Abstract:
A unilateral in-plane thermal buckle-beam microelectrical mechanical actuator is formed on a planar substrate of semiconductor material, for example. The actuator includes first and second anchors secured to the substrate and a floating shuttle positioned movable parallel to the substrate. Symmetric first and second sets of elongated thermal half-beams are secured between the floating shuttle and the respective first and second anchors. The first and second anchors and the first and second sets of thermal half-beams are positioned along one side of the floating shuttle. The half-beams are formed of semiconductor material, such as polysilicon. A current source directs electrical current through the thermal half beams via the anchors to impart thermal expansion of the thermal half-beams and hence linear motion of the floating center beam generally parallel to the substrate. A floating cold beam connected between the shuttle and the substrate constrains and amplifies the motion of the shuttle in a predefined direction.
Abstract:
MEMS devices include a substrate, an anchor attached to the substrate, and a multilayer member attached to the anchor and spaced apart from the substrate. The multilayer member can have a first portion that is remote from the anchor and that curls away from the substrate and a second portion that is adjacent the anchor that contacts the substrate. Related methods are also disclosed.
Abstract:
This invention relates to the construction of microfabricated devices and, in particular, to types of microfabricated devices requiring thermal isolation from the substrates upon which they are built. This invention discloses vertical thermal isolators and methods of fabricating the vertical thermal isolators. Vertical thermal isolators offer an advantage over thermal isolators of the prior art, which were substantially horizontal in nature, in that less wafer real estate is required for the use of the vertical thermal isolators, thereby allowing a greater density per unit area of the microfabricated devices.
Abstract:
An array of M.times.N thin film actuated mirrors includes an active matrix having a substrate with an array of M.times.N connecting terminals and an array of M.times.N transistors, and an array of M.times.N actuating structures, wherein each of the actuating structures being a bimorph structure, includes a second thin film electrode, a lower electrodisplacive member, an intermediate thin film electrode, an upper electrodisplacive member and a first thin film electrode. Furthermore, there is disclosed a method for the manufacture thereof, the method comprising the steps of: providing an active matrix; forming a thin film sacrificial layer on top of the active matrix; removing selectively the thin film sacrificial layer; forming a second thin film electrode layer thereon; removing selectively the second thin film electrode layer; depositing a lower electrodisplacive layer; forming an intermediate electrode layer; depositing an upper electrodisplacive layer; forming a first thin film electrode layer, thereby forming a multiple layered structure; patterning the multiple layered structure into an array of M.times.N semifinished actuating structures; and removing the thin film sacrificial layer.
Abstract:
A portable electronic device comprising: an enclosure having an enclosure wall that forms an interior chamber containing a transducer and a valve operable to open or close a vent to the interior chamber; and a particle removal mechanism coupled to the valve that is operable to drive particles away from the valve upon application of a current.
Abstract:
Disclosed herein is a microelectromechanical (MEMS) device, including a rotor and a first piezoelectric actuator mechanically coupled to the rotor. The first piezoelectric actuator is electrically coupled between a first signal node and a common voltage node. A second piezoelectric actuator is mechanically coupled to the rotor, and is electrically coupled between a second signal node and the common voltage node. Control circuitry includes a drive circuit configured to drive the first and second piezoelectric actuators, a sense circuit configured to process sense signals generated by the first and second pizeoelectric actuators, and a multiplexing circuit. The multiplexing circuit is configured to alternate between connecting the drive circuit to the first piezoelectric actuator while connecting the sense circuit to the second piezoelectric actuator, and connecting the drive circuit to the second piezoelectric actuator while connecting the sense circuit to the first piezoelectric actuator.
Abstract:
A droplet jetting device comprising a membrane layer defining a pressure chamber that is in fluid communication with a nozzle, the membrane layer carrying, on a membrane that covers the pressure chamber, an actuator for generating pressure waves in a liquid in the pressure chamber, the device further comprising a distribution layer bonded to the membrane layer on the side of the membrane and defining a supply line for supplying the liquid to the pressure chamber, the supply line being connected to the pressure chamber via a restrictor passage extending through the distribution layer in the thickness direction of that layer, and via a window formed in the membrane, characterized in that the restrictor passage has a uniform cross-section, and the membrane window is delimited by a contour that is inwardly offset from the contour of the restrictor passage on the entire periphery of the restrictor passage.
Abstract:
Aspects of the subject disclosure include a pressure-sensing device consisting of a housing including a membrane and one or more piezoresistive elements disposed on the membrane to sense a displacement due to a deflection of the membrane. A first set of electrodes is disposed over the membrane, and a second set of electrodes is disposed on a permeable port of the device at a distance from the membrane. The first and second sets of electrodes form an electrostatic actuator to exert a repulsive force onto the membrane to reduce the deflection of the membrane.
Abstract:
A method for large scale integration of haptic devices is described. The method comprises forming a first elastomer layer of a large scale integration (LSI) device on a substrate according to a specified manufacturing process, the first elastomer layer having a plurality of fluid based circuits, the first elastomer layer adhering to a plurality of formation specifications. The method further comprises curing the first elastomer layer. Additionally, one or more additional elastomer layers of the LSI device are formed with the first elastomer layer according to the specified manufacturing process, the one or more additional elastomer layers having a plurality of fluid based circuits, the one or more additional elastomer layers adhering to the plurality of formation specifications.
Abstract:
There is provided a micro-electromechanical system (MEMS) device (102, 200, 300, 404) for cancelling noise generated by oscillation of a movable micro-electromechanical system (MEMS) element (104, 204, 304, 406). The micro-electromechanical system (MEMS) device (102, 200, 300, 404) includes the movable micro-electromechanical system (MEMS) element (104, 204, 304, 406), an actuator (106, 208, 306, 408), a controller (108, 410) and a movable noise cancelling element (110, 202, 312, 412). The controller (108, 410) provides electrical signals to drive the actuator (106, 208, 306, 408) and the movable noise cancelling element (110, 202, 312, 412) in a way to cancel the noise generated in the micro-electromechanical system (MEMS) device (102, 200, 300, 404) by oscillation of the movable MEMS element (104, 204, 304, 406). The movable noise-cancelling element (110, 202, 312, 412) produces anti-phase noise based on the electrical signals received from the controller (108, 410) to cancel noise caused by oscillation of the movable MEMS element (104, 204, 304, 406) based on the control signals received from the controller (108, 410).