Charged particle beam apparatus
    181.
    发明授权
    Charged particle beam apparatus 有权
    带电粒子束装置

    公开(公告)号:US09006654B2

    公开(公告)日:2015-04-14

    申请号:US14447589

    申请日:2014-07-30

    Abstract: An embodiment is to provide a technique that continuously applies a certain amount of an electron beam to a sample by selecting a beam applied to the sample from an electron beam emitted from an electron source in a scanning electron microscope. A charged particle apparatus is configured, including: a mechanism that detects the distribution of electric current strength with respect to the emitting direction of an electron beam emitted from an electron source; a functionality that predicts a fluctuation of an electric current applied to a sample by predicting the distribution of the electric current based on the detected result; a functionality that determines a position at which a beam applied to the sample is acquired based on the predicted result; and a mechanism that controls a position at which a probe beam is acquired based on the determined result.

    Abstract translation: 一个实施例是提供一种技术,其通过从扫描电子显微镜中从电子源发射的电子束中选择施加到样品的光束,将一定量的电子束连续地施加到样品。 一种带电粒子装置,包括:检测相对于从电子源发射的电子束的发射方向的电流强度分布的机构; 通过基于检测结果预测电流分布来预测施加到样本的电流的波动的功能; 基于预测结果确定施加到样本的光束的位置的功能; 以及基于所确定的结果来控制获取探测光束的位置的机构。

    Ion beam measurement system and method
    182.
    发明授权
    Ion beam measurement system and method 有权
    离子束测量系统及方法

    公开(公告)号:US08698108B1

    公开(公告)日:2014-04-15

    申请号:US13790791

    申请日:2013-03-08

    Abstract: A system of measuring ion beam current in a process chamber using conductive liners is disclosed. A conductive liner is used to shield the walls of the process chamber. An ion measuring device, such as an ammeter, is used to measure the current created by the ions that impact the conductive liner. In some embodiments, a mechanism to contain secondary electrons generated in the process chamber is employed. Additionally, the ions that impact the scan system or workpiece may also be measured, thereby allowing the current of the entire ion beam to be measured.

    Abstract translation: 公开了一种使用导电衬套测量处理室中的离子束电流的系统。 导电衬套用于屏蔽处理室的壁。 使用诸如电流表的离子测量装置来测量由撞击导电衬垫的离子产生的电流。 在一些实施例中,采用在处理室中产生的含有二次电子的机制。 此外,还可以测量冲击扫描系统或工件的离子,从而允许测量整个离子束的电流。

    Multi-leaf collimator for proton beam therapy
    183.
    发明授权
    Multi-leaf collimator for proton beam therapy 有权
    用于质子束治疗的多叶准直器

    公开(公告)号:US08575579B2

    公开(公告)日:2013-11-05

    申请号:US13429559

    申请日:2012-03-26

    CPC classification number: A61N5/1045 A61N5/1071 A61N2005/1087 A61N2005/1094

    Abstract: A proton beam collimator comprising (a) titanium or (b) stainless steel containing no tungsten or (c) containing no tungsten or brass. The collimator comprises a multi-leaf collimator (MLC). The apparatus further comprises an integrated circuit (IC) mounted adjacent the collimator, the IC subject to exposure to atomic particles, illustratively, neutrons.

    Abstract translation: 包括(a)钛或(b)不含钨的不锈钢或不含钨或黄铜的(c))的质子束准直仪。 准直器包括多叶准直器(MLC)。 该装置还包括邻近准直器安装的集成电路(IC),IC暴露于原子粒子,例如中子。

    Particle beam irradiation method and particle beam irradiation apparatus used for the same
    184.
    发明授权
    Particle beam irradiation method and particle beam irradiation apparatus used for the same 有权
    用于其的粒子束照射方法和粒子束照射装置

    公开(公告)号:US07525104B2

    公开(公告)日:2009-04-28

    申请号:US11596707

    申请日:2005-02-04

    Applicant: Hisashi Harada

    Inventor: Hisashi Harada

    Abstract: In a particle beam irradiation method and a particle beam irradiation apparatus in which depth direction irradiation field spread and lateral direction irradiation field spread are performed, an irradiation dose in each of irradiation layers of an irradiation target is made substantially constant, and control is simplified.The depth direction irradiation field spread is made the active irradiation field spread in which plural irradiation layers having different ranges in an irradiation direction of the particle beam are superimposed, the lateral direction irradiation field spread is made the active irradiation field spread in which irradiation spots of the particle beam are superimposed in the lateral direction, and a bolus having a shape along a deepest part of the irradiation target in the depth direction is disposed to cross the particle beam.

    Abstract translation: 在进行深度方向照射场扩散和横向照射场扩散的粒子束照射方法和粒子束照射装置中,使照射对象的各照射层的照射剂量基本上恒定,简化了控制。 使深度方向照射场扩展成为主动照射场扩展,其中在粒子束的照射方向上具有不同范围的多个照射层叠加,横向照射场扩展成为主动照射场扩展,其中照射点 粒子束在横向上叠加,并且沿着深度方向沿着照射靶的最深部分具有形状的弹丸设置成与粒子束交叉。

    Active particle trapping for process control
    185.
    发明申请
    Active particle trapping for process control 审中-公开
    用于过程控制的活性颗粒捕集

    公开(公告)号:US20080157007A1

    公开(公告)日:2008-07-03

    申请号:US11646155

    申请日:2006-12-27

    CPC classification number: H01L21/67213 C23C14/48 C23C14/564 H01L21/67017

    Abstract: A particle isolation system includes a semiconductor process chamber; at least one member within the semiconductor process chamber wherein the member has at least a first position and a second position; and at least one isolation compartment having a plurality of walls, the isolation compartment defined by the plurality of walls, at least one of the plurality of walls of the isolation compartment defining at least one opening wherein the member in the first position permits particles to enter the isolation compartment from the semiconductor process chamber through the opening, and wherein the member in the second position substantially encloses the isolation compartment thereby substantially retaining the particles in the isolation compartment and substantially limiting movement of the particles between the semiconductor process chamber and the isolation compartment through the opening. An ion implant system is also provided.

    Abstract translation: 粒子隔离系统包括半导体处理室; 所述半导体处理室内的至少一个构件,其中所述构件具有至少第一位置和第二位置; 以及至少一个具有多个壁的隔离室,隔离室由多个壁限定,隔离隔室的多个壁中的至少一个限定了至少一个开口,其中第一位置的构件允许颗粒进入 所述隔离室通过所述开口与所述半导体处理室隔离,并且其中所述第二位置中的所述构件基本上包围所述隔离隔室,从而将所述颗粒基本上保持在所述隔离室中,并且基本上限制所述颗粒在所述半导体处理室和所述隔离室之间的运动 通过开放。 还提供离子注入系统。

    Particle source with selectable beam current and energy spread
    186.
    发明申请
    Particle source with selectable beam current and energy spread 有权
    粒子源可选择束流和能量传播

    公开(公告)号:US20050178982A1

    公开(公告)日:2005-08-18

    申请号:US11058695

    申请日:2005-02-15

    CPC classification number: H01J37/05 H01J37/09 H01J37/153 H01J37/26

    Abstract: The invention describes a particle source in which energy selection occurs. The energy selection occurs by sending a beam of electrically charged particles 13 eccentrically through a lens 6. As a result of this, energy dispersion will occur in an image 15 formed by the lens 6. By projecting this image 15 onto a diaphragm 7, it is possible to only allow particles in a limited portion of the energy spectrum to pass. Consequently, the passed beam 16 will have a reduced energy spread. By adding a deflection unit 10, this particle beam 16 can be deflected toward the optical axis 2. One can also elect to deflect a beam 12 going through the middle of the lens 6—and having, for example, greater current—toward the optical axis.

    Abstract translation: 本发明描述了发生能量选择的粒子源。 通过透镜6偏心地发送带电粒子13的光束来进行能量选择。其结果是,由透镜6形成的图像15中会发生能量分散。通过将该图像15投影到膜片7上, 可能只允许能谱范围的有限部分的粒子通过。 因此,通过的光束16将具有减小的能量扩展。 通过添加偏转单元10,该粒子束16可以朝向光轴2偏转。还可以选择使穿过透镜6的中部的光束12偏转并具有例如更大的电流朝向光学 轴。

    Ion implantation system and ion implantation method
    187.
    发明授权
    Ion implantation system and ion implantation method 有权
    离子注入系统和离子注入法

    公开(公告)号:US06930316B2

    公开(公告)日:2005-08-16

    申请号:US10011869

    申请日:2001-12-03

    CPC classification number: H01J37/3171 H01J2237/31711

    Abstract: In an ion implantation system including (a) an ion source (b) a mass analyzing portion, (c) an ion acceleration portion, (d) an ion beam focusing/deflecting portion, and (e) an end station chamber for implanting ions onto a semiconductor substrate. The ion source consists of plural ion sources being connected to the same mass analyzing portion in which any one of the plural ion sources is selected. Mass-separated ions from the ion source are led to the acceleration portion, and a stencil mask is arranged approximately to the semiconductor substrate in the end station chamber.

    Abstract translation: 在离子注入系统中,包括(a)离子源(b)质量分析部分,(c)离子加速部分,(d)离子束聚焦/偏转部分,和(e)用于注入离子 到半导体衬底上。 离子源由多个离子源组成,其中多个离子源连接到选择多个离子源中的任何一个的同一质量分析部分。 来自离子源的质量分离的离子被引导到加速部分,并且模板掩模大致布置在终端站室中的半导体衬底上。

    Method of charged particle beam lithography and equipment for charged particle beam lithography
    189.
    发明申请
    Method of charged particle beam lithography and equipment for charged particle beam lithography 有权
    带电粒子束光刻方法及带电粒子束光刻设备

    公开(公告)号:US20050072941A1

    公开(公告)日:2005-04-07

    申请号:US10958141

    申请日:2004-10-05

    CPC classification number: H01J37/3177 B82Y10/00 B82Y40/00 H01J37/04 H01J37/317

    Abstract: Disclosed is equipment for charged-particle beam lithography capable of executing exposure even when an electron beam with a bad property is produced due to a failure in some multibeam forming element, without replacing the failing multibeam forming element and without reducing the exposure accuracy. The equipment includes means for forming a plurality of charged-particle beams arranged at predetermined intervals; a plurality of blankers which act on the plurality of charged-particle beams individually; a common blanker which acts on all of the plurality of charged-particle beams; and a blanking restriction for causing those charged-particle beams which are given predetermined deflection by the plurality of blankers to reach onto a sample, with a signal applied to the common blanker, and blocking those charged-particle beams which are not given the predetermined deflection by the plurality of blankers to the sample. The equipment blocks beams with bad properties to the sample and executes exposure using only those beams which have bad properties.

    Abstract translation: 本发明公开了即使由于某些多波束形成元件的故障而产生具有不良特性的电子束也能够进行曝光的带电粒子束光刻设备,而不更换故障多波束形成元件而不降低曝光精度。 该设备包括用于形成以预定间隔布置的多个带电粒子束的装置; 分别作用在多个带电粒子束上的多个阻挡器; 作用于所有多个带电粒子束的常见消隐器; 以及消隐限制,用于使得由多个消隐器给予预定偏转的那些带电粒子束到达样本,信号施加到公共消隐器,并且阻挡未被给予预定偏转的那些带电粒子束 通过多个消隐器到样品。 设备阻挡样品性能不良的光束,并仅使用具有不良特性的光束执行曝光。

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