate, wherein at least some of the material sputtered from the target is guided to the substrate through a magnetic field provided by one or more upper magnets disposed about a processing volume of the PVD chamber above a support pedestal for the substrate in the PVD chamber, one or more first magnets disposed about the support pedestal and providing an increased magnetic field strength at an edge region of the substrate, and one or more second magnets disposed below the support pedestal that increase a magnetic field strength at a central region of the substrate.

公开(公告)号：US20210320034A1

公开(公告)日：2021-10-14

申请号：US16845749

申请日：2020-04-10

Applicant: APPLIED MATERIALS, INC.

Inventor： Wei LEI ,  Yi XU ,  Yu LEI ,  Tae Hong HA ,  Raymond HUNG ,  Shirish A. PETHE

IPC: H01L21/768 ,  H01L21/285 ,  H01L21/3213

Abstract: Methods and apparatus for selectively depositing a tungsten layer atop a dielectric surface. In embodiments the method includes: depositing a tungsten layer via a physical vapor deposition (PVD) process atop a substrate field and atop a sidewall and a dielectric bottom surface of a feature disposed in a substrate to form a first tungsten portion having a first thickness atop the substrate field, a second tungsten portion having a second thickness atop the sidewall, and a third tungsten portion having a third thickness atop the dielectric bottom surface, wherein the second thickness is less than the first thickness and third thickness; oxidizing a top surface of the tungsten layer to form a first oxidized tungsten portion atop the substrate field, a second oxidized tungsten portion atop the side wall, and a third oxidized tungsten portion atop the dielectric bottom surface; removing the first oxidized tungsten portion, the second oxidized tungsten portion and the third oxidized tungsten portion, wherein the second tungsten portion is completely removed from the sidewall; and passivating or completely removing the first tungsten portion from the substrate field.

公开(公告)号：US20200071816A1

公开(公告)日：2020-03-05

申请号：US16557086

申请日：2019-08-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Wei LEI ,  Jeffrey ANTHIS

IPC: C23C16/16 ,  C23C16/08 ,  C23C16/02 ,  C23C16/44

Abstract: Methods for selectively depositing a layer atop a substrate having a metal surface and a dielectric surface are provided including contacting the substrate and metal surface with molybdenum hexacarbonyl to selectively deposit a molybdenum layer atop the metal surface of the substrate, wherein the dielectric layer inhibits deposition of the molybdenum layer atop the dielectric surface. In embodiments, contacting the substrate and metal surface with molybdenum hexacarbonyl is performed at a low temperature such as below 150 degrees Celsius or about 105 to about 125 degrees Celsius.

公开(公告)号：US20240194527A1

公开(公告)日：2024-06-13

申请号：US18197846

申请日：2023-05-16

Applicant: Applied Materials, Inc.

Inventor： Sahil Jaykumar PATEL ,  Xianyuan ZHAO ,  Wei LEI ,  Aixi ZHANG ,  Yi XU ,  Yu LEI

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L21/76877 ,  H01L21/76843 ,  H01L21/76855 ,  H01L23/53266

Abstract: Methods and apparatus for processing a substrate are provided. In some embodiments, a method includes depositing an amorphous interlayer atop a first layer on a substrate, wherein the first layer is a metal-containing layer, and depositing a metal layer atop the amorphous interlayer.

公开(公告)号：US20230343644A1

公开(公告)日：2023-10-26

申请号：US18070383

申请日：2022-11-28

Applicant: Applied Materials, Inc.

Inventor： Chih-Hsun HSU ,  Shiyu YUE ,  Jiang LU ,  Rongjun WANG ,  Xianmin TANG ,  Zhenjiang CUI ,  Chi Hong CHING ,  Meng-Shan WU ,  Chun-chieh WANG ,  Wei LEI ,  Yu LEI

IPC: H01L21/768 ,  H01L21/67 ,  H01L23/532

CPC classification number: H01L21/76877 ,  H01L21/67063 ,  H01L21/6719 ,  H01L21/76843 ,  H01L21/76871 ,  H01L23/53266

Abstract: A method and apparatus for a gap-fill in semiconductor devices are provided. The method includes forming a metal seed layer on an exposed surface of the substrate, wherein the substrate has features in the form of trenches or vias formed in a top surface of the substrate, the features having sidewalls and a bottom surface extending between the sidewalls. A gradient oxidation process is performed in a first process chamber to oxidize exposed portions of the metal seed layer to form a metal oxide, wherein the gradient oxidation process preferentially oxidizes a field region of the substrate over the bottom surface of the features. An etch back process is performed in the first process chamber removes or reduces the oxidized portion of the seed layer. A metal gap-fill process fills or partially fills the features with a gap fill material.

公开(公告)号：US20230343643A1

公开(公告)日：2023-10-26

申请号：US17868475

申请日：2022-07-19

Applicant: Applied Materials, Inc.

Inventor： Chih-Hsun HSU ,  Shiyu YUE ,  Wei LEI ,  Yi XU ,  Jiang LU ,  Yu LEI ,  Ziye XIONG ,  Tsung-Han YANG ,  Zhimin QI ,  Aixi ZHANG ,  Jie ZHANG ,  Liqi WU ,  Rongjun WANG ,  Shihchung CHEN ,  Meng-Shan WU ,  Chun-Chieh WANG ,  Annamalai LAKSHMANAN ,  Yixiong YANG ,  Xianmin TANG

IPC: H01L21/768 ,  H01L23/522

CPC classification number: H01L21/76877 ,  H01L21/76876 ,  H01L21/76843 ,  H01L21/76865 ,  H01L23/5226 ,  H01L21/76826

Abstract: A method and apparatus for a gap-fill in semiconductor devices are provided. The method includes forming a metal seed layer on an exposed surface of the substrate, wherein the substrate has features in the form of trenches or vias formed in a top surface of the substrate, the features having sidewalls and a bottom surface extending between the sidewalls. A gradient oxidation process is performed to oxidize exposed portions of the metal seed layer to form a metal oxide, wherein the gradient oxidation process preferentially oxidizes a field region of the substrate over the bottom surface of the features. An etch back process removes or reduces the oxidized portion of the seed layer. A metal gap-fill process fills or partially fills the features with a gap fill material.

公开(公告)号：US20230326791A1

公开(公告)日：2023-10-12

申请号：US17718242

申请日：2022-04-11

Applicant: Applied Materials, Inc.

Inventor： Zhimin QI ,  Yi XU ,  Shirish A. PETHE ,  Xingyao GAO ,  Shiyu YUE ,  Aixi ZHANG ,  Wei LEI ,  Yu LEI ,  Geraldine VASQUEZ ,  Dien-yeh WU ,  Da HE

IPC: H01L21/768 ,  H01L21/285 ,  C23C14/18 ,  C23C16/14

CPC classification number: H01L21/76879 ,  H01L21/2855 ,  H01L21/28562 ,  H01L21/28568 ,  C23C14/18 ,  C23C16/14

Abstract: Embodiments of methods and associated apparatus for filling a feature in a substrate are provided herein. In some embodiments, a method of depositing tungsten in features of a substrate includes: depositing a seed layer consisting essentially of tungsten in the features via a physical vapor deposition (PVD) process; and depositing a bulk layer consisting essentially of tungsten in the features via a chemical vapor deposition (CVD) process to fill the features such that the deposition of the bulk layer is selective to within the features as compared to a field region of the substrate, wherein the CVD process is performed by flowing hydrogen gas (H2) at a first flow rate and a tungsten precursor at a second flow rate, and wherein the first flow rate is less than the second flow rate.