公开(公告)号：US11605774B2

公开(公告)日：2023-03-14

申请号：US17030275

申请日：2020-09-23

Applicant: Apple Inc.

Inventor： Majid Khan ,  Roberto M. Ribeiro ,  Savas Gider

IPC: H01L41/08 ,  H01L41/09 ,  H01L41/053 ,  G01S3/781

Abstract: Aspects of the subject technology relate to an apparatus including a housing, one or more piezoresistive elements and a magnetic actuator. The housing includes a membrane, and the piezoresistive elements are disposed on the membrane to sense a displacement due to a deflection of the membrane. The magnetic actuator is disposed inside a cavity of the housing. The magnetic actuator exerts a repulsive force onto the membrane to reduce the deflection of the membrane.

公开(公告)号：US11937511B2

公开(公告)日：2024-03-19

申请号：US18109180

申请日：2023-02-13

Applicant: Apple Inc.

Inventor： Majid Khan ,  Roberto M. Ribeiro ,  Savas Gider

IPC: H10N30/20 ,  G01L1/16 ,  G01L1/18 ,  G01L9/00 ,  G01L19/00 ,  G01S3/781 ,  H10N30/00 ,  H10N30/88

CPC classification number: H10N30/88 ,  G01L1/167 ,  G01L1/183 ,  G01L9/0055 ,  G01L19/0092 ,  G01S3/781 ,  H10N30/1071 ,  H10N30/2047 ,  B81B2201/0264 ,  B81B2201/032

Abstract: Aspects of the subject disclosure include a pressure-sensing device consisting of a housing including a membrane and one or more piezoresistive elements disposed on the membrane to sense a displacement due to a deflection of the membrane. A first set of electrodes is disposed over the membrane, and a second set of electrodes is disposed on a permeable port of the device at a distance from the membrane. The first and second sets of electrodes form an electrostatic actuator to exert a repulsive force onto the membrane to reduce the deflection of the membrane.

公开(公告)号：US20230061188A1

公开(公告)日：2023-03-02

申请号：US17461866

申请日：2021-08-30

Applicant: Apple Inc.

Inventor： Gregory B. ARNDT ,  Majid Khan ,  Savas Gider

IPC: B81B7/00 ,  H04M1/02 ,  H05B3/28

Abstract: Aspects of the subject technology relate to an apparatus including a housing and a substrate. The apparatus further includes a sensor, an integrated circuit mounted on the substrate, and one or more heating elements configured to adjust a temperature of the sensor to facilitate measurement of temperature sensitivity and calibration of the sensor.