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公开(公告)号：US20240022014A1
公开(公告)日：2024-01-18
申请号：US18219042
申请日：2023-07-06
发明人： André SCHLÖTTERER , Harald KOBOLLA
IPC分类号： H01R13/502 , H01L23/498 , H01L23/04 , H01R13/24
CPC分类号： H01R13/502 , H01L23/49811 , H01L23/04 , H01R13/24
摘要： An arrangement having a housing and an electrically conductive contact spring is presented, wherein the contact spring has a first and a second orthogonal main plane along its specified spring direction, wherein it is formed so as to be symmetric with respect to the first main plane, x-z plane, and asymmetric with respect to the second main plane, x-y plane, and also with respect to a rotation through 180° about the specified spring direction. The housing has a spring shaft for receiving the contact spring, and wherein this spring shaft likewise has a first and a second main plane, which coincides with the respective main plane of the contact spring, and wherein the spring shaft is formed so as to be symmetric relative to both main planes. And a power semiconductor module having such an arrangement.
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2.发明申请公开(公告)号：US20190020285A1
公开(公告)日：2019-01-17
申请号：US16019644
申请日：2018-06-27
发明人： Harald KOBOLLA , Alexander WEHNER , Ingo BOGEN , Jürgen STEGER , Peter BECKEDAHL
摘要： A submodule and an assembly include a switching device having a substrate, and printed conductors arranged thereupon. The submodule incorporates a first and a second DC voltage printed conductor, to which a first and a second DC voltage terminal element are connected in an electrically conductive manner, and an AC voltage printed conductor, to which an AC voltage terminal element is connected in an electrically conductive manner. The submodule further comprises an insulating moulding, which encloses the switching device in a frame-type arrangement. The first DC voltage terminal element, by means of a first contact section, engages with a first supporting body of the insulating moulding, and the AC voltage terminal element, by means of a second contact section, engages with a second supporting body of the insulating moulding. To this end, a first clamping device is configured to project through a first recess in the first supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the first DC voltage terminal element and an associated first DC voltage connecting element, and a second clamping device is configured to project through a second recess in the second supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the AC voltage terminal element and an associated AC voltage connecting element.
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公开(公告)号：US20200013687A1
公开(公告)日：2020-01-09
申请号：US16415677
申请日：2019-05-17
发明人： JORG AMMON , Harald KOBOLLA , Stefan WEISS
摘要： The invention relates to a power semiconductor device comprising a pin element which passes through a housing opening, comprising a support device, further comprising an elastic sealing device which is arranged on the support device, comprising a pressure device which is arranged on the sealing device, and comprising an electrically conductive sleeve. A first pressure element of the pressure device presses a first sealing element of the sealing device against a first support element of the support device in the axial direction of the pin element causes deformation of the first sealing element so that the first sealing element presses against the housing opening wall and against the sleeve in a perpendicular direction in relation to the axial direction of the pin element. A second pressure element of the pressure device is designed to press a second sealing element of the sealing device against a second support element of the support device in the axial direction of the pin element and in this way to cause deformation of the second sealing element in such a way that the second sealing element presses against the sleeve and against the pin element in a perpendicular direction in relation to the axial direction of the pin element.
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4.发明公开公开(公告)号：US20230197561A1
公开(公告)日：2023-06-22
申请号：US18078854
申请日：2022-12-09
发明人： Jörg AMMON , Harald KOBOLLA , Ralf EHLER , Simon HÜTTMEIER
IPC分类号： H01L23/40 , H01L23/367 , H01L25/065 , H01L23/04 , H01L23/00
CPC分类号： H01L23/4006 , H01L23/3672 , H01L25/0655 , H01L23/04 , H01L24/48 , H01L24/45 , H01L2023/4081 , H01L2224/48225 , H01L2224/45147
摘要： A power semiconductor module has a substrate and an insulation layer and a metal layer arranged on the insulation layer, forming conductor tracks, comprising power semiconductor components arranged on the metal layer and conductively contacted with the metal layer. A pressure device arranged above the substrate in the normal direction of the insulation layer and having a pressure body and pressure elements running toward the substrate. The pressure elements each being connected to the pressure body to move resiliently in the normal direction via a spring element. The pressure body exerting a pressure onto the pressure elements in the direction toward the substrate via the spring elements, the pressure elements being arranged in such a way that, owing to the pressure exerted by the pressure body, they press onto power semiconductor component surrounding regions, surrounding the power semiconductor components, of the substrate.
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5.发明申请公开(公告)号：US20210336552A1
公开(公告)日：2021-10-28
申请号：US17219276
申请日：2021-03-31
发明人： Ingo BOGEN , Florian FINK , Jürgen STEGER , Harald KOBOLLA
摘要： A power converter module has a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and having a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection, wherein the second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection.
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