- 专利标题: APPARATUS FOR THE MATERIAL-BONDED CONNECTION OF CONNECTION PARTNERS OF A POWER-ELECTRONICS COMPONENT
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申请号: US15356655申请日: 2016-11-20
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公开(公告)号: US20170144246A1公开(公告)日: 2017-05-25
- 发明人: Ingo BOGEN , Heiko BRAML , Christian GÖBL , Ulrich SAGEBAUM , Jürgen WINDISCHMANN
- 申请人: Semikron Elektronik GmbH & Co., KG
- 申请人地址: DE Nurnberg
- 专利权人: Semikron Elektronik GmbH & Co., KG
- 当前专利权人: Semikron Elektronik GmbH & Co., KG
- 当前专利权人地址: DE Nurnberg
- 优先权: DE102015120156.9 20151120
- 主分类号: B23K20/00
- IPC分类号: B23K20/00 ; B23K20/10 ; B23K20/26 ; B23K20/02
摘要:
A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.
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