POWER ELECTRONIC ARRANGEMENT WITH DC VOLTAGE CONNECTION ELEMENT AND METHOD FOR ITS PRODUCTION

    公开(公告)号:US20210336552A1

    公开(公告)日:2021-10-28

    申请号:US17219276

    申请日:2021-03-31

    IPC分类号: H02M7/00 H01R4/02 H01R4/34

    摘要: A power converter module has a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and having a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection, wherein the second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection.

    POWER SEMICONDUCTOR MODULE HAVING A SUBSTRATE ARRANGEMENT, HAVING POWER SEMICONDUCTOR COMPONENTS AND HAVING A FOIL STACK ARRANGEMENT

    公开(公告)号:US20240079367A1

    公开(公告)日:2024-03-07

    申请号:US17902629

    申请日:2022-09-02

    摘要: A power semiconductor module has a substrate arrangement which has a substrate, wherein the respective substrate has conductor tracks, power semiconductor components arranged on the substrate conductor tracks and electrically conductively contacted therewith, a foil stack arrangement which has at least one foil stack, and the foil stack comprises foil stack conductor tracks. The power semiconductor components are electrically conductively connected to by the substrate conductor tracks and the foil stack conductor tracks to form a circuit, and having an electrically conductive bridging element which has first and second contact sections extending from the foil stack arrangement and a connecting section which connects the first and second contact sections, the first contact section is electrically conductively contacted with a first substrate conductor track or with a foil stack conductor track, and the second contact section is electrically conductively contacted with a second substrate conductor track or with a foil stack conductor track, the bridging element is electrically connected in parallel with at least one section of a foil stack conductor track of the foil stack.

    PRESSING DEVICE FOR DIRECTLY OR INDIRECTLY APPLYING PRESSURE TO POWER-SEMICONDUCTOR COMPONENTS OF A POWER-SEMICONDUCTOR MODULE

    公开(公告)号:US20220406674A1

    公开(公告)日:2022-12-22

    申请号:US17840405

    申请日:2022-06-14

    IPC分类号: H01L23/32

    摘要: A pressing device for indirectly or directly applying pressure to power-semiconductor components of a power-semiconductor module, having a pressing plate, having a pressing nub element which is formed from an elastic material and which has a pressing nub plate and pressing nubs projecting therefrom, and having a receiving device for receiving the pressing nub element, which receiving device has a base plate provided with recesses, wherein the recesses run through the base plate, wherein the pressing nub plate is arranged on the base plate and the pressing nubs run through the recesses and, on the main side of the base plate facing away from the pressing nub plate, project beyond this main side of the base plate, and wherein the pressing nub plate is arranged between the pressing plate and the base plate.

    POWER ELECTRONICS SUBMODULE HAVING DC AND AC VOLTAGE TERMINAL ELEMENTS, AND ASSEMBLY HEREOF

    公开(公告)号:US20190020285A1

    公开(公告)日:2019-01-17

    申请号:US16019644

    申请日:2018-06-27

    摘要: A submodule and an assembly include a switching device having a substrate, and printed conductors arranged thereupon. The submodule incorporates a first and a second DC voltage printed conductor, to which a first and a second DC voltage terminal element are connected in an electrically conductive manner, and an AC voltage printed conductor, to which an AC voltage terminal element is connected in an electrically conductive manner. The submodule further comprises an insulating moulding, which encloses the switching device in a frame-type arrangement. The first DC voltage terminal element, by means of a first contact section, engages with a first supporting body of the insulating moulding, and the AC voltage terminal element, by means of a second contact section, engages with a second supporting body of the insulating moulding. To this end, a first clamping device is configured to project through a first recess in the first supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the first DC voltage terminal element and an associated first DC voltage connecting element, and a second clamping device is configured to project through a second recess in the second supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the AC voltage terminal element and an associated AC voltage connecting element.

    POWER ELECTRONIC SUBMODULE COMPRISING A BIPARTITE HOUSING
    6.
    发明申请
    POWER ELECTRONIC SUBMODULE COMPRISING A BIPARTITE HOUSING 审中-公开
    功率电子元件包含一个双重住宅

    公开(公告)号:US20170062296A1

    公开(公告)日:2017-03-02

    申请号:US15249075

    申请日:2016-08-26

    发明人: Ingo BOGEN

    摘要: A submodule comprising: a substrate, a power semiconductor component, a connection device, a terminal device and an insulating body. The substrate has conductor tracks electrically insulated from one another, and the component is electrically conductively connected to a track. The connection device is a film composite with a first surface facing the component and the substrate and an opposed second surface. The insulating body has: a first partial body, connected to an edge of the substrate, a first cutout for a terminal, a second partial body, embodied as a pressure body and a second cutout, with a pressure element projecting therefrom. The second partial body is movable relative to the first partial body in the direction of the substrate to press with the pressure element onto a section of the second surface. The section is within the area of the component in projection along the direction of the normal thereto.

    摘要翻译: 一种子模块,包括:基板,功率半导体部件,连接装置,端子装置和绝缘体。 衬底具有彼此电绝缘的导体轨道,并且该部件导电地连接到轨道。 连接装置是具有面向组件和基板的第一表面和相对的第二表面的薄膜复合材料。 所述绝缘体具有连接到所述基板的边缘的第一部分体,用于端子的第一切口,被实施为压力体的第二部分体和具有从其突出的压力元件的第二切口。 所述第二部分主体相对于所述第一部分主体在所述基板的方向上是可移动的,以将所述压力元件压在所述第二表面的一部分上。 该部分在沿其法线方向投影的部件的区域内。

    POWER ELECTRONICS SUBMODULE FOR MOUNTING ON A COOLING DEVICE

    公开(公告)号:US20210267086A1

    公开(公告)日:2021-08-26

    申请号:US17174801

    申请日:2021-02-12

    摘要: A power electronics submodule for mounting on a cooling device, has first and second surface sections next to one another, a substrate with a housing and includes a connection element, conductively connected by a contact to a track of the substrate and a connection section, arranged parallel to the substrate, the substrate arranged on the first surface section, the housing has a housing section, with a first main surface, arranged on the second surface section, and a second main surface, situated opposite the first main surface. In a non-mounted state a first main surface of the connection section is a first distance from the second main surface of the housing section in the housing region of a fastening device.

    POWER SEMICONDUCTOR DEVICE
    9.
    发明申请
    POWER SEMICONDUCTOR DEVICE 有权
    功率半导体器件

    公开(公告)号:US20150282339A1

    公开(公告)日:2015-10-01

    申请号:US14670237

    申请日:2015-03-26

    发明人: Ingo BOGEN

    IPC分类号: H05K5/00 H05K1/18 H05K1/02

    摘要: A power semiconductor device comprising: a body, a substrate and power semiconductor components arranged on and connected to the substrate. The device has electrically conductive load connection elements and an integrally formed housing which runs laterally around the components. The body has a main outer surface which runs laterally around the components and which is at least partially covered by an elastic, electrically nonconductive, integrally formed, structured sealing element which runs laterally around the components. A section of the sealing element is arranged between the housing and the main outer surface of the body. The housing and the main outer surface of the body are pressed against the sealing element, which seals off the housing from the main outer surface of the body. The invention provides a compact device whose load connection elements are reliably electrically insulated from the body and whose housing is reliably sealed off from the body.

    摘要翻译: 一种功率半导体器件,包括:主体,衬底和布置在衬底上并连接到衬底的功率半导体器件。 该装置具有导电负载连接元件和整体形成的围绕部件横向延伸的壳体。 主体具有围绕部件横向延伸的主外表面,并且至少部分地被围绕部件横向延伸的弹性的,不导电的,整体形成的结构化的密封元件覆盖。 密封元件的一部分布置在壳体和主体的主外表面之间。 壳体和主体外表面被压靠在密封元件上,密封元件将壳体与主体的外表面密封。 本发明提供了一种紧凑的装置,其负载连接元件与主体可靠地电绝缘,并且其外壳可靠地与主体密封。