公开(公告)号：US10863623B2

公开(公告)日：2020-12-08

申请号：US16365948

申请日：2019-03-27

申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG

发明人： Nicola Burani ,  Roland Bittner ,  Matthias Kujath ,  Peter Mauer

IPC分类号： H05K1/14 ,  H05K1/18 ,  H05K7/14

摘要： A circuit configuration for controlling a power semiconductor device has a first circuit carrier and a second circuit carrier arranged parallel to and spaced apart from the first, and having a plastic molded body arranged in an intermediate space between the first and second circuit carrier, wherein the first circuit carrier has a first conductor track with a first contact point, which can be implemented in particular as a contact pad or as a contact receptacle, which is arranged on a main side of the first circuit carrier facing the plastic molded body, wherein the second circuit carrier has a second conductor track with a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body, wherein the plastic molded body has a first holder for a first component with a first and a second contact device, and wherein the first contact device is electrically conductively connected to the first contact point and the second contact device is electrically conductively connected to the second contact point.