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1.
公开(公告)号:US20210336552A1
公开(公告)日:2021-10-28
申请号:US17219276
申请日:2021-03-31
发明人: Ingo BOGEN , Florian FINK , Jürgen STEGER , Harald KOBOLLA
摘要: A power converter module has a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and having a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection, wherein the second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection.
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公开(公告)号:US20240079367A1
公开(公告)日:2024-03-07
申请号:US17902629
申请日:2022-09-02
发明人: Ingo BOGEN , Stefan OEHLING
IPC分类号: H01L23/00 , H01L23/373 , H01L25/07
CPC分类号: H01L24/40 , H01L23/3735 , H01L24/32 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/40139 , H01L2224/40225 , H01L2224/73263
摘要: A power semiconductor module has a substrate arrangement which has a substrate, wherein the respective substrate has conductor tracks, power semiconductor components arranged on the substrate conductor tracks and electrically conductively contacted therewith, a foil stack arrangement which has at least one foil stack, and the foil stack comprises foil stack conductor tracks. The power semiconductor components are electrically conductively connected to by the substrate conductor tracks and the foil stack conductor tracks to form a circuit, and having an electrically conductive bridging element which has first and second contact sections extending from the foil stack arrangement and a connecting section which connects the first and second contact sections, the first contact section is electrically conductively contacted with a first substrate conductor track or with a foil stack conductor track, and the second contact section is electrically conductively contacted with a second substrate conductor track or with a foil stack conductor track, the bridging element is electrically connected in parallel with at least one section of a foil stack conductor track of the foil stack.
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公开(公告)号:US20220406674A1
公开(公告)日:2022-12-22
申请号:US17840405
申请日:2022-06-14
发明人: Ingo BOGEN , Manuel NODERER , Alexander WEHNER
IPC分类号: H01L23/32
摘要: A pressing device for indirectly or directly applying pressure to power-semiconductor components of a power-semiconductor module, having a pressing plate, having a pressing nub element which is formed from an elastic material and which has a pressing nub plate and pressing nubs projecting therefrom, and having a receiving device for receiving the pressing nub element, which receiving device has a base plate provided with recesses, wherein the recesses run through the base plate, wherein the pressing nub plate is arranged on the base plate and the pressing nubs run through the recesses and, on the main side of the base plate facing away from the pressing nub plate, project beyond this main side of the base plate, and wherein the pressing nub plate is arranged between the pressing plate and the base plate.
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公开(公告)号:US20210408698A1
公开(公告)日:2021-12-30
申请号:US17355319
申请日:2021-06-23
摘要: A component for a vehicle electric drive is described, which includes at least one connecting lug pair projecting from the component for electrically connecting the component. Here, a first connecting lug and a second connecting lug of the connecting lug pair each have a joining zone for electrically connecting the component. Furthermore, an assembly for a vehicle electric drive is presented, which has at least two such components. Further presented is a method of electrically conductively connecting two components.
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5.
公开(公告)号:US20190020285A1
公开(公告)日:2019-01-17
申请号:US16019644
申请日:2018-06-27
发明人: Harald KOBOLLA , Alexander WEHNER , Ingo BOGEN , Jürgen STEGER , Peter BECKEDAHL
摘要: A submodule and an assembly include a switching device having a substrate, and printed conductors arranged thereupon. The submodule incorporates a first and a second DC voltage printed conductor, to which a first and a second DC voltage terminal element are connected in an electrically conductive manner, and an AC voltage printed conductor, to which an AC voltage terminal element is connected in an electrically conductive manner. The submodule further comprises an insulating moulding, which encloses the switching device in a frame-type arrangement. The first DC voltage terminal element, by means of a first contact section, engages with a first supporting body of the insulating moulding, and the AC voltage terminal element, by means of a second contact section, engages with a second supporting body of the insulating moulding. To this end, a first clamping device is configured to project through a first recess in the first supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the first DC voltage terminal element and an associated first DC voltage connecting element, and a second clamping device is configured to project through a second recess in the second supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the AC voltage terminal element and an associated AC voltage connecting element.
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公开(公告)号:US20170062296A1
公开(公告)日:2017-03-02
申请号:US15249075
申请日:2016-08-26
发明人: Ingo BOGEN
IPC分类号: H01L23/053 , H01L25/07 , H01L23/498 , H01L23/367 , H01L23/10 , H01L23/12
CPC分类号: H01L23/053 , H01L23/043 , H01L23/10 , H01L23/12 , H01L23/367 , H01L23/3675 , H01L23/49838 , H01L24/06 , H01L24/24 , H01L24/32 , H01L24/72 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/04026 , H01L2224/06181 , H01L2224/24137 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/8384 , H01L2924/13055 , H01L2924/13091
摘要: A submodule comprising: a substrate, a power semiconductor component, a connection device, a terminal device and an insulating body. The substrate has conductor tracks electrically insulated from one another, and the component is electrically conductively connected to a track. The connection device is a film composite with a first surface facing the component and the substrate and an opposed second surface. The insulating body has: a first partial body, connected to an edge of the substrate, a first cutout for a terminal, a second partial body, embodied as a pressure body and a second cutout, with a pressure element projecting therefrom. The second partial body is movable relative to the first partial body in the direction of the substrate to press with the pressure element onto a section of the second surface. The section is within the area of the component in projection along the direction of the normal thereto.
摘要翻译: 一种子模块,包括:基板,功率半导体部件,连接装置,端子装置和绝缘体。 衬底具有彼此电绝缘的导体轨道,并且该部件导电地连接到轨道。 连接装置是具有面向组件和基板的第一表面和相对的第二表面的薄膜复合材料。 所述绝缘体具有连接到所述基板的边缘的第一部分体,用于端子的第一切口,被实施为压力体的第二部分体和具有从其突出的压力元件的第二切口。 所述第二部分主体相对于所述第一部分主体在所述基板的方向上是可移动的,以将所述压力元件压在所述第二表面的一部分上。 该部分在沿其法线方向投影的部件的区域内。
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公开(公告)号:US20210267086A1
公开(公告)日:2021-08-26
申请号:US17174801
申请日:2021-02-12
发明人: Ingo BOGEN , Alexander WEHNER
摘要: A power electronics submodule for mounting on a cooling device, has first and second surface sections next to one another, a substrate with a housing and includes a connection element, conductively connected by a contact to a track of the substrate and a connection section, arranged parallel to the substrate, the substrate arranged on the first surface section, the housing has a housing section, with a first main surface, arranged on the second surface section, and a second main surface, situated opposite the first main surface. In a non-mounted state a first main surface of the connection section is a first distance from the second main surface of the housing section in the housing region of a fastening device.
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8.
公开(公告)号:US20170144246A1
公开(公告)日:2017-05-25
申请号:US15356655
申请日:2016-11-20
CPC分类号: B23K20/002 , B23K20/023 , B23K20/10 , B23K20/26 , H01L24/32 , H01L24/50 , H01L24/75 , H01L24/79 , H01L24/83 , H01L24/86 , H01L2224/32227 , H01L2224/73269 , H01L2224/75251 , H01L2224/75252 , H01L2224/75314 , H01L2224/75315 , H01L2224/75316 , H01L2224/7532 , H01L2224/75343 , H01L2224/75704 , H01L2224/7598 , H01L2224/79251 , H01L2224/79252 , H01L2224/79314 , H01L2224/79316 , H01L2224/7932 , H01L2224/79343 , H01L2224/83203 , H01L2224/8384 , H01L2224/86203 , H01L2924/00014 , H01L2924/00012
摘要: A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.
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公开(公告)号:US20150282339A1
公开(公告)日:2015-10-01
申请号:US14670237
申请日:2015-03-26
发明人: Ingo BOGEN
CPC分类号: H05K5/0056 , H05K1/0203 , H05K1/181 , H05K5/0008 , H05K7/1432
摘要: A power semiconductor device comprising: a body, a substrate and power semiconductor components arranged on and connected to the substrate. The device has electrically conductive load connection elements and an integrally formed housing which runs laterally around the components. The body has a main outer surface which runs laterally around the components and which is at least partially covered by an elastic, electrically nonconductive, integrally formed, structured sealing element which runs laterally around the components. A section of the sealing element is arranged between the housing and the main outer surface of the body. The housing and the main outer surface of the body are pressed against the sealing element, which seals off the housing from the main outer surface of the body. The invention provides a compact device whose load connection elements are reliably electrically insulated from the body and whose housing is reliably sealed off from the body.
摘要翻译: 一种功率半导体器件,包括:主体,衬底和布置在衬底上并连接到衬底的功率半导体器件。 该装置具有导电负载连接元件和整体形成的围绕部件横向延伸的壳体。 主体具有围绕部件横向延伸的主外表面,并且至少部分地被围绕部件横向延伸的弹性的,不导电的,整体形成的结构化的密封元件覆盖。 密封元件的一部分布置在壳体和主体的主外表面之间。 壳体和主体外表面被压靠在密封元件上,密封元件将壳体与主体的外表面密封。 本发明提供了一种紧凑的装置,其负载连接元件与主体可靠地电绝缘,并且其外壳可靠地与主体密封。
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公开(公告)号:US20150061112A1
公开(公告)日:2015-03-05
申请号:US14476299
申请日:2014-09-03
IPC分类号: H01L23/367 , H01L23/00 , H01L21/48
CPC分类号: H01L23/3675 , H01L21/4882 , H01L23/3672 , H01L23/3677 , H01L24/83 , H01L2224/83237 , H01L2224/83238 , H01L2224/83801 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/20103 , H01L2924/20104 , H05K7/20927 , H01L2924/00
摘要: A power semiconductor device comprising a power semiconductor module and a heat sink and a method for its manufacture. The heat sink has a first cooling housing component, with a cutout passing therethrough, and a second cooling housing component, with a cooling plate arranged in the cutout. The first and second cooling housing components are configured and arranged relative to one another so that a cavity is formed at the side of the cooling plate facing away from the power semiconductor components. The cooling plate is connected to the first cooling housing component by a first weld seam which extends circumferentially therearound. The first weld seam seals the cooling plate in relation to the first cooling housing component, and the second cooling housing component is connected to the first cooling housing component. The inventive power semiconductor device has good heat conduction from the power semiconductor components to a heat sink.
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