公开(公告)号：US20190189589A1

公开(公告)日：2019-06-20

申请号：US15986212

申请日：2018-05-22

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Ha Yong JUNG ,  Jae Min CHOI ,  Jae Kul LEE ,  Dong Jin KIM ,  Sung Taek WOO ,  Ji Hye SHIM ,  Woon Ha CHOI ,  Han Sang CHO

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48

CPC分类号： H01L25/0652 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/09135 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/2402 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24155 ,  H01L2224/25171 ,  H01L2224/32145 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48159 ,  H01L2224/48165 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/49176 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/73269 ,  H01L2225/06558 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

公开(公告)号：US09659843B2

公开(公告)日：2017-05-23

申请号：US14533463

申请日：2014-11-05

申请人： Infineon Technologies AG

发明人： Boon Teik Tee ,  Tiam Sen Ong

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31

CPC分类号： H01L23/49548 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49565 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/00

摘要： A lead frame strip has a plurality of unit lead frames. Each of the unit lead frames has a periphery structure connecting adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads connected to the periphery structure and extending towards the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material. The lead frame strip is processed by attaching a semiconductor die to each of the die paddles, electrically connecting each of the semiconductor dies to the leads, and forming a liquefied molding compound on each of the unit lead frames. The liquefied molding compound is formed such that the liquefied molding compound encapsulates the semiconductor dies and flows into the molding compound channels thereby forming molding extensions that extend onto the periphery structures.

公开(公告)号：US20160120038A1

公开(公告)日：2016-04-28

申请号：US14924679

申请日：2015-10-27

申请人： Semikron Elektronik GmbH & Co., KG

发明人： Christian GÖBL ,  Heinrich HEILBRONNER

IPC分类号： H05K3/32 ,  H05K3/10

CPC分类号： H05K3/32 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/50 ,  H01L24/86 ,  H01L25/07 ,  H01L2224/32225 ,  H01L2224/73269 ,  H01L2224/8384 ,  H05K3/10 ,  H01L2924/00014

摘要： A method for producing a power electronic switching device comprising a substrate, having a power semiconductor component arranged thereon; a connection device, and terminal devices. The method comprises: Providing the substrate with an insulation ply and conductor tracks electrically insulated from one another, wherein a power semiconductor component is arranged on a conductor track and is cohesively connected thereto; Arranging the connection device embodied as a film stack; Arranging a thin pressure- and temperature-resistant and moisture-blocking insulation layer along a surface contour of the connection device and comprising a covering section and an overlap section, which overlaps the connection device circumferentially and covers the substrate in a circumferential contact region; Cohesively connecting the connection device to the substrate, whereby the connection device connects the switching device in a circuit-conforming manner internally; Connecting the covering section to the connection device; Connecting the overlap section to the contact region.

摘要翻译： 一种电力电子开关器件的制造方法，其特征在于，具有配置有功率半导体元件的基板， 连接装置和终端装置。 该方法包括：为衬底提供彼此电绝缘的绝缘层和导体轨道，其中功率半导体部件布置在导体轨道上并与其粘结连接; 布置作为胶片堆叠的连接装置; 沿着连接装置的表面轮廓布置薄的耐压和耐温和防潮的绝缘层，并且包括覆盖部分和重叠部分，所述覆盖部分和重叠部分周向地与连接装置重叠并且在周向接触区域中覆盖基板; 将连接装置与衬底粘合地连接，由此连接装置在内部以电路符合的方式连接开关装置; 将覆盖部分连接到连接装置; 将重叠部分连接到接触区域。

公开(公告)号：US20130168845A1

公开(公告)日：2013-07-04

申请号：US13611568

申请日：2012-09-12

申请人： Masaki AOSHIMA

发明人： Masaki AOSHIMA

IPC分类号： H01L23/34

CPC分类号： H01L23/34 ,  H01L23/051 ,  H01L23/3675 ,  H01L2224/73269 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor module includes a semiconductor device, a first conductive member, a second conductive member, a cylinder, and a cover. The first conductive member is in contact with a first electrode of the semiconductor device. The second conductive member is in contact with a second electrode of the semiconductor device. The cylinder encompasses the semiconductor device and is fixed to the first conductive member, and a first thread groove is formed on the cylinder. A second thread groove is formed on the cover. The cover is fixed to the cylinder by an engagement of the second thread groove with the first thread groove. The semiconductor device and the second conductive member are fixed by being sandwiched between the first conductive member and the cover. The second conductive member includes a portion extending from inside to outside the cylinder by penetrating an outer peripheral wall of the cylinder.

摘要翻译： 半导体模块包括半导体器件，第一导电构件，第二导电构件，圆柱体和盖。 第一导电构件与半导体器件的第一电极接触。 第二导电构件与半导体器件的第二电极接触。 圆筒包围半导体器件并固定在第一导电部件上，第一螺纹槽形成在圆筒上。 在盖上形成第二螺纹槽。 盖通过第二螺纹槽与第一螺纹槽的接合而固定在气缸上。 半导体器件和第二导电构件通过夹在第一导电构件和盖之间而被固定。 第二导电构件包括通过穿过气缸的外周壁从内向外延伸的部分。

公开(公告)号：US20020149027A1

公开(公告)日：2002-10-17

申请号：US09381232

申请日：1999-09-17

发明人： NORIYUKI TAKAHASHI ,  SEIICHI ICHIHARA ,  CHUICHI MIYAZAKI

IPC分类号： H01L023/495

CPC分类号： H01L23/3107 ,  H01L23/16 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/50 ,  H01L2224/73269 ,  H01L2224/9222 ,  H01L2924/1433

摘要： A semiconductor device comprising a semiconductor chip, a wiring substrate provided surrounding the semiconductor chip, leads projected from the wiring substrate and connected to the semiconductor chip, a stiffening member provided on one main surface of the wiring substrate, surrounding-the semiconductor chip, a plurality of bumps provided along a periphery of the wiring substrate on another main surface of the wiring substrate opposite to the main surface where the stiffening member is provided, and resin covering the semiconductor chip and the leads. The leads connected to the semiconductor chip are bend-processed toward a side where the stiffening member of the wiring substrate is provided or a side where the plurality of bumps are formed. The leads and the semiconductor chip are connected such that the surface of the semiconductor chip opposite to the surface connected to the leads is positioned on a side opposite to the side where the leads are bend-processed.

摘要翻译： 一种半导体器件，包括半导体芯片，设置在半导体芯片周围的布线基板，从布线基板突出并连接到半导体芯片的引线，设置在布线基板的一个主表面上的加强部件，围绕半导体芯片， 在配线基板的与设置有加强构件的主面相反的另一主面上的布线基板的周围设置有多个凸块，以及覆盖半导体芯片和引线的树脂。 连接到半导体芯片的引线朝向设置布线基板的加强构件的一侧或形成多个凸块的一侧弯曲加工。 引线和半导体芯片被连接，使得与连接到引线的表面相对的半导体芯片的表面位于与引线弯曲加工的一侧相反的一侧。

公开(公告)号：US20020066955A1

公开(公告)日：2002-06-06

申请号：US10046204

申请日：2002-01-16

申请人： Hitachi, Ltd.

发明人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

IPC分类号： H01L023/34

CPC分类号： H01L24/50 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/45099

摘要： A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.

公开(公告)号：US5998241A

公开(公告)日：1999-12-07

申请号：US207557

申请日：1998-12-08

申请人： Kouichirou Niwa

发明人： Kouichirou Niwa

IPC分类号： H01L21/60 ,  H01L23/34 ,  H01L23/36 ,  H01L23/40 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L23/49572 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/50 ,  H01L2224/32245 ,  H01L2224/73269 ,  H01L2924/15311 ,  H01L2924/1532

摘要： A semiconductor device includes a tape carrier, a semiconductor chip, a metal heat spreader, a support ring, and a projection, recess, and spot welding portion. The tape carrier includes a TAB tape. The semiconductor chip is mounted on the tape carrier. The metal heat spreader is fixed to a surface of the semiconductor chip opposite to the tape carrier to dissipate heat generated in the semiconductor chip. The heat spreader has a shape larger than that of the semiconductor chip. The support ring is arranged between the heat spreader and tape carrier and is adhered to the tape carrier. The support ring serves to ensure a predetermined gap between the heat spreader and the tape carrier and to prevent warp of the tape carrier. The projection, recess, and spot welding portion bond the heat spreader and reinforcing member to each other by employing one of mechanical engagement and fusion welding. A method of manufacturing a semiconductor device is also disclosed.

摘要翻译： 半导体器件包括带状载体，半导体芯片，金属散热器，支撑环以及突起，凹部和点焊部。 带式载体包括TAB带。 半导体芯片安装在磁带载体上。 金属散热器固定在半导体芯片与带载体相对的表面上，以散发在半导体芯片中产生的热量。 散热器的形状大于半导体芯片的形状。 支撑环布置在散热器和带载体之间并且粘附到带状载体上。 支撑环用于确保散热器和带载体之间的预定间隙并且防止带状物承载件翘曲。 突起，凹陷和点焊部分通过使用机械接合和熔焊之一将散热器和加强构件彼此接合。 还公开了半导体器件的制造方法。

公开(公告)号：US20190043820A1

公开(公告)日：2019-02-07

申请号：US16020378

申请日：2018-06-27

申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG

发明人： Ulrich Sagebaum

IPC分类号： H01L23/00 ,  H01L23/15 ,  H01L23/14

CPC分类号： H01L24/29 ,  H01L23/145 ,  H01L23/15 ,  H01L24/05 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/50 ,  H01L24/75 ,  H01L24/79 ,  H01L24/83 ,  H01L24/86 ,  H01L2224/04026 ,  H01L2224/2732 ,  H01L2224/2783 ,  H01L2224/2784 ,  H01L2224/29017 ,  H01L2224/29019 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/50 ,  H01L2224/73269 ,  H01L2224/75303 ,  H01L2224/79303 ,  H01L2224/83345 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/8684 ,  H01L2924/10158 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A power electronics method and assembly produced by the method. The assembly has a substrate, having a power semiconductor element, and an adhesion layer disposed therebetween, wherein the substrate has a first surface that faces a power semiconductor element, a power semiconductor element has a third surface that faces the substrate, the adhesion layer has a second surface which, preferably across the full area, contacts the third surface and has a first consistent surface contour having a first roughness, and wherein a fourth surface of the power semiconductor element that is opposite the third surface has a second surface contour having a second roughness, said second surface contour following the first surface contour.

公开(公告)号：US20170221802A1

公开(公告)日：2017-08-03

申请号：US15492259

申请日：2017-04-20

申请人： Infineon Technologies AG

发明人： Boon Teik Tee ,  Tiam Sen Ong

IPC分类号： H01L23/495 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC分类号： H01L23/49548 ,  B29C45/14655 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49565 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/97 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/83801 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device packaging assembly includes a lead frame strip having a plurality of unit lead frames. Each of the unit lead frames includes a periphery structure connected to adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material onto the periphery structure.

公开(公告)号：US20170144246A1

公开(公告)日：2017-05-25

申请号：US15356655

申请日：2016-11-20

申请人： Semikron Elektronik GmbH & Co., KG

发明人： Ingo BOGEN ,  Heiko BRAML ,  Christian GÖBL ,  Ulrich SAGEBAUM ,  Jürgen WINDISCHMANN

IPC分类号： B23K20/00 ,  B23K20/10 ,  B23K20/26 ,  B23K20/02

CPC分类号： B23K20/002 ,  B23K20/023 ,  B23K20/10 ,  B23K20/26 ,  H01L24/32 ,  H01L24/50 ,  H01L24/75 ,  H01L24/79 ,  H01L24/83 ,  H01L24/86 ,  H01L2224/32227 ,  H01L2224/73269 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/75316 ,  H01L2224/7532 ,  H01L2224/75343 ,  H01L2224/75704 ,  H01L2224/7598 ,  H01L2224/79251 ,  H01L2224/79252 ,  H01L2224/79314 ,  H01L2224/79316 ,  H01L2224/7932 ,  H01L2224/79343 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2224/86203 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.