公开(公告)号：US20170301600A1

公开(公告)日：2017-10-19

申请号：US15487519

申请日：2017-04-14

申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG

发明人： Thomas FRANK ,  Christian WALTER ,  Stefan WEISS ,  Thomas ZIEGLER

IPC分类号： H01L23/32 ,  B60K1/04 ,  H01R13/73 ,  H01R12/70 ,  B60K1/02 ,  B66F9/075 ,  B60K7/00 ,  H01L23/367 ,  H01R12/82

CPC分类号： H01L23/32 ,  B60K1/02 ,  B60K1/04 ,  B60K7/0007 ,  B60K2007/0061 ,  B66F9/07572 ,  H01L23/3672 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73267 ,  H01R12/7047 ,  H01R12/82 ,  H01R13/73 ,  H01R2201/26 ,  H05K7/1432

摘要： A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.

公开(公告)号：US20170011985A1

公开(公告)日：2017-01-12

申请号：US15206303

申请日：2016-07-10

申请人： Semikron Elektronik GmbH & Co., KG

发明人： Christian WALTER

IPC分类号： H01L23/367 ,  H01L23/498 ,  H01L23/043 ,  G01R19/00 ,  H05K5/02 ,  H01L23/00 ,  H01L23/473 ,  H01L23/373 ,  H05K5/00

CPC分类号： H01L23/3675 ,  G01R19/0092 ,  H01L23/043 ,  H01L23/055 ,  H01L23/3672 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/50 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48132 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2924/00014 ,  H05K7/1432 ,  H05K7/209 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A power electronics module having a base plate, a circuit carrier arranged on the base plate and a plurality of conductor tracks which are electrically insulated from the base plate. A power semiconductor component is arranged on one of the conductor tracks, and has a load connection element. In this case, the base plate has a substantially continuous first recess and the circuit carrier has a substantially continuous second recess, wherein the first and second recesses are arranged such that they are in alignment with one another. The load connection element has a first contact device which is in electrically conductive contact with a contact area of that side of the conductor track which is averted from the base plate, a second contact device for externally making contact with the circuit carrier, and a connecting section, which extends through the first and second recesses, between the first and second contact devices.

摘要翻译： 一种功率电子模块，具有基板，布置在基板上的电路载体和与基板电绝缘的多个导体轨道。 功率半导体部件布置在一个导体轨道上，并具有负载连接元件。 在这种情况下，基板具有基本上连续的第一凹部，并且电路载体具有基本上连续的第二凹部，其中第一凹部和第二凹部被布置成使得它们彼此对准。 负载连接元件具有第一接触装置，其与从基板避开的导体轨道的该侧的接触区域导电接触，用于外部与电路载体接触的第二接触装置和连接 其在第一和第二接触装置之间延伸穿过第一和第二凹部。