公开(公告)号：US10665562B2

公开(公告)日：2020-05-26

申请号：US16020378

申请日：2018-06-27

申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG

发明人： Ulrich Sagebaum

IPC分类号： H01L23/00 ,  H01L23/14 ,  H01L23/15

摘要： A power electronics method and assembly produced by the method. The assembly has a substrate, having a power semiconductor element, and an adhesion layer disposed therebetween, wherein the substrate has a first surface that faces a power semiconductor element, a power semiconductor element has a third surface that faces the substrate, the adhesion layer has a second surface which, preferably across the full area, contacts the third surface and has a first consistent surface contour having a first roughness, and wherein a fourth surface of the power semiconductor element that is opposite the third surface has a second surface contour having a second roughness, said second surface contour following the first surface contour.

公开(公告)号：US20190043820A1

公开(公告)日：2019-02-07

申请号：US16020378

申请日：2018-06-27

申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG

发明人： Ulrich Sagebaum

IPC分类号： H01L23/00 ,  H01L23/15 ,  H01L23/14

CPC分类号： H01L24/29 ,  H01L23/145 ,  H01L23/15 ,  H01L24/05 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/50 ,  H01L24/75 ,  H01L24/79 ,  H01L24/83 ,  H01L24/86 ,  H01L2224/04026 ,  H01L2224/2732 ,  H01L2224/2783 ,  H01L2224/2784 ,  H01L2224/29017 ,  H01L2224/29019 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/50 ,  H01L2224/73269 ,  H01L2224/75303 ,  H01L2224/79303 ,  H01L2224/83345 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83862 ,  H01L2224/8684 ,  H01L2924/10158 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A power electronics method and assembly produced by the method. The assembly has a substrate, having a power semiconductor element, and an adhesion layer disposed therebetween, wherein the substrate has a first surface that faces a power semiconductor element, a power semiconductor element has a third surface that faces the substrate, the adhesion layer has a second surface which, preferably across the full area, contacts the third surface and has a first consistent surface contour having a first roughness, and wherein a fourth surface of the power semiconductor element that is opposite the third surface has a second surface contour having a second roughness, said second surface contour following the first surface contour.

公开(公告)号：US10603741B2

公开(公告)日：2020-03-31

申请号：US15356655

申请日：2016-11-20

申请人： Semikron Elektronik GmbH & Co., KG

发明人： Ingo Bogen ,  Heiko Braml ,  Christian Göbl ,  Ulrich Sagebaum ,  Jürgen Windischmann

IPC分类号： B23K37/00 ,  B23K20/00 ,  H01L23/00 ,  B23K20/02 ,  B23K20/10 ,  B23K20/26

摘要： A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.