-
公开(公告)号：US20210336370A1
公开(公告)日：2021-10-28
申请号：US17230649
申请日：2021-04-14
发明人： INGO BOGEN , Alexander WEHNER
IPC分类号： H01R13/426 , H01R13/415 , H01R12/58
摘要： A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.
-
公开(公告)号：US10863623B2
公开(公告)日：2020-12-08
申请号：US16365948
申请日：2019-03-27
发明人： Nicola Burani , Roland Bittner , Matthias Kujath , Peter Mauer
摘要： A circuit configuration for controlling a power semiconductor device has a first circuit carrier and a second circuit carrier arranged parallel to and spaced apart from the first, and having a plastic molded body arranged in an intermediate space between the first and second circuit carrier, wherein the first circuit carrier has a first conductor track with a first contact point, which can be implemented in particular as a contact pad or as a contact receptacle, which is arranged on a main side of the first circuit carrier facing the plastic molded body, wherein the second circuit carrier has a second conductor track with a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body, wherein the plastic molded body has a first holder for a first component with a first and a second contact device, and wherein the first contact device is electrically conductively connected to the first contact point and the second contact device is electrically conductively connected to the second contact point.
-
公开(公告)号：US10577707B2
公开(公告)日：2020-03-03
申请号：US14682945
申请日：2015-04-09
摘要： Method and apparatus for the electrodeposition of a contact metal layer on contact areas of semiconductor components in a wafer assemblage. The method comprises: a) providing a wafer having components having at least one pn junction; b) arranging a non-conductive homogenizing device with respect to the first surfaces of the components, and an electrical contact device at a second surface of the wafer; c) introducing the wafer into an electroplating bath having an electrode, wherein the surface thereof consists at least partly of a first contact metal, and wherein the first surface of the components is in contact with the electroplating bath; d) applying a voltage to the electrode and to the contact device, as a result of which current flows between the electrode and the contact device, through the electroplating bath and the component and contact metal is thus deposited at the first contact areas of the components.
-
14.发明申请公开(公告)号：US20190020285A1
公开(公告)日：2019-01-17
申请号：US16019644
申请日：2018-06-27
发明人： Harald KOBOLLA , Alexander WEHNER , Ingo BOGEN , Jürgen STEGER , Peter BECKEDAHL
摘要： A submodule and an assembly include a switching device having a substrate, and printed conductors arranged thereupon. The submodule incorporates a first and a second DC voltage printed conductor, to which a first and a second DC voltage terminal element are connected in an electrically conductive manner, and an AC voltage printed conductor, to which an AC voltage terminal element is connected in an electrically conductive manner. The submodule further comprises an insulating moulding, which encloses the switching device in a frame-type arrangement. The first DC voltage terminal element, by means of a first contact section, engages with a first supporting body of the insulating moulding, and the AC voltage terminal element, by means of a second contact section, engages with a second supporting body of the insulating moulding. To this end, a first clamping device is configured to project through a first recess in the first supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the first DC voltage terminal element and an associated first DC voltage connecting element, and a second clamping device is configured to project through a second recess in the second supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the AC voltage terminal element and an associated AC voltage connecting element.
-
15.发明授权公开(公告)号：US10079120B2
公开(公告)日：2018-09-18
申请号：US15654774
申请日：2017-07-20
发明人： Harald Kobolla , Jörg Ammon
CPC分类号： H01H1/20 , H01H9/52 , H01L23/4093 , H01L23/42 , H01L23/49811 , H01L23/4985 , H01L24/72 , H01L24/90 , H01L25/072 , H01L2224/18
摘要： A switching device has a substrate, a connection device and a pressure device, wherein the substrate has electrically insulated conductor tracks, and a power semiconductor component is on one of the conductor tracks with a first main surface and is conductively connected thereto. The connection device is a film composite with conductive film and an insulating film and forms a first and a second main surface. The switching device is connected by the connection device and a contact area of the second main surface of the power semiconductor component is connected to a first contact area of the first main surface of the connection device in a force-locking and electrically conductive manner with a pressure body and a pressure element projecting toward the power semiconductor component.
-
公开(公告)号：US20180061802A1
公开(公告)日：2018-03-01
申请号：US15669159
申请日：2017-08-04
IPC分类号： H01L23/00 , H01L23/473
CPC分类号： H01L24/72 , H01L23/473 , H01L23/48
摘要： The invention relates to a power semiconductor device with a substrate with a cooling device and power semiconductor components connected thereon, having load current terminal elements and a cooling device. Pressure devices have a pressure element is arranged movably in a direction normal (N) to the substrate, and an elastic deformation element between the pressure element and a load current terminal element. The pressure element presses the assigned load current terminal element against an electrically conductive contact area of the substrate via the elastic deformation element and provides electrically conductive pressure contacting of the assigned load current terminal element with the substrate. The electrical connection of the power semiconductor device is improved.
-
公开(公告)号：US09883596B2
公开(公告)日：2018-01-30
申请号：US14924679
申请日：2015-10-27
IPC分类号： H05K3/32 , H01L25/07 , H01L23/498 , H01L23/31 , H05K3/10 , H01L23/00 , H01L23/367
CPC分类号： H05K3/32 , H01L23/3121 , H01L23/367 , H01L23/49811 , H01L23/49833 , H01L23/4985 , H01L24/50 , H01L24/86 , H01L25/07 , H01L2224/32225 , H01L2224/73269 , H01L2224/8384 , H05K3/10 , H01L2924/00014
摘要： A method for producing a power electronic switching device comprising a substrate, having a power semiconductor component arranged thereon; a connection device, and terminal devices. The method comprises: Providing the substrate with an insulation ply and conductor tracks electrically insulated from one another, wherein a power semiconductor component is arranged on a conductor track and is cohesively connected thereto; Arranging the connection device embodied as a film stack; Arranging a thin pressure- and temperature-resistant and moisture-blocking insulation layer along a surface contour of the connection device and comprising a covering section and an overlap section, which overlaps the connection device circumferentially and covers the substrate in a circumferential contact region; Cohesively connecting the connection device to the substrate, whereby the connection device connects the switching device in a circuit-conforming manner internally; Connecting the covering section to the connection device; Connecting the overlap section to the contact region.
-
公开(公告)号：US20170062296A1
公开(公告)日：2017-03-02
申请号：US15249075
申请日：2016-08-26
发明人： Ingo BOGEN
IPC分类号： H01L23/053 , H01L25/07 , H01L23/498 , H01L23/367 , H01L23/10 , H01L23/12
CPC分类号： H01L23/053 , H01L23/043 , H01L23/10 , H01L23/12 , H01L23/367 , H01L23/3675 , H01L23/49838 , H01L24/06 , H01L24/24 , H01L24/32 , H01L24/72 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/04026 , H01L2224/06181 , H01L2224/24137 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/8384 , H01L2924/13055 , H01L2924/13091
摘要： A submodule comprising: a substrate, a power semiconductor component, a connection device, a terminal device and an insulating body. The substrate has conductor tracks electrically insulated from one another, and the component is electrically conductively connected to a track. The connection device is a film composite with a first surface facing the component and the substrate and an opposed second surface. The insulating body has: a first partial body, connected to an edge of the substrate, a first cutout for a terminal, a second partial body, embodied as a pressure body and a second cutout, with a pressure element projecting therefrom. The second partial body is movable relative to the first partial body in the direction of the substrate to press with the pressure element onto a section of the second surface. The section is within the area of the component in projection along the direction of the normal thereto.
摘要翻译： 一种子模块，包括：基板，功率半导体部件，连接装置，端子装置和绝缘体。 衬底具有彼此电绝缘的导体轨道，并且该部件导电地连接到轨道。 连接装置是具有面向组件和基板的第一表面和相对的第二表面的薄膜复合材料。 所述绝缘体具有连接到所述基板的边缘的第一部分体，用于端子的第一切口，被实施为压力体的第二部分体和具有从其突出的压力元件的第二切口。 所述第二部分主体相对于所述第一部分主体在所述基板的方向上是可移动的，以将所述压力元件压在所述第二表面的一部分上。 该部分在沿其法线方向投影的部件的区域内。
-
公开(公告)号：US20170011985A1
公开(公告)日：2017-01-12
申请号：US15206303
申请日：2016-07-10
发明人： Christian WALTER
IPC分类号： H01L23/367 , H01L23/498 , H01L23/043 , G01R19/00 , H05K5/02 , H01L23/00 , H01L23/473 , H01L23/373 , H05K5/00
CPC分类号： H01L23/3675 , G01R19/0092 , H01L23/043 , H01L23/055 , H01L23/3672 , H01L23/3735 , H01L23/4006 , H01L23/467 , H01L23/473 , H01L23/49811 , H01L23/49838 , H01L23/49861 , H01L24/48 , H01L24/50 , H01L25/072 , H01L2224/48091 , H01L2224/4813 , H01L2224/48132 , H01L2224/48175 , H01L2224/48227 , H01L2224/4846 , H01L2224/48472 , H01L2924/00014 , H05K7/1432 , H05K7/209 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要： A power electronics module having a base plate, a circuit carrier arranged on the base plate and a plurality of conductor tracks which are electrically insulated from the base plate. A power semiconductor component is arranged on one of the conductor tracks, and has a load connection element. In this case, the base plate has a substantially continuous first recess and the circuit carrier has a substantially continuous second recess, wherein the first and second recesses are arranged such that they are in alignment with one another. The load connection element has a first contact device which is in electrically conductive contact with a contact area of that side of the conductor track which is averted from the base plate, a second contact device for externally making contact with the circuit carrier, and a connecting section, which extends through the first and second recesses, between the first and second contact devices.
摘要翻译： 一种功率电子模块，具有基板，布置在基板上的电路载体和与基板电绝缘的多个导体轨道。 功率半导体部件布置在一个导体轨道上，并具有负载连接元件。 在这种情况下，基板具有基本上连续的第一凹部，并且电路载体具有基本上连续的第二凹部，其中第一凹部和第二凹部被布置成使得它们彼此对准。 负载连接元件具有第一接触装置，其与从基板避开的导体轨道的该侧的接触区域导电接触，用于外部与电路载体接触的第二接触装置和连接 其在第一和第二接触装置之间延伸穿过第一和第二凹部。
-
公开(公告)号：US09159639B2
公开(公告)日：2015-10-13
申请号：US13544630
申请日：2012-07-09
IPC分类号： H05K7/20 , H01L23/34 , H01L23/18 , H01L23/36 , H01L23/373 , H01L23/498 , H01L25/07 , H01L23/00
CPC分类号： H01L23/34 , H01L23/18 , H01L23/36 , H01L23/3735 , H01L23/49833 , H01L23/4985 , H01L24/32 , H01L24/83 , H01L25/072 , H01L2224/32225 , H01L2224/33181 , H01L2224/83101 , H01L2224/8384 , H01L2924/01068 , H05K7/2039
摘要： A power electronic system with a cooling device, and a method for producing the system, comprising a plurality of submodules, each submodule having a first planar insulating material body, one first conductor track cohesively connected thereto, one power switch arranged on the conductor track, at least one internal connecting device composed of an alternate layer sequence of at least one electrically conductive film and at least one electrically insulating film, wherein at least one electrically conductive layer forms at least one second conductor track, and comprising external connection elements. In this case, the submodules are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their first main surface on the cooling device. At least one second conductor track at least partially covers first conductor tracks of two submodules, electrically connects them to one another and covers an interspace between the submodules.
摘要翻译： 一种具有冷却装置的电力电子系统及其制造方法，包括多个子模块，每个子模块具有第一平面绝缘材料体，一个内部连接到其上的一个第一导体轨道，布置在导体轨道上的一个电力开关， 至少一个内部连接装置，其由至少一个导电膜和至少一个电绝缘膜的交替层序列组成，其中至少一个导电层形成至少一个第二导体轨道，并且包括外部连接元件。 在这种情况下，子模块以冷却装置的内部和第二主表面彼此间隔开的方式以强力锁定的方式并排设置。 至少一个第二导体轨道至少部分地覆盖两个子模块的第一导体轨道，将它们彼此电连接并覆盖子模块之间的间隙。
-
-
-
-
-
-
-
-
-
搜索结果
284 条记录 (耗时 0.028 秒)
